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    • 6. 发明授权
    • Semiconductor device having integrated memory and logic
    • 具有集成存储器和逻辑的半导体器件
    • US06532187B2
    • 2003-03-11
    • US09867547
    • 2001-05-31
    • Tomonori FujimotoShoji SakamotoKiyoto Ohta
    • Tomonori FujimotoShoji SakamotoKiyoto Ohta
    • G11C800
    • G11C11/4082G11C8/06G11C29/48
    • In a conventional DRAM, row addresses and column addresses are latched by DFF and decoding of addresses is started a certain time after a clock rise, and it takes a long time after the clock rise until the decoding is completed, having a problem that it is not possible to perform read/write at high speed. The present invention adopts a configuration connecting latch circuits such as the row address latch circuits and column address latch circuits using a scan chain. This makes decoding of row addresses and column addresses start when the clock is “L”, making it possible to complete decoding on the rise of each operation clock cycle, shorten the operation clock cycle and speed up read/write. The conventional art conducts a test on the connection between the row addresses and column addresses of the logic section and memory through an actual operation test of the entire LSI, resulting in a low circuit failure detection rate. The present invention conducts this test through a scan test, making it possible to automatically create test patterns with high circuit failure detection rate.
    • 在常规DRAM中,行地址和列地址被DFF锁存,地址的解码在时钟上升之后的特定时间开始,并且在时钟上升直到解码完成之后需要很长时间,具有这样的问题 不可能高速执行读/写。 本发明采用使用扫描链连接诸如行地址锁存电路和列地址锁存电路的锁存电路的配置。 这使得当时钟为“L”时,行地址和列地址的解码开始,使得可以在每个操作时钟周期的上升完成解码,缩短操作时钟周期并加快读/写速度。 传统技术通过整个LSI的实际操作测试来对逻辑部分和存储器的行地址和列地址之间的连接进行测试,导致低电路故障检测率。 本发明通过扫描测试进行该测试,使得可以自动创建具有高电路故障检测速率的测试图案。
    • 7. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06198671B1
    • 2001-03-06
    • US09506102
    • 2000-02-17
    • Yasuhiro AoyamaKazuhiko ShimakawaKiyoto OhtaMasanobu Hirose
    • Yasuhiro AoyamaKazuhiko ShimakawaKiyoto OhtaMasanobu Hirose
    • G11C700
    • G11C5/14
    • The semiconductor memory device formed on a semiconductor substrate includes: a memory cell array having a plurality of memory cells formed at intersections between a plurality of word lines and a plurality of bit line pairs; a plurality of sense amplifiers each formed to correspond to each of the plurality of bit line pairs for amplifying a potential difference read on the bit line pair; and a low-level potential generation section for generating a low-level potential out of high-level and low-level potentials to be applied to the memory cells, the bit line pairs, and the sense amplifiers. The low-level potential generation section has: a ground potential generation part having a ground potential generation semiconductor element for generating as the low-level potential a first potential substantially equal to a ground potential; a threshold potential generation part having a threshold potential generation semiconductor element for generating as the low-level potential a second potential substantially equal to a threshold potential, and operating when a potential exceeding the threshold potential is applied; and a ground potential control part for controlling operation of the ground potential generation semiconductor element.
    • 形成在半导体衬底上的半导体存储器件包括:存储单元阵列,具有形成在多个字线和多个位线对之间的交叉处的多个存储单元; 多个读出放大器,每个形成为对应于多个位线对中的每一个,用于放大位线对上读取的电位差; 以及用于在施加到存储单元,位线对和读出放大器的高电平和低电平电位之间产生低电平电位的低电平电位产生部分。 低电平电位产生部分具有:具有接地电位产生半导体元件的地电位产生部分,用于产生基本上等于地电势的第一电位作为低电位电位; 阈值电位产生部分,其具有用于产生基本上等于阈值电位的第二电位作为低电位电位的阈值电位产生半导体元件,并且当施加超过阈值电势的电位时操作; 以及用于控制地电位产生半导体元件的工作的接地电位控制部。
    • 9. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US07266036B2
    • 2007-09-04
    • US10860111
    • 2004-06-04
    • Emi HayashiKiyoto OhtaYuji Yamasaki
    • Emi HayashiKiyoto OhtaYuji Yamasaki
    • G11C8/00
    • G11C29/808G11C11/401G11C29/24
    • A semiconductor memory device is provided with a plurality of memory blocks including a plurality of word lines and a plurality of bit line pairs intersecting the individual word lines, a plurality of memory cells provided at each of intersections where the individual word lines intersect the bit line pairs, and a plurality of sense amplifiers respectively provided in correspondence with the bit line pairs. The semiconductor memory device further comprises common data bus line pairs each connected via switch transistors to the corresponding memory blocks, a read/write amplifier for performing a data read/write operation through the common data bus line pairs on the memory blocks, and an SRAM cell electrically connected via switch transistors to each common data bus line pair.
    • 半导体存储器件具有多个存储块,包括多个字线和与各个字线相交的多个位线对,多个存储单元,设置在各个字线与位线相交的每个相交处 分别对应于位线对提供的多个读出放大器。 半导体存储器件还包括通过开关晶体管连接到对应的存储块的公共数据总线线对,用于通过存储器块上的公共数据总线对执行数据读/写操作的读/写放大器,以及SRAM 单元经由开关晶体管电连接到每个公共数据总线线对。
    • 10. 发明授权
    • Semiconductor integrated circuit device and method of manufacturing the same
    • 半导体集成电路器件及其制造方法
    • US06741118B2
    • 2004-05-25
    • US10306588
    • 2002-11-27
    • Toshitaka UchikobaYuji YamasakiKenichi OrigasaKiyoto Ohta
    • Toshitaka UchikobaYuji YamasakiKenichi OrigasaKiyoto Ohta
    • G05F110
    • H02M3/07H02M2003/071
    • A semiconductor integrated circuit device includes a charge pump circuit for outputting a predetermined negative voltage to a negative voltage node, a voltage detection circuit for generating a first detection signal when the voltage of the negative voltage node has reached a first detection voltage and for generating a second detection signal when the voltage of the negative voltage node has reached a second detection voltage, an oscillator that is driven in response to the first detection signal so as to generate a signal for driving the charge pump circuit, and a negative voltage raising circuit that has an output terminal connected to the negative voltage node, and that is driven in response to the second detection signal so as to raise the voltage of the negative voltage node through the output of its output terminal. The VBB voltage can be increased rapidly and can be controlled at higher speeds, thereby increasing the stability of the voltage.
    • 半导体集成电路装置包括用于向负电压节点输出预定负电压的电荷泵电路,当负电压节点的电压达到第一检测电压时产生第一检测信号的电压检测电路, 当所述负电压节点的电压达到第二检测电压时的第二检测信号;响应于所述第一检测信号被驱动以产生用于驱动所述电荷泵电路的信号的振荡器;以及负电压升高电路, 具有连接到负电压节点的输出端子,并且响应于第二检测信号被驱动,以便通过其输出端子的输出来提高负电压节点的电压。 VBB电压可以快速增加,可以在更高的速度下进行控制,从而提高电压的稳定性。