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1. 发明授权

US06635971B2 Electronic device and optical transmission module 有权
公开(公告)号：US06635971B2
公开(公告)日：2003-10-21
申请号：US10042270
申请日：2002-01-11
申请人： Toyoki Asada , Yuji Fujita , Hideo Sotokawa , Kazumi Kawamoto , Kunio Matsumoto , Shinya Hamagishi , Mari Matsuyoshi
发明人： Toyoki Asada , Yuji Fujita , Hideo Sotokawa , Kazumi Kawamoto , Kunio Matsumoto , Shinya Hamagishi , Mari Matsuyoshi
IPC分类号： H01L2329
CPC分类号： H01L24/31 , G02B6/4232 , G02B6/4246 , H01L21/563 , H01L24/29 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2224/83951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/351 , H01L2924/00 , H01L2224/0401
摘要： An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.

2. 发明授权

US6153938A Flip-chip connecting method, flip-chip connected structure and electronic device using the same 失效
标题翻译：倒装芯片连接方法，倒装芯片连接结构和使用该电路的电子设备
公开(公告)号：US6153938A
公开(公告)日：2000-11-28
申请号：US122782
申请日：1998-07-27
申请人： Naoya Kanda , Toyoki Asada , Yoshio Oozeki , Yasuo Amano , Kunio Matsumoto , Yasuhiro Narikawa
发明人： Naoya Kanda , Toyoki Asada , Yoshio Oozeki , Yasuo Amano , Kunio Matsumoto , Yasuhiro Narikawa
IPC分类号： H01L21/56 , H01L21/60 , H01L21/603 , H01L23/12 , H01L23/48
CPC分类号： H01L24/16 , H01L21/563 , H01L24/11 , H01L24/12 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05573 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/8319 , H01L2224/83192 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/3011
摘要： A stable low-connecting resistance connection arrangement having a high yield rate without using any special material or process for a substrate. A flip-chip connecting structure in which the semiconductor integrated circuit (IC) chip is mounted directly on an organic circuit substrate. To achieve reliable connection and low-connecting resistance, the present invention absorbs variation of the heights of projecting electrodes formed on a semiconductor IC chip and substrate electrodes of an organic circuit substrate for example, by deforming the substrate electrodes and/or substrate layer of the organic circuit substrate. Resin of a conductive paste disposed between the projecting electrodes and substrate electrodes is squeezed out leaving a high density conductive particle layer to lower a contact resistance between such electrodes.
摘要翻译：稳定的低连接电阻连接装置，具有高产率而不使用任何特殊材料或工艺用于基板。一种倒装芯片连接结构，其中半导体集成电路（IC）芯片直接安装在有机电路基板上。为了实现可靠的连接和低连接电阻，本发明通过使基板电极和/或基板层变形来吸收形成在半导体IC芯片和有机电路基板的基板电极上的突起电极的高度的变化，例如，有机电路基板。设置在突出电极和基板电极之间的导电膏的树脂被挤出，留下高密度导电颗粒层以降低这些电极之间的接触电阻。

3. 发明申请

US20150248190A1 SCREEN TRANSITION DIAGRAM CREATOR 有权
标题翻译：屏幕转换图创建者
公开(公告)号：US20150248190A1
公开(公告)日：2015-09-03
申请号：US14428429
申请日：2012-10-12
申请人： Kunio Matsumoto , Koichi Nakagawa
发明人： Kunio Matsumoto , Koichi Nakagawa
IPC分类号： G06F3/0481 , G06F17/21
CPC分类号： G06F3/0481 , G06F3/04817 , G06F8/38 , G06F17/212
摘要： A screen transition diagram creator that creates a screen transition diagram illustrating complicated transition relations in an easy-to-understand manner, including: a screen transition diagram editor providing the screen transition diagram in which transition relations among plural screens are illustrated by plural screen nodes and arrows between the screen nodes; a screen transition pattern applying unit applying a predetermined screen transition pattern to a target screen node group that includes at least part of the screen nodes illustrated in the screen transition diagram to provide a pattern-applied screen node group; and a screen transition structure diagram creator creating a screen transition structure diagram by abridgement processing on the pattern-applied screen node group according to a display layout corresponding to the screen transition pattern. In the abridgement processing, arrows are deleted and an icon that simplistically illustrates a transition pattern between the screen nodes displayed in the display layout is added.
摘要翻译：一种屏幕转换图创建器，其以易于理解的方式创建示出复杂的转变关系的屏幕转换图，包括：提供屏幕转换图的屏幕转换图编辑器，其中多个屏幕节点和多个屏幕节点之间显示多个屏幕之间的转换关系，屏幕节点之间的箭头; 屏幕转换模式应用单元，将预定屏幕转换模式应用于包括屏幕转换图中所示屏幕节点的至少一部分的目标屏幕节点组，以提供模式应用屏幕节点组; 以及屏幕转换结构图创建器，根据与屏幕转换模式相对应的显示布局，通过对图案应用屏幕节点组进行缩小处理来创建屏幕转换结构图。在缩小处理中，删除箭头，并且添加简单地示出在显示布局中显示的屏幕节点之间的转换模式的图标。

4. 发明授权

US08278270B2 HGF precursor protein variant and active protein thereof 有权
标题翻译： HGF前体蛋白质变体及其活性蛋白质
公开(公告)号：US08278270B2
公开(公告)日：2012-10-02
申请号：US13175110
申请日：2011-07-01
申请人： Toshikazu Nakamura , Kunio Matsumoto , Kazuhiro Fukuta , Kiichi Adachi , Daichika Hayata
发明人： Toshikazu Nakamura , Kunio Matsumoto , Kazuhiro Fukuta , Kiichi Adachi , Daichika Hayata
IPC分类号： A61K38/18 , C12P21/04 , C12P21/06 , C12N15/00 , C12N5/00 , C07K14/475
CPC分类号： C07K14/4753 , A61K38/00
摘要： An HGF precursor protein variant, in which a peptide structure comprises a sequence including a peptide chain X inserted between an α chain of HGF or a polypeptide where 1 to 20 amino-acid residues from the C-terminus of the α chain are deleted, and a β chain of HGF or a polypeptide where 1 to 20 amino-acid residues from the N-terminus of the β chain are deleted; wherein (i) the peptide chain X has an amino-acid sequence of at least two residues, (ii) the peptide chain X can be cleaved by a protease reaction or a chemical reaction, and (iii) a protein obtained by cleaving at least one site of the peptide chain X has HGF action.
摘要翻译：一种HGF前体蛋白质变体，其中肽结构包含插入在H链α链或多肽之间的肽链X的序列，其中缺失来自α链C末端的1-20个氨基酸残基，一个的HGF链或多肽，其中从＆lt; bgr的N末端1至20个氨基酸残基; 链被删除; 其中（i）肽链X具有至少两个残基的氨基酸序列，（ii）肽链X可以通过蛋白酶反应或化学反应来切割，和（iii）通过至少裂解获得的蛋白质肽链X的一个位点具有HGF作用。

5. 发明授权

US08076289B2 Fibrosis inhibitor for implanted organ 有权
标题翻译：植入器官纤维化抑制剂
公开(公告)号：US08076289B2
公开(公告)日：2011-12-13
申请号：US12695532
申请日：2010-01-28
申请人： Jun Amano , Ken-ichi Ito , Kazuhiro Yamaura , Kunio Matsumoto , Toshikazu Nakamura
发明人： Jun Amano , Ken-ichi Ito , Kazuhiro Yamaura , Kunio Matsumoto , Toshikazu Nakamura
IPC分类号： A61K38/18
CPC分类号： C07K14/4753 , A61K38/1833 , A61K48/00
摘要： A pharmaceutical preparation comprising a hepatocyte growth factor or a DNA molecule encoding the same and the like according to the present invention can suppress the fibrosis of a transplanted organ after organ transplantation. The present invention is useful in the fields of organ transplantation and regeneration therapy.
摘要翻译：包含肝细胞生长因子或编码本发明的DNA分子的药物制剂能够抑制器官移植后的移植器官的纤维化。本发明可用于器官移植和再生治疗领域。

6. 发明申请

US20110269944A1 HGF PRECURSOR PROTEIN VARIANT AND ACTIVE PROTEIN THEREOF 有权
标题翻译： HGF前体蛋白变体和活性蛋白
公开(公告)号：US20110269944A1
公开(公告)日：2011-11-03
申请号：US13175110
申请日：2011-07-01
申请人： Toshikazu Nakamura , Kunio Matsumoto , Kazuhiro Fukuta , Kiichi Adachi , Daichika Hayata
发明人： Toshikazu Nakamura , Kunio Matsumoto , Kazuhiro Fukuta , Kiichi Adachi , Daichika Hayata
IPC分类号： C07K14/475
CPC分类号： C07K14/4753 , A61K38/00
摘要： An HGF precursor protein variant, in which a peptide structure comprises a sequence including a peptide chain X inserted between an α chain of HGF or a polypeptide where 1 to 20 amino-acid residues from the C-terminus of the α chain are deleted, and a β chain of HGF or a polypeptide where 1 to 20 amino-acid residues from the N-terminus of the β chain are deleted; wherein (i) the peptide chain X has an amino-acid sequence of at least two residues, (ii) the peptide chain X can be cleaved by a protease reaction or a chemical reaction, and (iii) a protein obtained by cleaving at least one site of the peptide chain X has HGF action.
摘要翻译：一种HGF前体蛋白质变体，其中肽结构包含插入在H链α链或多肽之间的肽链X的序列，其中缺失来自α链C末端的1-20个氨基酸残基，一个的HGF链或多肽，其中从＆lt; bgr的N末端1至20个氨基酸残基; 链被删除; 其中（i）肽链X具有至少两个残基的氨基酸序列，（ii）肽链X可以通过蛋白酶反应或化学反应来切割，和（iii）通过至少裂解获得的蛋白质肽链X的一个位点具有HGF作用。

7. 发明申请

US20080274960A1 Fibrosis Inhibitor for Implanted Organ 失效
标题翻译：植入器官纤维化抑制剂
公开(公告)号：US20080274960A1
公开(公告)日：2008-11-06
申请号：US11795314
申请日：2005-09-09
申请人： Jun Amano , Ken-ichi Ito , Kazuhiro Yamaura , Kunio Matsumoto , Toshikazu Nakamura
发明人： Jun Amano , Ken-ichi Ito , Kazuhiro Yamaura , Kunio Matsumoto , Toshikazu Nakamura
IPC分类号： A61K38/18 , C07K14/475 , C12N15/12 , A61P37/06
CPC分类号： C07K14/4753 , A61K38/1833 , A61K48/00
摘要： A pharmaceutical preparation comprising a hepatocyte growth factor or a DNA molecule encoding the same and the like according to the present invention can suppress the fibrosis of a transplanted organ after organ transplantation. The present invention is useful in the fields of organ transplantation and regeneration therapy.
摘要翻译：包含肝细胞生长因子或编码本发明的DNA分子的药物制剂能够抑制器官移植后的移植器官的纤维化。本发明可用于器官移植和再生治疗领域。

8. 发明授权

US06197603B1 Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step 失效
标题翻译：半导体器件及其制造方法，包括探针测试步骤和老化测试步骤
公开(公告)号：US06197603B1
公开(公告)日：2001-03-06
申请号：US09157153
申请日：1998-09-18
申请人： Ryuji Kohno , Tetsuo Kumazawa , Makoto Kitano , Akihiko Ariga , Yuji Wada , Naoto Ban , Shuji Shibuya , Yasuhiro Motoyama , Kunio Matsumoto , Susumu Kasukabe , Terutaka Mori , Hidetaka Shigi , Takayoshi Watanabe
发明人： Ryuji Kohno , Tetsuo Kumazawa , Makoto Kitano , Akihiko Ariga , Yuji Wada , Naoto Ban , Shuji Shibuya , Yasuhiro Motoyama , Kunio Matsumoto , Susumu Kasukabe , Terutaka Mori , Hidetaka Shigi , Takayoshi Watanabe
IPC分类号： G01R3126
CPC分类号： G01R3/00 , G01R1/0735
摘要： Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a plane of the pressure members on the side opposite the wafer in a probe test step, burn-in test step which represent typical semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit at the same time.
摘要翻译：即使当大量区域中的多个探针通过将设置在膜中的探针压在晶片上时，通过将压力负载施加到多个位置的平面上的多个位置，负载的分散也可以保持在预定容限内在探针测试步骤中与晶片相对的一侧的压力构件，代表典型的半导体器件制造步骤的老化测试步骤。因此，可以提供通过同时探测大量集成电路或大尺寸集成电路来提高半导体器件的可靠性和生产率的半导体器件及其制造方法。

9. 发明授权

US5811877A Semiconductor device structure 失效
标题翻译：半导体器件结构
公开(公告)号：US5811877A
公开(公告)日：1998-09-22
申请号：US829144
申请日：1997-03-31
申请人： Ichiro Miyano , Ikuo Kawaguchi , Kunio Matsumoto , Junichi Saeki , Tooru Yoshida , Naoya Kanda , Isamu Yoshida , Michifumi Kawai , Hideo Yamakura , Shigeharu Tsunoda , Ritsuro Orihashi , Masachika Masuda , Sueo Kawai
发明人： Ichiro Miyano , Ikuo Kawaguchi , Kunio Matsumoto , Junichi Saeki , Tooru Yoshida , Naoya Kanda , Isamu Yoshida , Michifumi Kawai , Hideo Yamakura , Shigeharu Tsunoda , Ritsuro Orihashi , Masachika Masuda , Sueo Kawai
IPC分类号： H01L21/50 , H01L21/56 , H01L21/70 , H01L23/28 , H01L23/31 , H01L23/495 , H01L23/50 , H01L25/10 , H01L23/48 , H01L25/18
CPC分类号： H01L21/565 , H01L23/3107 , H01L23/4951 , H01L23/49568 , H01L25/105 , H01L2224/32014 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/4826 , H01L2224/49175 , H01L2224/73215 , H01L2225/1029 , H01L2225/1058 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01019 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/3025 , H01L2924/3511
摘要： An ultra-thin resin molded semiconductor device of high reliability with low cost and with easy repair at time of mounting. A plurality of these semiconductor devices are stacked to provide a semiconductor module which has a higher function than semiconductor devices in the same volume, and a card type module utilizing assembled by the stacked semiconductor module is provided. In manufacturing the semiconductor module, an extremely thin lead frame and an LSI chip are directly connected together, and the mirror surface of the LSI chip is exposed by using a low viscosity epoxy resin to have a thin molding. The mirror surface is grinded to have a further thin thickness of the whole structure of the semiconductor device. A part of the lead frame is formed as a reinforcing member, a heat radiation path, a light shielding part for shielding the LSI from harmful light beams, or a positioning base for mounting a substrate. The above ultra-thin resin molded semiconductor devices are interconnected together in a stacked layout to provide a stacked semiconductor module, and to provide a card type device having a higher function.
摘要翻译：一种超薄树脂模制半导体器件，可靠性高，成本低，安装时易于维修。多个这些半导体器件被堆叠以提供具有比相同体积的半导体器件更高功能的半导体模块，并且提供利用由堆叠的半导体模块组装的卡型模块。在制造半导体模块时，将极薄的引线框架和LSI芯片直接连接在一起，并且通过使用低粘度环氧树脂来暴露LSI芯片的镜面以具有薄的成型。研磨镜面以使半导体器件的整个结构具有更薄的厚度。引线框架的一部分形成为加强构件，散热路径，用于屏蔽LSI免受有害光束的遮光部分或用于安装基板的定位基座。上述超薄树脂模制半导体器件以堆叠的布局互连在一起以提供堆叠的半导体模块，并且提供具有更高功能的卡型设备。

10. 发明授权

US4681841A Enzymatic assay method 失效
标题翻译：酶法测定
公开(公告)号：US4681841A
公开(公告)日：1987-07-21
申请号：US538680
申请日：1983-10-03
申请人： Kunio Matsumoto , Tsutomu Hirata
发明人： Kunio Matsumoto , Tsutomu Hirata
IPC分类号： G01N33/50 , C12Q1/00 , C12Q1/26 , C12Q1/34 , C12Q1/44
CPC分类号： C12Q1/004 , C12Q1/34 , C12Q2334/00 , C12Q2337/10 , G01N2333/924 , G01N2333/948 , G01N2333/976 , Y10S435/817
摘要： A method for assaying a compound of the formula ##STR1## wherein R.sub.1 is hydroxyl or amino, or hydrogen if at least one of R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 is hydroxyl or amino, and R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are hydrogen, halogen, lower alkyl, lower alkoxy, amino, substituted amino, hydroxy, carboxyl or sulfo, or R.sub.5 and R.sub.6 together form a ring, comprises establishing a reaction system containing the compound to be assayed and a coupler and an enzyme capable of consuming oxygen and generating a pigment in the presence of the compound and the coupler. A detectable change in the reaction system is measured, to assay the compound in question. The measurement can comprise the measurement of consumed oxygen, as by an oxygen electrode. Or the measurement can comprise the measurement of the generated pigment, as by a colorimetric assay at a specific absorption wavelength thereof.
摘要翻译：如果R 2，R 3，R 4，R 5和R 6中的至少一个是羟基或氨基，以及R 2，R 3，R 4，R 5和R 6，则分析其中R 1为羟基或氨基的式是氢，卤素，低级烷基，低级烷氧基，氨基，取代的氨基，羟基，羧基或磺基，或R5和R6一起形成环，包括建立含有待测化合物的反应体系和成色剂和能够消耗氧并在化合物和偶联剂存在下产生颜料。测量反应体系中可检测的变化，以测定所讨论的化合物。测量可以包括通过氧电极测量消耗的氧气。或者测量可以包括产生的颜料的测量，如通过其特定吸收波长的比色测定法。

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