专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070277930A1 Substrate Cleaning Apparatus and Substrate Processing Unit 审中-公开
标题翻译：基板清洗装置及基板处理装置
公开(公告)号：US20070277930A1
公开(公告)日：2007-12-06
申请号：US11663071
申请日：2005-09-14
申请人： Toshi Yokoyama , Seiji Katsuoka , Takahiro Ogawa , Kaoru Yamada , Kazuaki Maeda
发明人： Toshi Yokoyama , Seiji Katsuoka , Takahiro Ogawa , Kaoru Yamada , Kazuaki Maeda
IPC分类号： H01L21/304 , H01L21/683
CPC分类号： H01L21/67051 , H01L21/67207
摘要： A substrate cleaning apparatus does not need positioning of a transport system on start-up of the apparatus and can reduce the installation area of the apparatus. The substrate cleaning apparatus includes a base-integrated frame (1) in which are mounted a substrate transport device (2) for transporting a substrate, at least one substrate processing unit (3) for processing the substrate, a substrate loading port (5) for placing a substrate-housing cassette (4) on it, and a processing liquid supply apparatus (6) for supplying a processing liquid to the substrate processing unit, wherein maintenance of the substrate processing unit (3) can be performed from the backside of the apparatus.
摘要翻译：基板清洗装置不需要在装置起动时定位运输系统，并且可以减少装置的安装面积。基板清洗装置包括基底一体化框架（1），其中安装有用于输送基板的基板输送装置（2），用于处理基板的至少一个基板处理单元（3），基板装载口（5）用于将衬底容纳盒（4）放置在其上，以及处理液体供应装置（6），用于向衬底处理单元提供处理液体，其中可以从衬底处理单元（3）的背面执行维护该装置。

2. 外观设计

USD670886S1 Snack food 有权
公开(公告)号：USD670886S1
公开(公告)日：2012-11-20
申请号：US29384761
申请日：2011-02-03
申请人： Kaoru Yamada
设计人： Kaoru Yamada

3. 发明授权

US07638030B2 Electrolytic processing apparatus and electrolytic processing method 有权
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US07638030B2
公开(公告)日：2009-12-29
申请号：US10669468
申请日：2003-09-25
申请人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
发明人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
IPC分类号： C25F7/00 , B23H5/06
CPC分类号： C25F7/00
摘要： An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.
摘要翻译：一种在完全消除CMP处理或者尽可能减少CMP处理负荷的电解处理装置可以处理和平坦化形成在基板表面上的导电材料，或者可以除去（清洁）附着的附着物到工件（例如基板）的表面。本发明包括一个电极部分，它包括平行设置的多个电极部件，每个电极部件包括一个电极和一个覆盖电极表面的离子交换器，一个用于保持工件的保持器，它能使工件靠近或与电极部件的离子交换器接触，以及要连接到电极部分的每个电极部件的电极的电源。电极构件的离子交换器包括具有优异表面平滑度的离子交换器和离子交换容量大的离子交换器。

4. 发明申请

US20060234503A1 Substrate processing apparatus, substrate processing method, and substrate holding apparatus 有权
标题翻译：基板处理装置，基板处理方法以及基板保持装置
公开(公告)号：US20060234503A1
公开(公告)日：2006-10-19
申请号：US10564980
申请日：2004-07-28
申请人： Kaoru Yamada , Takayuki Saito , Sumio Yabe , Kenya Ito , Masayuki Kamezawa , Masaya Seki , Ichiro Katakabe , Yuki Inoue
发明人： Kaoru Yamada , Takayuki Saito , Sumio Yabe , Kenya Ito , Masayuki Kamezawa , Masaya Seki , Ichiro Katakabe , Yuki Inoue
IPC分类号： H01L21/44 , B65G47/91
CPC分类号： H01L21/02052 , B08B1/04 , B08B3/02 , B08B2203/0229 , B08B2203/0288 , C23C18/1628 , C25D17/001 , H01L21/67028 , H01L21/67034 , H01L21/67051
摘要： The present invention relates to a substrate processing apparatus and a substrate processing method for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. The present invention also relates to a substrate holding apparatus for holding and rotating a substrate. The substrate processing apparatus (1) for processing a substrate (W) while supplying a fluid to the substrate (W) includes a substrate holder (11) for holding and rotating the substrate (W), and a holder suction unit (24) for sucking the fluid from the substrate holder (11). The substrate holding apparatus includes a plurality of rollers (20) which are brought into contact with an edge portion of a substrate (W) so as to hold and rotate the substrate (W), and at least one moving mechanism (303a) for moving the rollers (20).
摘要翻译：本发明涉及在旋转诸如半导体晶片或液晶基板的基板的同时进行化学液体处理，清洁处理，干燥处理等的基板处理装置和基板处理方法。本发明还涉及用于保持和旋转衬底的衬底保持装置。另外，在向基板（W）供给流体的同时，对基板（W）进行处理的基板处理装置（1）具备用于保持和旋转基板（W）的基板支架（11），以及用于从基板支架（11）吸入流体。基板保持装置包括与基板（W）的边缘部分接触以便保持和旋转基板（W）的多个辊（20），以及至少一个移动机构（303a），用于移动辊子（20）。

5. 发明申请

US20060065645A1 Apparatus for repairing circuit pattern and method for manufacturing display apparatus using the same 有权
标题翻译：用于修复电路图案的装置和使用该装置的显示装置的制造方法
公开(公告)号：US20060065645A1
公开(公告)日：2006-03-30
申请号：US11143981
申请日：2005-06-03
申请人： Nobuaki Nakasu , Kaoru Yamada , Yuichiro Tanaka , Takeshi Arai , Hideyuki Honoki , Kazushi Yoshimura , Tetsuya Kawamura , Masanori Okawa
发明人： Nobuaki Nakasu , Kaoru Yamada , Yuichiro Tanaka , Takeshi Arai , Hideyuki Honoki , Kazushi Yoshimura , Tetsuya Kawamura , Masanori Okawa
IPC分类号： B23K26/36 , B23K26/03 , B23K26/06
CPC分类号： B23K26/34 , B23K26/32 , B23K2101/34 , B23K2101/36 , B23K2103/08 , B23K2103/50 , G02F1/1309 , H01L27/124 , H01L27/1259
摘要： A region surrounded by two gate wiring and two drain wiring includes pixels and when there is a defect of short-circuit in adjacent pixel electrodes, the short-circuited portion is removed by irradiating a laser via a mask having a transmission pattern, which corresponds to a pattern of the gate wiring, drain wiring and pixel electrodes in the short-circuited portion. The above short-circuited portion is identified and removed in comparison to a normal pattern, by use of information from an inspection apparatus, and the pattern defect formed on the substrate is automatically repaired. By applying the above method to a manufacturing process of display apparatus, in particular, to a resist pattern forming process, a display apparatus having a highly qualified display property may be achieved.
摘要翻译：由两个栅极布线和两个漏极布线包围的区域包括像素，并且当相邻像素电极中存在短路的缺陷时，通过经由具有透射图案的掩模照射激光来去除短路部分，该掩模对应于在短路部分中的栅极布线，漏极布线和像素电极的图案。通过使用来自检查装置的信息，与正常图案相比，识别和去除上述短路部分，并自动修复在基板上形成的图案缺陷。通过将上述方法应用于显示装置的制造工艺，特别是涉及抗蚀剂图案形成处理，可以实现具有高度合格的显示特性的显示装置。

6. 发明申请

US20050092351A1 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US20050092351A1
公开(公告)日：2005-05-05
申请号：US10695826
申请日：2003-10-30
申请人： Takayuki Saito , Tsukuru Suzuki , Kaoru Yamada , Kenya Ito , Masayuki Kamezawa , Kenji Yamaguchi
发明人： Takayuki Saito , Tsukuru Suzuki , Kaoru Yamada , Kenya Ito , Masayuki Kamezawa , Kenji Yamaguchi
IPC分类号： B08B3/02 , H01L21/00
CPC分类号： H01L21/6708 , B08B3/02 , Y10S134/902
摘要： The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder 11 for holding a substrate W substantially horizontally and rotating the substrate W, and a processing liquid supply unit 15 for supplying a processing liquid onto a peripheral portion of the substrate W which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate W. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder 54 for holding a substrate W substantially horizontally and rotating the substrate W, and a cleaning liquid supply unit 53 having a cleaning liquid outlet 53a which is oriented from a center of the substrate W toward a peripheral portion of the substrate W with an elevation angle of not more than 45° from a surface of the substrate W. The cleaning liquid supply unit 53 supplies a cleaning liquid to the surface of the substrate W at a flow velocity of not less than 0.1 m/s.
摘要翻译：本发明提供一种适用于腐蚀形成在基板的周边部分上的薄膜的蚀刻装置中的基板处理装置和基板处理方法。本发明还提供一种适用于在已被蚀刻的基板上进行清洗处理的清洗装置的基板处理装置和基板处理方法。用于蚀刻的基板处理装置包括基板保持器11，用于基本上水平地保持基板W并旋转基板W;以及处理液体供应单元15，用于将处理液体供应到正在旋转的基板W的周边部分处理液体相对于基板W是静止的。用于清洗基板的基板处理装置包括：基板保持件54，用于基本上水平地保持基板W并旋转基板W;以及清洗液供给部单元53具有从基板W的中心朝向基板W的周边部分取向的清洗液出口53a，其与基板W的表面具有不大于45°的仰角。清洗液供给单元 53以不小于0.1m / s的流速向基板W的表面供给清洗液。

7. 外观设计

USD670067S1 Snack food 有权
公开(公告)号：USD670067S1
公开(公告)日：2012-11-06
申请号：US29397762
申请日：2011-07-20
申请人： Kaoru Yamada
设计人： Kaoru Yamada

8. 发明授权

US08133380B2 Method for regenerating ion exchanger 有权
标题翻译：离子交换器再生方法
公开(公告)号：US08133380B2
公开(公告)日：2012-03-13
申请号：US12222733
申请日：2008-08-14
申请人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
发明人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
IPC分类号： B23H3/10
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.
摘要翻译：用于再生离子交换剂的方法和装置可以容易且快速地再生离子交换器，并且可以在再生离子交换器的清洁和废液的处理时最小化负载。再生污染离子交换器的方法包括：提供一对再生电极和对置电极，设置在电极之间的隔板和设置在对电极与隔板之间的再生用离子交换器; 并在再生电极和对电极之间施加电压，同时在隔板和再生电极之间提供液体，并且还在分隔件和对电极之间供应液体。

9. 发明申请

US20090090397A1 Substrate processing apparatus and substrate processing method 审中-公开
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US20090090397A1
公开(公告)日：2009-04-09
申请号：US12314197
申请日：2008-12-05
申请人： Takayuki Saito , Tsukuru Suzuki , Kaoru Yamada , Kenya Ito , Masayuki Kamezawa , Kenji Yamaguchi
发明人： Takayuki Saito , Tsukuru Suzuki , Kaoru Yamada , Kenya Ito , Masayuki Kamezawa , Kenji Yamaguchi
IPC分类号： B08B3/04
CPC分类号： H01L21/6708 , B08B3/02 , Y10S134/902
摘要： The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder 11 for holding a substrate W substantially horizontally and rotating the substrate W, and a processing liquid supply unit 15 for supplying a processing liquid onto a peripheral portion of the substrate W which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate W. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder 54 for holding a substrate W substantially horizontally and rotating the substrate W, and a cleaning liquid supply unit 53 having a cleaning liquid outlet 53a which is oriented from a center of the substrate W toward a peripheral portion of the substrate W with an elevation angle of not more than 45° from a surface of the substrate W. The cleaning liquid supply unit 53 supplies a cleaning liquid to the surface of the substrate W at a flow velocity of not less than 0.1 m/s.
摘要翻译：本发明提供一种适用于腐蚀形成在基板的周边部分上的薄膜的蚀刻装置中的基板处理装置和基板处理方法。本发明还提供一种适用于在已被蚀刻的基板上进行清洗处理的清洗装置的基板处理装置和基板处理方法。用于蚀刻的基板处理装置包括基板保持器11，用于基本上水平地保持基板W并旋转基板W;以及处理液体供应单元15，用于将处理液体供应到正在旋转的基板W的周边部分处理液体相对于基板W是静止的。用于清洗基板的基板处理装置包括：基板保持件54，用于基本上水平地保持基板W并旋转基板W;以及清洗液供给部单元53具有从基板W的中心朝向基板W的周边部分取向的清洗液出口53a，其与基板W的表面的仰角不大于45°。清洗液供给单元53 以不小于0.1m / s的流速将清洗液供给到基板W的表面。

10. 发明授权

US07476290B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US07476290B2
公开(公告)日：2009-01-13
申请号：US10695826
申请日：2003-10-30
申请人： Takayuki Saito , Tsukuru Suzuki , Kaoru Yamada , Kenya Ito , Masayuki Kamezawa , Kenji Yamaguchi
发明人： Takayuki Saito , Tsukuru Suzuki , Kaoru Yamada , Kenya Ito , Masayuki Kamezawa , Kenji Yamaguchi
IPC分类号： B08B7/04
CPC分类号： H01L21/6708 , B08B3/02 , Y10S134/902
摘要： The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a processing liquid supply unit for supplying a processing liquid onto a peripheral portion of the substrate which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a cleaning liquid supply unit having a cleaning liquid outlet which is oriented from a center of the substrate toward a peripheral portion of the substrate with an elevation angle of not more than 45° from a surface of the substrate. The cleaning liquid supply unit supplies a cleaning liquid to the surface of the substrate at a flow velocity of not less than 0.1 m/s.
摘要翻译：本发明提供一种适用于腐蚀形成在基板的周边部分上的薄膜的蚀刻装置中的基板处理装置和基板处理方法。本发明还提供一种适用于在已被蚀刻的基板上进行清洗处理的清洗装置的基板处理装置和基板处理方法。用于蚀刻的基板处理装置包括：基板保持器，用于基本上水平地保持基板并旋转基板;以及处理液体供应单元，用于将处理液体供应到正在旋转的基板的周边部分，处理液相对于基板静止。用于清洗基板的基板处理装置包括基板保持器，用于基本水平地保持基板并旋转基板;以及清洗液供给单元，其具有从基板的中心朝向基板的周边部分该衬底的仰角与衬底的表面不超过45°。清洗液供给部以不小于0.1m / s的流速向基板的表面供给清洗液。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式