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    • 4. 发明授权
    • Method and apparatus for X-ray analyses
    • X射线分析的方法和装置
    • US5877498A
    • 1999-03-02
    • US893034
    • 1997-07-15
    • Aritoshi SugimotoYoshimi SudoTokuo KureKen NinomiyaKatsuhiro KurodaTakashi NishidaHideo TodokoroYasuhiro MitsuiHiroyasu Shichi
    • Aritoshi SugimotoYoshimi SudoTokuo KureKen NinomiyaKatsuhiro KurodaTakashi NishidaHideo TodokoroYasuhiro MitsuiHiroyasu Shichi
    • G01N23/225H01J37/256
    • G01N23/2252H01J2237/2445H01J2237/2807
    • An X-ray analyzing method for inspecting opening states of fine holes comprises the steps of: irradiating a finely converged electron beam into a first fine hole, observing an X-ray emitted from the inside of said first fine hole in order to obtain an first X-ray analysis data about the residue substance existing at the bottom of said first fine hole; irradiating a finely converged electron beam into a second fine hole, observing an X-ray emitted from the inside of said second fine hole in order to obtain an second X-ray analysis data about the residue substance existing at the bottom of said second fine hole; and comparing said first X-ray analysis data with said second X-ray analysis data, forming a judgment as to whether or not a difference between said first and second analysis data is smaller than a predetermined threshold value and using an outcome of said judgment to determine the opening states of said first and second fine holes. The X-ray observations are carried out by detecting only the X-rays emitted within the angular range -.theta. to +.theta. where notation .theta. is an angle formed with a center axis of the irradiated electron beam and so defined that tan .theta. is equal to a/d whereas notations a and d are the radius and the depth of the fine holes.
    • 用于检查细孔的打开状态的X射线分析方法包括以下步骤:将精细会聚的电子束照射到第一细孔中,观察从所述第一细孔的内部发射的X射线,以获得第一细孔 关于存在于所述第一细孔底部的残留物质的X射线分析数据; 将精细会聚的电子束照射到第二细孔中,观察从所述第二细孔的内部发射的X射线,以获得关于存在于所述第二细孔底部的残留物质的第二X射线分析数据 ; 以及将所述第一X射线分析数据与所述第二X射线分析数据进行比较,形成关于所述第一和第二分析数据之间的差是否小于预定阈值的判断,并且使用所述判断结果 确定所述第一和第二细孔的打开状态。 通过仅检测在角度范围θ至+θ内发射的X射线来进行X射线观察,其中符号θ是与照射的电子束的中心轴形成的角度,并且如此定义,tanθ等于 a / d,而符号a和d是细孔的半径和深度。
    • 5. 发明授权
    • Semiconductor device including arrangement for reducing junction
degradation
    • 半导体器件包括用于减少结退化的装置
    • US5426326A
    • 1995-06-20
    • US103206
    • 1993-08-09
    • Kiyonori OhyuKozo WatanabeOsamu TsuchiyaKazuyoshi OshimaYoshifumi KawamotoAtsushi HiraiwaTakashi Nishida
    • Kiyonori OhyuKozo WatanabeOsamu TsuchiyaKazuyoshi OshimaYoshifumi KawamotoAtsushi HiraiwaTakashi Nishida
    • H01L27/10H01L29/08H01L29/36H01L29/78H01L29/165
    • H01L29/0847H01L29/08H01L29/36
    • An arrangement is provided to decrease the junction degradation caused by the leakage current at a p-n junction in semiconductor devices. This arrangement can be useful for a variety of devices, and is especially effective for reducing junction degradation at the source or drain region of a MOSFET. To achieve such a reduction, a p-n junction layer is provided at a p-n junction of a semiconductor region and a substrate. Carrier concentration distributions of a p-type layer and an n-type layer of the p-n junction layer are set so that an electric field which tends to be increased by a local electric field enhancement in a depletion layer of the p-n junction due to a precipitate introduced from a semiconductor surface will not exceed 1 MV/cm. When the depth of a depletion layer of the p-type layer or the n-type layer is referred to as Xp or Xn, and the slope of the carrier concentration, Ap or An, the following relation is provided:4.3.times.10.sup.12 (/cm.sup.2).gtoreq.An.multidot.Xn.sup.2 =Ap.multidot.Xp.sup.2Preferably, the p-n junction layer is formed under a contact hole of a source or drain region if the device in question is a MOSFET. As a result of using this arrangement, the leakage current caused by a local Zener effect decreases so that the electric field locally increased by the precipitate will not be greater than 1 MV/cm.
    • 提供了一种布置,以减少由半导体器件中的p-n结处的漏电流引起的结劣化。 这种布置对于各种器件可能是有用的,并且对于降低MOSFET的源极或漏极区域处的结退化特别有效。 为了实现这种减少,在半导体区域和衬底的p-n结处提供p-n结层。 pn结层的p型层和n型层的载流子浓度分布被设定为使得由于沉淀引起的在pn结的耗尽层中的局部电场增强倾向于增加的电场 从半导体表面引入的电流不超过1MV / cm。 当p型层或n型层的耗尽层的深度被称为Xp或Xn以及载流子浓度Ap或An的斜率时,提供以下关系:4.3×10 12(/ cm 2) )> / = AnxXn2 = ApxXp2如果所讨论的器件是MOSFET,则优选地,在源极或漏极区域的接触孔下方形成pn结层。 作为使用这种布置的结果,由局部齐纳效应引起的漏电流减小,使得由沉淀物局部增加的电场将不会大于1MV / cm。
    • 7. 发明授权
    • Semiconductor memory devices having stacked polycrystalline silicon
transistors
    • 具有堆叠多晶硅晶体管的半导体存储器件
    • US5034797A
    • 1991-07-23
    • US497182
    • 1990-03-22
    • Toshiaki YamanakaYoshio SakaiTakashi HashimotoTakashi NishidaSatoshi MeguroShuji IkedaEiji Takeda
    • Toshiaki YamanakaYoshio SakaiTakashi HashimotoTakashi NishidaSatoshi MeguroShuji IkedaEiji Takeda
    • G11C11/412H01L21/8244H01L27/11
    • H01L27/1104H01L27/11H01L27/1108Y10S257/904
    • A semiconductor device having a CMIS structure for forming a static random access memory is disclosed which device can increase the packing density of the memory and reduce the stand-by power thereof. In this semiconductor device, a first MISFET of a first conductivity type is formed on and a substrate, a second MISFET of a second conductivity type is formed over the first MISFET with a first insulating film therebetween to form a stacked CMIS structure. The second MISFET is made up of a first conductive film, a second insulating film and a second conductive film, with the source, drain and channel regions of the second MISFET being formed in the first conductive film. A first resistive drain region is formed between the channel and drain regions of the first conductive film so that an impurity of the second conductivity type is contained in the first resistive drain region at a lower concentration than in the drain region, or the first resistive drain region is substantially undoped. The first resistive drain region is disposed over the gate electrode of the first MISFET, and the gate insulating film and gate electrode of the second MISFET are formed of the second insulating film and the second conductive film, respectively. In a case where a semiconductor memory device having a static random access memory cell which is provided with a flip-flop circuit of the stacked CMIS type, is formed, a pair of first MISFET's and a pair of third MISFET's of the first conductivity type are formed on the substrate, and the second MISFET is formed on one MISFET of the first MISFET's and the third MISFET's.
    • 公开了具有用于形成静态随机存取存储器的CMIS结构的半导体器件,其可以增加存储器的堆积密度并降低其待机功率。 在该半导体器件中,在基板上形成第一导电型的第一MISFET,在第一MISFET上形成第二导电类型的第二MISFET,其间具有第一绝缘膜,以形成层叠的CMIS结构。 第二MISFET由第一导电膜,第二绝缘膜和第二导电膜构成,第二MISFET的源极,漏极和沟道区形成在第一导电膜中。 在第一导电膜的沟道和漏极区之间形成第一电阻漏极区,使得第一导电类型的杂质以比漏极区域低的浓度包含在第一电阻漏极区域中,或者第一电阻漏极 区域基本上未掺杂。 第一电阻漏极区域设置在第一MISFET的栅电极之上,并且第二MISFET的栅极绝缘膜和栅极电极分别由第二绝缘膜和第二导电膜形成。 在具有设置有层叠CMIS型触发电路的静态随机存取存储单元的半导体存储器件的情况下,形成一对第一MISFET和第一导电类型的一对第三MISFET 并且第一MISFET形成在第一MISFET和第三MISFET的一个MISFET上。
    • 8. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US07776495B2
    • 2010-08-17
    • US11725507
    • 2007-03-20
    • Masahito HiroshimaTakashi Nishida
    • Masahito HiroshimaTakashi Nishida
    • G03F7/00
    • H01L28/91G03F1/00H01L27/10808H01L27/10852
    • A semiconductor device and a manufacturing method thereof in which the peripheral length of an aperture and the mechanical strength of cylinders in a cell can be increased without changing the occupation rate of patterns in the cell. By forming a slit in the middle of each mask pattern so as not to expose parts of wafer, the aperture of the wafer becomes nearly cocoon-shaped with a constriction in the middle. Thereby, the peripheral length of the aperture can be increased without changing the occupation rate of the mask patterns in a cell. Further, the shape of the bottom of the aperture also becomes nearly cocoon-shaped with a constriction in the middle, and therefore it is possible to increase the mechanical strength of cylinders.
    • 一种半导体器件及其制造方法,其中可以增加孔的圆周长度和单元中气缸的机械强度,而不改变单元中图案的占用率。 通过在每个掩模图案的中间形成狭缝以不暴露晶片的一部分,晶片的孔径在中间收缩而变为几乎茧形。 因此,可以增加孔径的周长,而不改变单元中的掩模图案的占有率。 此外,孔的底部的形状也变得几乎茧形,中间有收缩,因此可以提高气缸的机械强度。
    • 9. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US07208788B2
    • 2007-04-24
    • US10995134
    • 2004-11-24
    • Masahito HiroshimaTakashi Nishida
    • Masahito HiroshimaTakashi Nishida
    • H01L29/73
    • H01L28/91G03F1/00H01L27/10808H01L27/10852
    • A semiconductor device and a manufacturing method thereof in which the peripheral length of an aperture and the mechanical strength of cylinders in a cell can be increased without changing the occupation rate of patterns in the cell. By forming a slit in the middle of each mask pattern so as not to expose parts of wafer, the aperture of the wafer becomes nearly cocoon-shaped with a constriction in the middle. Thereby, the peripheral length of the aperture can be increased without changing the occupation rate of the mask patterns in a cell. Further, the shape of the bottom of the aperture also becomes nearly cocoon-shaped with a constriction in the middle, and therefore it is possible to increase the mechanical strength of cylinders.
    • 一种半导体器件及其制造方法,其中可以增加孔的圆周长度和单元中气缸的机械强度,而不改变单元中图案的占用率。 通过在每个掩模图案的中间形成狭缝以不暴露晶片的一部分,晶片的孔径在中间收缩而变为几乎茧形。 因此,可以增加孔径的周长,而不改变单元中的掩模图案的占有率。 此外,孔的底部的形状也变得几乎茧形,中间有收缩,因此可以提高气缸的机械强度。