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    • 1. 发明授权
    • Frequency synthesizer with VCO output control
    • 具有VCO输出控制的频率合成器
    • US5335365A
    • 1994-08-02
    • US117749
    • 1993-09-07
    • Wayne W. BallantyneLeng H. OoiEugene W. Hodges, III
    • Wayne W. BallantyneLeng H. OoiEugene W. Hodges, III
    • H03L7/14H04B1/40H04B1/16
    • H04B1/408H03L7/146H03L2207/08
    • A frequency synthesizer circuit, having first and second modes of operation, comprises a voltage-controlled oscillator (VCO) (64), a low-pass filter (74), a phase-locked loop (PLL) (67), an analog-to-digital converter (50), a digital-to-analog converter (56), a controller (48), and a VCO input switch. During the first mode, the VCO input switch couples the control input of the VCO to a control signal produced by the PLL, and the analog-to-digital converter measures the control signal and provides it to the controller which stores the control voltage measured by the analog-to-digital converter. During the second mode, the VCO input switch couples the control input of the VCO to the digital-to-analog converter which applies the stored control to the control input of the VCO.
    • 具有第一和第二工作模式的频率合成器电路包括压控振荡器(VCO)(64),低通滤波器(74),锁相环(PLL)(67),模拟 - 数字转换器(50),数模转换器(56),控制器(48)和VCO输入开关。 在第一模式期间,VCO输入开关将VCO的控制输入耦合到由PLL产生的控制信号,并且模数转换器测量控制信号并将其提供给控制器,该控制器存储由 模数转换器。 在第二模式期间,VCO输入开关将VCO的控制输入耦合到将所存储的控制应用于VCO的控制输入的数模转换器。
    • 2. 发明授权
    • Electrical module assembly
    • 电气模块组装
    • US5367434A
    • 1994-11-22
    • US57376
    • 1993-05-06
    • Curtis M. GriffinJames V. LauderLeng H. Ooi
    • Curtis M. GriffinJames V. LauderLeng H. Ooi
    • H01L23/36H05K7/20
    • H01L23/36H01L2924/0002
    • An electrical module assembly (100) includes a mounting frame (130) having a passage (135) extending though the mounting frame (130). A heat sink (160) is positioned within the passage (135) of the mounting frame (130). A module substrate (120) is located on or near the heat sink (160) such that there is thermal conductivity between the module substrate (120) and the heat sink (160). A heat-generating semiconductor device (122), such as a power amplifier (122), which requires heat dissipation, is positioned on the module substrate (120) such that there is thermal conductivity between the heat-generating semiconductor device and the heat sink (160). Electrical connection to the module substrate (120) is provided through the mounting frame (130).
    • 电气模块组件(100)包括具有延伸穿过安装框架(130)的通道(135)的安装框架(130)。 散热器(160)定位在安装框架(130)的通道(135)内。 模块基板(120)位于散热器(160)上或附近,使得在模块基板(120)和散热器(160)之间存在导热性。 需要散热的诸如功率放大器(122)的发热半导体器件(122)位于模块衬底(120)上,使得在发热半导体器件和散热片之间存在导热性 (160)。 通过安装框架(130)提供与模块基板(120)的电连接。
    • 5. 发明授权
    • Stripline split ring resonator bandpass filter
    • 带状共振带通滤波器
    • US5057803A
    • 1991-10-15
    • US561117
    • 1990-08-01
    • Leng H. OoiPeter J. YehBranko Avanic
    • Leng H. OoiPeter J. YehBranko Avanic
    • H01P1/203
    • H01P1/20363H01P1/20381
    • A stripline split-ring resonator bandpass filter comprises first and second conducting layers and first and second substrates connected to each other between the conducting layers. A first stripline ring resonator is located on the top side of the second nonconducting substrate and is coupled to the input port of the BPF. The first stripline ring resonator has a gap located therein. A second stripline ring resonator is also located on the top side of the second nonconducting substrate between the first stripline ring resonator and the output port of the BPF. The second stripline ring resonator has a gap located therein. The first substrate has at least two slots therein to allow lumped capacitors to be placed in the gaps in the first and second ring resonators.
    • 带状线分离环谐振器带通滤波器包括第一和第二导电层以及在导电层之间彼此连接的第一和第二基板。 第一带状线环谐振器位于第二非导电衬底的顶侧,并且耦合到BPF的输入端口。 第一带状线环谐振器具有位于其中的间隙。 第二带状线环谐振器也位于第二非导体衬底的顶侧,位于第一带状线环谐振器和BPF的输出端口之间。 第二带状线环谐振器在其中具有间隙。 第一衬底在其中具有至少两个槽,以允许集中的电容器放置在第一和第二环形谐振器的间隙中。
    • 10. 发明授权
    • Ultra thin radio housing with integral antenna
    • 超薄无线电外壳,带集成天线
    • US4894663A
    • 1990-01-16
    • US121322
    • 1987-11-16
    • Glenn F. UrbishQuirino BalzanoDale W. DorinskiMartin J. McKinleyLeng H. OoiJohn A. StoutlandAnthony B. Suppelsa
    • Glenn F. UrbishQuirino BalzanoDale W. DorinskiMartin J. McKinleyLeng H. OoiJohn A. StoutlandAnthony B. Suppelsa
    • H01Q1/24H01Q7/00H05K1/00H05K1/16
    • H01Q7/00H01Q1/243H05K1/0284H05K1/16
    • The preferred housing includes an integrally molded thermoplastic base (102) and cover (104) assembly. The cover is joined to the base by a living hinge (106) and a peripheral wall (108) extends around the perimeter of the base. In one embodiment, the antenna is a wire loop (204), the wire being wound in an external circumferential groove (202A) in the peripheral wall or, alternatively, integrally molded into the peripheral wall. Other embodiments use printed circuit loop antenna patterns that are preferably vacuum deposited directly onto the thermoplastic base and/or cover. When the antenna pattern is disposed on both the cover and the base, a portion of the antenna (e.g., 1002K) is also disposed on the hinge to join the main portions of the antenna on the base and cover. In one embodiment of the printed circuit loop antenna, the plane of the loop lies parallel to the base and may include one or more turns or loops (e.g., 402C, E, G and J). In another embodiment, the loop includes a 90 degree bend (e.g., 504) and both planes of the loop lie perpendicular to the base. In still another embodiment, the loop includes three 90 degree bends, a crossover at one of the bends (e.g., at 704), and all four planes of the loop lie perpendicular to the base.
    • 优选的壳体包括整体模制的热塑性基座(102)和盖(104)组件。 盖通过活动铰链(106)连接到基部,并且周壁(108)围绕基部的周边延伸。 在一个实施例中,天线是线环(204),线缠绕在周壁中的外周凹槽(202A)中,或者整体模制成周壁。 其他实施例使用优选地真空地直接沉积到热塑性基底和/或盖上的印刷电路环形天线图案。 当天线图案设置在盖和底座上时,天线的一部分(例如,1002K)也设置在铰链上,以将天线的主要部分连接在基座和盖上。 在印刷电路环形天线的一个实施例中,环的平面平行于基部并且可以包括一个或多个匝或环(例如,402C,E,G和J)。 在另一个实施例中,环包括90度弯曲(例如504),并且环的两个平面垂直于基部。 在另一个实施例中,环路包括三个90度弯曲部,在一个弯曲处(例如,在704处)的交叉,并且环的所有四个平面垂直于基部。