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    • 1. 发明授权
    • Microstrip assembly
    • 微带组件
    • US5363067A
    • 1994-11-08
    • US63477
    • 1993-05-19
    • Mark A. CrandallWilliam J. WingfieldLeng H. Ooi
    • Mark A. CrandallWilliam J. WingfieldLeng H. Ooi
    • H01P7/08H03B5/18
    • H01P7/082H03B5/1847
    • A microstrip assembly (100), includes a first substrate such as a multilayer substrate (102, 106 and 112) having pockets or cavity areas (104). A second substrate (110) includes transmission lines (108) on its first surface, and a ground plane on its second surface which help form a microstrip resonator. The first and second substrates are attached with the transmission lines (108) resting inside of the areas defined by cavity areas (104). By providing an air gap on top of transmission lines (108), the microstrip assembly (100) can exhibit enhanced characteristics, while still maintaining the high Q characteristics of a microstrip.
    • 微带组件(100)包括具有凹穴或空腔区域(104)的第一衬底,例如多层衬底(102,106和112)。 第二基板(110)在其第一表面上包括传输线(108),在其第二表面上包括有助于形成微带谐振器的接地平面。 所述第一和第二基板与传导线(108)相连接,所述传输线(108)位于由空腔区域(104)限定的区域的内部。 通过在传输线(108)的顶部提供空气间隙,微带组件(100)可以表现出增强的特性,同时仍保持微带的高Q特性。