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    • 7. 发明授权
    • Gas supply member and plasma processing apparatus
    • 供气构件和等离子体处理装置
    • US07416635B2
    • 2008-08-26
    • US11365509
    • 2006-03-02
    • Tsuyoshi MoriyaTakahiro Murakami
    • Tsuyoshi MoriyaTakahiro Murakami
    • H01L21/3065C23C16/00C23C16/50C23C16/455
    • H01J37/3244C23F4/00
    • A gas supply member is disposed in a chamber of a plasma processing apparatus and has a planar surface facing an inner space of the chamber and a plurality of gas holes bored in the planar surface to supply a gas through the gas holes to the inner space. An outer periphery portion of each gas hole at the planar surface has a slant surface formed to correspond to a flow of the gas injected through each gas hole. Further, the slant surface includes at least any one of a flat surface and a curved surface. An angle formed between the slant surface and the planar surface is equal to or greater than that formed between the planar surface and a distribution of the gas injected through each gas hole.
    • 气体供给构件设置在等离子体处理装置的腔室中,并且具有面向腔室的内部空间的平坦表面和在平坦表面中钻出的多个气体孔,以通过气体孔向内部空间供应气体。 平坦表面处的每个气孔的外周部分具有与通过每个气孔注入的气体流相对应的倾斜表面。 此外,倾斜表面包括平坦表面和弯曲表面中的至少任一个。 在倾斜表面和平坦表面之间形成的角度等于或大于在平坦表面与通过每个气孔注入的气体的分布之间形成的角度。
    • 8. 发明申请
    • Gas supply member and plasma processing apparatus
    • 供气构件和等离子体处理装置
    • US20060196604A1
    • 2006-09-07
    • US11365509
    • 2006-03-02
    • Tsuyoshi MoriyaTakahiro Murakami
    • Tsuyoshi MoriyaTakahiro Murakami
    • C23F1/00
    • H01J37/3244C23F4/00
    • A gas supply member is disposed in a chamber of a plasma processing apparatus and has a planar surface facing an inner space of the chamber and a plurality of gas holes bored in the planar surface to supply a gas through the gas holes to the inner space. An outer periphery portion of each gas hole at the planar surface has a slant surface formed to correspond to a flow of the gas injected through each gas hole. Further, the slant surface includes at least any one of a flat surface and a curved surface. An angle formed between the slant surface and the planar surface is equal to or greater than that formed between the planar surface and a distribution of the gas injected through each gas hole.
    • 气体供给构件设置在等离子体处理装置的腔室中,并且具有面向腔室的内部空间的平坦表面和在平坦表面中钻出的多个气体孔,以通过气体孔向内部空间供应气体。 平坦表面处的每个气孔的外周部分具有与通过每个气孔注入的气体流相对应的倾斜表面。 此外,倾斜表面包括平坦表面和弯曲表面中的至少任一个。 在倾斜表面和平坦表面之间形成的角度等于或大于在平坦表面与通过每个气孔注入的气体的分布之间形成的角度。