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    • 1. 发明申请
    • NEAR FIELD EXPOSURE MASK, METHOD OF FORMING RESIST PATTERN USING THE MASK, AND METHOD OF PRODUCING DEVICE
    • 近场曝光掩模,使用掩模形成电阻图案的方法,以及制造装置的方法
    • US20100270264A1
    • 2010-10-28
    • US12376426
    • 2007-10-05
    • Toshiki ItoNatsuhiko MizutaniAkira Terao
    • Toshiki ItoNatsuhiko MizutaniAkira Terao
    • B44C1/22G03F1/00G03F7/20
    • G03F7/2014B82Y10/00G03F1/50G03F7/70325
    • Provided are a near field exposure mask which can suppress heat generation of a mask during exposure and can also suppress variation in size of a resist pattern for each shot, and a resist pattern forming method using the same. The near field exposure mask includes a transparent mask matrix l0; a light shielding layer l2 formed above the transparent mask matrix l0 and containing silicon; a reflective layer l1 formed between the transparent mask matrix l0 and the light shielding layer l2; and an opening pattern provided in the reflective layer l1 and the light shielding layer l2 and being less in size than an exposure wavelength λ (nm), wherein the reflectance at an interface between the transparent mask matrix l0 and the reflective layer l1 is higher than a reflectance at an interface between a transparent mask matrix and a light shielding layer formed on the transparent mask matrix and containing silicon of a near field exposure mask which has no reflective layer between the transparent mask matrix and the light shielding layer.
    • 提供一种可以抑制曝光期间掩模的发热的近场曝光掩模,并且还可以抑制每个镜头的抗蚀剂图案的尺寸变化,以及使用其的抗蚀剂图案形成方法。 近场曝光掩模包括透明掩模矩阵10; 形成在透明掩模矩阵10上方并含有硅的遮光层12; 形成在透明掩模矩阵10和遮光层12之间的反射层l1; 以及设置在反射层11和遮光层12中并且尺寸小于曝光波长λ(nm)的开口图案,其中透明掩模矩阵10和反射层11之间的界面处的反射率高于 在透明掩模矩阵和形成在透明掩模矩阵上的遮光层之间的界面处的反射率,并且包含在透明掩模矩阵和遮光层之间没有反射层的近场曝光掩模的硅。
    • 2. 发明授权
    • Near field exposure mask, method of forming resist pattern using the mask, and method of producing device
    • 近场曝光掩模,使用掩模形成抗蚀剂图案的方法,以及制造装置的方法
    • US07968256B2
    • 2011-06-28
    • US12376426
    • 2007-10-05
    • Toshiki ItoNatsuhiko MizutaniAkira Terao
    • Toshiki ItoNatsuhiko MizutaniAkira Terao
    • G03F1/00G03F7/00
    • G03F7/2014B82Y10/00G03F1/50G03F7/70325
    • Provided are a near field exposure mask which can suppress heat generation of a mask during exposure and can also suppress variation in size of a resist pattern for each shot, and a resist pattern forming method using the same. The near field exposure mask includes a transparent mask matrix l0; a light shielding layer l2 formed above the transparent mask matrix l0 and containing silicon; a reflective layer l1 formed between the transparent mask matrix l0 and the light shielding layer l2; and an opening pattern provided in the reflective layer l1 and the light shielding layer l2 and being less in size than an exposure wavelength λ (nm), wherein the reflectance at an interface between the transparent mask matrix l0 and the reflective layer l1 is higher than a reflectance at an interface between a transparent mask matrix and a light shielding layer formed on the transparent mask matrix and containing silicon of a near field exposure mask which has no reflective layer between the transparent mask matrix and the light shielding layer.
    • 提供一种可以抑制曝光期间掩模的发热的近场曝光掩模,并且还可以抑制每个镜头的抗蚀剂图案的尺寸变化,以及使用其的抗蚀剂图案形成方法。 近场曝光掩模包括透明掩模矩阵10; 形成在透明掩模矩阵10上方并含有硅的遮光层12; 形成在透明掩模矩阵10和遮光层12之间的反射层l1; 以及设置在反射层11和遮光层12中并且尺寸小于曝光波长λ(nm)的开口图案,其中透明掩模矩阵10和反射层11之间的界面处的反射率高于 在透明掩模矩阵和形成在透明掩模矩阵上的遮光层之间的界面处的反射率,并且包含在透明掩模矩阵和遮光层之间没有反射层的近场曝光掩模的硅。
    • 9. 发明申请
    • EXPOSURE METHOD USING NEAR FIELD LIGHT AND PATTERN FORMATION METHOD USING THE METHOD
    • 使用近场和曝光方法的曝光方法
    • US20080085474A1
    • 2008-04-10
    • US11861711
    • 2007-09-26
    • Natsuhiko MizutaniToshiki Ito
    • Natsuhiko MizutaniToshiki Ito
    • G03F7/20
    • G03F7/2014B82Y10/00G03F1/50G03F7/7035
    • Provided is an exposure method using near field light which can form a pattern finer than a mask pitch and avoid difficulty when forming a mask for fine lithography at unity magnification. The exposure method is configured such that a mask including a light shielding film with a fine opening less in size than a wavelength of exposure light is closely contacted with a photosensitive thin film including a silane coupling agent on a substrate, and light of a wavelength at which the photosensitive thin film has sensitivity for propagating light is irradiated to perform exposure, wherein the exposure is performed with the light at such an exposure amount that an exposed portion in the photosensitive thin film just below an edge portion of the light shielding film and a non-exposed portion in the photosensitive thin film just below a central portion of the fine opening are formed coexistently.
    • 提供了一种使用近场光的曝光方法,其可以形成比掩模间距更细的图案,并且在以单位放大形成用于精细光刻的掩模时避免困难。 曝光方法被配置为使得包括具有比曝光光的波长更小的精细开口的遮光膜的掩模与在基板上包括硅烷偶联剂的感光薄膜紧密接触, 照射感光薄膜对传播光具有灵敏度的曝光,进行曝光,其中以这样的曝光量进行曝光,使曝光部分刚好在遮光膜的边缘部分处的感光薄膜的曝光部分和 形成在微细开口的中央部正下方的感光性薄膜的非曝光部分共存。