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1. 发明授权

US5773198A Method of forming high resolution circuitry by depositing a polyvinyl alcohol layer beneath a photosensitive polymer layer 失效
标题翻译：通过在感光聚合物层下沉积聚乙烯醇层形成高分辨率电路的方法
公开(公告)号：US5773198A
公开(公告)日：1998-06-30
申请号：US660384
申请日：1996-06-07
申请人： Thomas J. Swirbel , Anthony B. Suppelsa , Joaquin Barreto
发明人： Thomas J. Swirbel , Anthony B. Suppelsa , Joaquin Barreto
IPC分类号： G03F7/09 , H05K3/10 , G03C5/56
CPC分类号： H05K3/108 , G03F7/092 , H05K2203/0577 , H05K2203/0789 , Y10S438/95 , Y10S438/951
摘要： A method of forming a high resolution metal pattern on a substrate. A temporary polyvinyl alcohol (10) layer underneath the photoresist layer (20) aids in removing the photoresist layer after plating. The photoresist is photodelineated in conventional manner to form a pattern (40). During photodelineation, the developing process for the resist does not completely remove the PVA (45) that lies directly under the removed resist, but instead reveals those portions of the polyvinyl alcohol layer. The substrate is then rinsed in a hot aqueous solution to effect removal of the revealed PVA portions, now exposing portions (40) of the substrate (15). Metal (50) is then electroplated to build up a metal circuitry pattern. The remaining portions of the photoresist and the PVA are then removed by a hot aqueous solution.
摘要翻译：在基板上形成高分辨率金属图案的方法。在光致抗蚀剂层（20）下面的临时聚乙烯醇（10）层有助于在电镀后去除光致抗蚀剂层。光致抗蚀剂以常规方式光线照射以形成图案（40）。在光线照射期间，抗蚀剂的显影过程不能完全去除位于去除的抗蚀剂正下方的PVA（45），而是透露聚乙烯醇层的那些部分。然后将衬底在热水溶液中漂洗以实现所揭露的PVA部分的去除，现在暴露衬底（15）的部分（40）。然后电镀金属（50）以建立金属电路图案。然后通过热水溶液除去光致抗蚀剂和PVA的剩余部分。

2. 发明授权

US5686226A Method of forming an applicator for applying tacking media to a circuit substrate 失效
标题翻译：形成用于将紧固介质施加到电路基板的施加器的方法
公开(公告)号：US5686226A
公开(公告)日：1997-11-11
申请号：US511077
申请日：1995-08-03
申请人： Barry B. Groman , Anthony B. Suppelsa , Scott Potter
发明人： Barry B. Groman , Anthony B. Suppelsa , Scott Potter
IPC分类号： B05C1/02 , G03F7/16 , H05K3/00 , H05K3/34 , H05K13/04 , G03F7/26
CPC分类号： G03F7/161 , B05C1/027 , H05K13/0469 , H05K3/0002 , H05K3/3489 , H05K2203/0195 , H05K2203/0338 , H05K3/3484
摘要： An applicator (300) provides a tool for depositing processing media (510), such as a tacky flux agent, on predetermined surface areas (715) of a circuit substrate (705). The applicator (300) has a portion formed from a flexible compressible material with a surface (302, 325) patterned to have projections (325) that correspond in location to the predetermined surface areas (715) of the circuit substrate (705). The applicator (300) is preferably formed by polymerizing resin material using an image that corresponds to the circuit substrate (410, 420, 430).
摘要翻译：施加器（300）提供用于在电路基板（705）的预定表面区域（715）上沉积诸如粘性助焊剂的处理介质（510）的工具。施加器（300）具有由柔性可压缩材料形成的部分，其表面（302,325）被图案化以具有在位置上对应于电路基板（705）的预定表面区域（715）的突起（325）。施加器（300）优选通过使用对应于电路基板（410,420,430）的图像聚合树脂材料来形成。

3. 发明授权

US5536917A Housing with integral thin film resistive snap-fits 失效
标题翻译：外壳采用整体薄膜电阻卡扣
公开(公告)号：US5536917A
公开(公告)日：1996-07-16
申请号：US264551
申请日：1994-06-23
申请人： Anthony B. Suppelsa , Dale W. Dorinski
发明人： Anthony B. Suppelsa , Dale W. Dorinski
IPC分类号： B29C65/08 , B29C65/58 , B29C65/76 , E05B47/00 , E05C19/06 , H05K5/00 , H05B1/00
CPC分类号： E05B47/0009 , B29C65/08 , B29C65/58 , B29C65/76 , B29C66/54 , B29C66/542 , B29C66/73921 , E05C19/06 , H05K5/0013 , Y10T156/1158 , Y10T156/1911
摘要： An assembly (5) has two or more plastic parts joined together. One of the plastic parts (20) has an electrical heating element (31) whose function is to soften a portion of the plastic when the heating element is electrically energized. Once the plastic is softened, the two parts can be separated and the assembly disassembled. When the two parts are joined together with snap-fit joints, the snap-fits have a heating element to soften a portion of the snap-fit (24) when the heating element is electrically energized, thereby allowing the housing to be opened and separated. If the two parts are ultrasonically welded together to form a housing, a heating element is located therein to soften the ultrasonically welded portion (44), thereby allowing the two halves of the housing to be separated. The heating element can be a nichrome or thin film resistor that is energized by a source (33) located within the housing, or by an power source external to the housing, or it may be inductively coupled to the power source.
摘要翻译：组件（5）具有两个或多个连接在一起的塑料部件。其中一个塑料部件（20）具有电加热元件（31），其功能是在加热元件通电时软化一部分塑料。一旦塑料软化，两个部分可以分离，拆卸组件。当两个部分用卡扣配合接合在一起时，卡扣配合件具有加热元件，以在加热元件被通电时软化卡扣配合件（24）的一部分，从而允许壳体打开和分离。如果两个部件被超声波焊接在一起形成壳体，则加热元件位于其中，以软化超声波焊接部分（44），从而允许壳体的两半分离。加热元件可以是由位于壳体内的源（33）或壳体外部的电源激励的镍铬合金或薄膜电阻器，或者可以感应地耦合到电源。

4. 发明授权

US5421083A Method of manufacturing a circuit carrying substrate having coaxial via holes 失效
标题翻译：制造具有同轴通孔的电路承载基板的方法
公开(公告)号：US5421083A
公开(公告)日：1995-06-06
申请号：US221593
申请日：1994-04-01
申请人： Anthony B. Suppelsa , Anthony J. Suppelsa , Fadia Nounou
发明人： Anthony B. Suppelsa , Anthony J. Suppelsa , Fadia Nounou
IPC分类号： H05K1/02 , H05K1/11 , H05K3/42 , H05K3/46 , H05K3/10
CPC分类号： H05K1/0222 , H05K1/115 , H05K2201/09536 , H05K2201/09809 , H05K3/429 , H05K3/4602 , H05K3/4644 , Y10T29/49123 , Y10T29/49165
摘要： A method of manufacturing a circuit carrying substrate having one or more coaxial via holes. The center core or inner layer (330) of the circuit carrying substrate is a dielectric material that has a plated (339) through hole or via (335) coupling the two surfaces of the inner layer together. One side of the inner layer has a first metallization pattern (336) and the other side has a second metallization pattern (338) on it. The through hole is electrically conductive (339) and connects portions of the first and second metallization patterns. The plated through hole is filled with a dielectric material (340). A first dielectric layer (342) is formed on one side of the inner layer, and a second dielectric layer (344) is formed on the other side of the inner layer, so that the dielectric layers cover the first and second metallization patterns and the filled via hole. A third metallization pattern (350) is formed on the first dielectric layer, and a fourth metallization pattern (360) is formed on the second dielectric layer. A second via hole (370) is formed within the first via hole, substantially concentric to and electrically insulated from the first via hole, to electrically connect the third and fourth metallization patterns.
摘要翻译：一种制造具有一个或多个同轴通孔的电路承载基板的方法。电路承载衬底的中心芯或内层（330）是电介质材料，其具有将内层的两个表面连接在一起的电镀（339）通孔或通孔（335）。内层的一侧具有第一金属化图案（336），另一侧在其上具有第二金属化图案（338）。通孔是导电的（339）并且连接第一和第二金属化图案的部分。电镀通孔填充有电介质材料（340）。第一电介质层（342）形成在内层的一侧，并且在内层的另一侧上形成第二电介质层（344），使得电介质层覆盖第一和第二金属化图案，并且填充通孔。在第一电介质层上形成第三金属化图案（350），在第二电介质层上形成第四金属化图案（360）。在第一通孔内形成与第一通孔大致同心并与其电绝缘的第二通孔（370），以电连接第三和第四金属化图案。

5. 发明授权

US5218759A Method of making a transfer molded semiconductor device 失效
标题翻译：制造转印模制半导体器件的方法
公开(公告)号：US5218759A
公开(公告)日：1993-06-15
申请号：US670663
申请日：1991-03-18
申请人： Frank J. Juskey , Lonnie L. Bernardoni , Bruce J. Freyman , Anthony B. Suppelsa
发明人： Frank J. Juskey , Lonnie L. Bernardoni , Bruce J. Freyman , Anthony B. Suppelsa
IPC分类号： H01L21/56 , H01L21/68
CPC分类号： H01L21/568 , H01L21/565 , H01L2224/48091 , H01L2924/01004 , H01L2924/181 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149
摘要： A method of making a pad array chip carrier package is disclosed. A semiconductor device (10) is bonded to a ceramic substrate (12). The semiconductor device may be attached to the substrate by wirebonding, tab bonding or flip chip bonding. The bonded assembly (16) is then attached to a flexible temporary support substrate (18) by means of an adhesive (19). The entire assembly is then placed into a mold cavity (20 and 22) and registered against the temporary support substrate (18). Plastic material (30) is molded about the semiconductor device and associated wirebonds in order to encapsulate the device. After removal from the mold, the encapsulated assembly is removed from the temporary support substrate (18) by peeling the temporary support substrate (18) from the circuit substrate.
摘要翻译：公开了制造焊盘阵列芯片载体封装的方法。将半导体器件（10）接合到陶瓷衬底（12）上。半导体器件可以通过引线接合，接头接合或倒装芯片接合而附接到基板。接合组件（16）然后通过粘合剂（19）附接到柔性临时支撑衬底（18）。然后将整个组件放入模腔（20和22）中并与临时支撑衬底（18）对准。围绕半导体器件和相关联的引线键合塑料材料（30），以封装该器件。从模具中取出之后，通过从电路基板剥离临时支撑基板（18），将封装的组件从临时支撑基板（18）移除。

6. 发明授权

US4939792A Moldable/foldable radio housing 失效
标题翻译：可成型/可折叠收音机外壳
公开(公告)号：US4939792A
公开(公告)日：1990-07-03
申请号：US121323
申请日：1987-11-16
申请人： Glenn F. Urbish , John M. McKee , Martin J. McKinley , Anthony B. Suppelsa
发明人： Glenn F. Urbish , John M. McKee , Martin J. McKinley , Anthony B. Suppelsa
IPC分类号： H04B1/08 , H04B7/26 , H04Q7/14 , H05K1/00 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/32 , H05K7/06
CPC分类号： H05K3/326 , H04B1/08 , H05K1/0278 , H05K1/119 , H05K1/189 , H05K2201/0129 , H05K2201/0191 , H05K2201/042 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/0999 , H05K2201/10037 , H05K2201/10053 , H05K2201/10136 , H05K2201/10598 , H05K2201/2009 , H05K3/0058 , H05K3/325
摘要： A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing. A switch (136) and battery contact (152) are integrally formed with the housing and an integrally molded structural support means strenghthens the housing members. The housing is manufactured "opened up" and, at the final assembly stage, the cover member is rotated about the hinge until it contacts the upper surface of the peripheral wall (108B). Snap-fit connectors (e.g., 110) join the cover to the base.
摘要翻译：模制的热塑性外壳（100）包括由活动铰链（106）连接的基座（102）和盖（104）构件。基部构件（102）包括周壁（108）。四个可焊接印刷电路图案（112,114,116和118）被真空沉积到两个壳体构件的内表面和外表面上。基座和盖构件的相对表面上的印刷电路图案通过导电通孔（例如，120和122）连接，而基座和盖构件的内表面上的印刷电路图案通过互连印刷电路图案（124），其被真空沉积到活动铰链上。聚酯薄膜片（132）粘附到外壳的外表面以使外部印刷电路图案绝缘。天线图案（126）也被真空沉积到外壳的外表面上。开关（136）和电池触点（152）与壳体一体地形成，并且整体模制的结构支撑装置加强了壳体构件。壳体被制造为“开放”，并且在最终组装阶段，盖构件围绕铰链旋转直到其接触周壁（108B）的上表面。卡扣连接器（例如，110）将盖连接到基座。

7. 发明授权

US5573859A Auto-regulating solder composition 失效
标题翻译：自动调节焊料组成
公开(公告)号：US5573859A
公开(公告)日：1996-11-12
申请号：US523449
申请日：1995-09-05
申请人： Anthony B. Suppelsa
发明人： Anthony B. Suppelsa
IPC分类号： B22F1/02 , B23K35/02 , B23K35/14 , H05K3/34 , B22F7/04
CPC分类号： H05K3/3484 , B22F1/025 , B23K35/0244 , B23K35/025 , H05K2201/0215 , H05K2201/0218 , H05K2201/083 , H05K2203/101 , H05K2203/104 , H05K3/3463 , H05K3/3494 , Y10T428/12028 , Y10T428/12063 , Y10T428/12132
摘要： A soldering composition is self melting and is auto-regulating. The solder composition (100) has a central core (102) made from a non-magnetic metal. A coating (105) of a magnetic material surrounds most or all of the central core. A solder layer (108) overlies the coating of magnetic material, and the solder layer has a melting temperature that is lower than the Curie temperature of the magnetic material. The auto-regulating temperature substantially corresponds to the Curie temperature. When the solder composition is placed in a field of alternating current, the magnetic material heats up and melts the solder coating. When the Curie temperature is reached, the magnetic material stops heating, thus controlling the maximum temperature of the soldering composition. As the temperature of the composition drops below the Curie temperature, the magnetic material again heats up, thus keeping the temperature of the solder constant.
摘要翻译：焊接组合物是自熔的并且是自动调节的。焊料组合物（100）具有由非磁性金属制成的中心芯（102）。磁性材料的涂层（105）围绕中心芯的大部分或全部。焊料层（108）覆盖在磁性材料的涂层上，焊料层的熔化温度低于磁性材料的居里温度。自动调节温度基本上对应于居里温度。当焊料组合物置于交流电场中时，磁性材料加热并熔化焊料涂层。当达到居里温度时，磁性材料停止加热，从而控制焊接组合物的最高温度。随着组合物的温度低于居里温度，磁性材料再次升温，从而保持焊料的温度恒定。

8. 发明授权

US5438216A Light erasable multichip module 失效
标题翻译：光可擦多芯片模块
公开(公告)号：US5438216A
公开(公告)日：1995-08-01
申请号：US937017
申请日：1992-08-31
申请人： Frank J. Juskey , Anthony B. Suppelsa , Dale W. Dorinski
发明人： Frank J. Juskey , Anthony B. Suppelsa , Dale W. Dorinski
IPC分类号： G11C5/00 , G11C16/18 , H01L27/14 , H01L23/02 , H01L23/12 , H01L31/00
CPC分类号： G11C16/18 , G11C5/00 , H01L2224/48091 , H01L2924/01322 , H01L2924/1815
摘要： A multichip circuit package is formed for use with an EPROM chip. The active circuitry on the EPROM die surface is revealed. An EPROM die (14) is mounted on an insulating substrate (10). The active circuitry (15) on the die is connected to a conductive circuit pattern (13) on the substrate by wire bonds (16) between the die and the conductive circuit pattern. A second integrated circuit die (20) is also mounted on the substrate and electrically connected to the conductive circuit pattern by wire bonds. A plastic material (50) is then molded to encapsulate the perimeter (18) of the EPROM and the associated thin wires, the entire second integrated circuit die and it's associated thin wires, at least a portion of the conductive circuit pattern, and portions of the insulating substrate. The plastic material is formed so as to expose the active circuitry on the face of the EPROM.
摘要翻译：形成用于EPROM芯片的多芯片电路封装。显示了EPROM芯片表面上的有源电路。 EPROM芯片（14）安装在绝缘基板（10）上。管芯上的有源电路（15）通过管芯和导电电路图案之间的引线键合（16）连接到衬底上的导电电路图案（13）。第二集成电路管芯（20）也安装在衬底上并且通过引线键与导电电路图案电连接。塑料材料（50）然后被模制以封装EPROM的周边（18）和相关联的细线，整个第二集成电路管芯及其相关联的细线，导电电路图案的至少一部分和绝缘基板。塑料材料被形成为暴露EPROM表面上的有源电路。

9. 发明授权

US5379186A Encapsulated electronic component having a heat diffusing layer 失效
标题翻译：具有散热层的封装电子部件
公开(公告)号：US5379186A
公开(公告)日：1995-01-03
申请号：US85807
申请日：1993-07-06
申请人： Glenn E. Gold , Anthony B. Suppelsa , Anthony J. Suppelsa
发明人： Glenn E. Gold , Anthony B. Suppelsa , Anthony J. Suppelsa
IPC分类号： H01L23/31 , H01L23/42 , H05K1/02 , H05K3/28 , H05K7/20
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/3135 , H01L23/42 , H01L2924/0002 , H05K1/0201 , H05K2201/017 , H05K2201/0209 , H05K2201/09872 , H05K2203/1322
摘要： An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.
摘要翻译：一种具有整体散热器的封装的电子部件。发热电子部件（10）安装在基板载体（12）上，并且密封材料层（16）覆盖该部件。将一层导热材料（18）施加在密封剂材料上，然后将第二层密封剂材料（20）施加在导热材料上。由部件产生的热量分布在整个导热材料上，从而消除了部件上的热点，从而导致基本上较低的表面温度。

10. 发明授权

US5172852A Soldering method 失效
标题翻译：焊接方法
公开(公告)号：US5172852A
公开(公告)日：1992-12-22
申请号：US877003
申请日：1992-05-01
申请人： Lonnie L. Bernardoni , Kenneth R. Thompson , Anthony B. Suppelsa
发明人： Lonnie L. Bernardoni , Kenneth R. Thompson , Anthony B. Suppelsa
IPC分类号： H05K1/11 , H05K3/34
CPC分类号： H05K3/3421 , H05K1/111 , H05K2201/09663 , H05K2201/10636 , H05K2201/10689 , H05K2203/042 , H05K2203/0485 , H05K2203/0545 , H05K3/3473 , H05K3/3489 , Y02P70/611 , Y02P70/613
摘要： An electronic component (14) is soldered to a circuit carrying substrate (11) by a method that allows the component to remain in better contact with the flat solder pads of the substrate. The circuit carrying substrate (11) has a plurality of solder pads (12) disposed thereon, each pad consisting of a terminal portion (16), a solder reservoir portion (18), and a bridging portion (17). The terminal portion is connected to the reservoir portion by the bridging portion. The bridging portion is typically a necked down portion of the pad. The electronic component (14) has a plurality of solderable terminals (15) corresponding to the terminal portions (16) of the solder pads (12). Each of the solder pad reservoir portions are coated with a reservoir of solder (23). The amount of solder coated onto the reservoir portion is sufficient to provide a fillet between the component (14) and the solder pad terminal portion (16) during a subsequent heating step. A flux (25) is then applied to the solder pad terminal portions (16), and the electronic component (14) is placed on the circuit carrying substrate so that each of component terminals is in the flux and contacts the terminal portions of the solder pads. The entire assembly is then heated to melt the solder, thereby causing the melted solder to flow across the solder pad bridging portion and form a fillet between the solder pad terminal portion and the component terminal.
摘要翻译：电子部件（14）通过允许部件保持与衬底的平坦焊盘更好地接触的方法被焊接到电路承载衬底（11）。电路承载基板（11）具有设置在其上的多个焊盘（12），每个焊盘由端子部分（16），焊料储存部分（18）和桥接部分（17）组成。端子部分通过桥接部分连接到储存器部分。桥接部分通常是垫的颈缩部分。电子部件（14）具有与焊盘（12）的端子部分（16）对应的多个可焊接端子（15）。每个焊盘储存器部分涂覆有焊料储存器（23）。涂覆到储存器部分上的焊料的量足以在随后的加热步骤期间在部件（14）和焊盘端子部分（16）之间提供圆角。然后将焊剂（25）施加到焊料焊盘端子部分（16），并且将电子部件（14）放置在电路承载基板上，使得每个部件端子处于焊剂中并与焊料的端子部分接触垫然后将整个组件加热以熔化焊料，从而使熔融的焊料流过焊料焊盘桥接部分并在焊料焊盘端子部分和部件端子之间形成圆角。

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