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1. 发明申请

US20140001678A1 METHOD FOR MANUFACTURING LIQUID CRYSTAL POLYESTER MOLDED BODIES 审中-公开
标题翻译：制造液晶聚酯模塑体的方法
公开(公告)号：US20140001678A1
公开(公告)日：2014-01-02
申请号：US14005468
申请日：2012-03-13
申请人： Tomoyuki Hara , Mitsuo Maeda , Yasuo Matsumi
发明人： Tomoyuki Hara , Mitsuo Maeda , Yasuo Matsumi
IPC分类号： B29C45/00
CPC分类号： B29C45/0001 , B29C45/60 , B29C48/362 , B29C48/52 , B29C48/53 , B29K2067/003
摘要： A method is provided for manufacturing a liquid crystal polyester molded body by molding a liquid crystal polyester composition using a molding machine containing a cylinder, a screw and a heater. The screw is provided inside the cylinder, and is composed of a feed section, a compression section, and a metering section, the feed section and the compression section of the screw are composed of a single flight, the heater is provided on the outer periphery of the cylinder. The liquid crystal polyester composition contains a liquid crystal polyester and a polyamide resin. The method for manufacturing the polyester molded body includes: a step of melting and metering the liquid crystal polyester composition, a step of tightening a mold and performing mold clamping, a step of injecting the melted liquid crystal polyester composition into the mold, and a step of extracting the solidified resin from inside the mold.
摘要翻译：提供一种通过使用含有圆筒，螺杆和加热器的成型机成型液晶聚酯组合物来制造液晶聚酯成型体的方法。螺杆设置在气缸内部，由进给部，压缩部和计量部构成，螺杆的进给部和压缩部由单个飞行构成，加热器设置在外周的气缸。液晶聚酯组合物含有液晶聚酯和聚酰胺树脂。聚酯成型体的制造方法包括：熔融并计量液晶聚酯组合物的步骤，将模具拉紧并进行合模的步骤，将熔融的液晶聚酯组合物注入到模具中的步骤，以及步骤从模具内部提取固化树脂。

2. 发明授权

US08298869B2 Resin package and production method thereof 有权
标题翻译：树脂包装及其制造方法
公开(公告)号：US08298869B2
公开(公告)日：2012-10-30
申请号：US12406997
申请日：2009-03-19
申请人： Mitsuo Maeda , Yasuo Matsumi
发明人： Mitsuo Maeda , Yasuo Matsumi
IPC分类号： H01L21/60
CPC分类号： H01L21/565 , H01L23/3121 , H01L23/3142 , H01L23/49861 , H01L23/49894 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2924/00014 , H01L2924/1461 , H01L2924/15747 , H01L2924/00 , H01L2224/4554
摘要： The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution.
摘要翻译：根据本发明的树脂封装的制造方法包括通过氧化至少表面由铜制成的引线框架的表面来形成氧化铜层的工序，以及形成树脂封装主体的工序通过树脂成型封装使树脂附着在引线框架表面上的氧化铜层上，然后用酸性溶液除去规定区域的氧化铜层。

3. 发明授权

US08692272B2 Resin composition, reflective board and light-emitting apparatus 有权
标题翻译：树脂组合物，反射板和发光装置
公开(公告)号：US08692272B2
公开(公告)日：2014-04-08
申请号：US13125348
申请日：2009-10-23
申请人： Yasuo Matsumi , Mitsuo Maeda , Shintaro Saito
发明人： Yasuo Matsumi , Mitsuo Maeda , Shintaro Saito
IPC分类号： H01L33/00
CPC分类号： C09K19/3809 , C08K3/013 , C08K3/22 , C08L67/03 , C09K19/52 , G02B5/0808 , H01L31/0232 , H01L33/60
摘要： The present invention provides a resin composition comprising a liquid crystal polyester and a titanium oxide filler, wherein when a value obtained by converting the content of aluminum in the titanium oxide filler to the content of aluminum oxide is A (% by weight) and the volume average particle diameter of the titanium oxide filler is B (μm), A and B satisfy the formula (I): A≧0.1 and the formula (II): A/B2≦25, a reflective board obtained by molding the resin composition, and a light-emitting apparatus comprising the reflective board and a light-emitting element. According to the resin composition of the present invention, a reflective board having high reflectance and high heat resistance can be obtained. Furthermore, a light-emitting apparatus which is excellent in properties such as luminance can be obtained by using the reflective board.
摘要翻译：本发明提供一种包含液晶聚酯和氧化钛填料的树脂组合物，其中当将氧化钛填料中的铝含量转化为氧化铝含量而获得的值为A（重量％）和体积氧化钛填料的平均粒径为B（μm），A和B满足式（I）：A≥0.1和式（II）：A / B2＆nlE; 25，通过模塑树脂组合物获得的反射板，以及包括反射板和发光元件的发光装置。根据本发明的树脂组合物，可以获得具有高反射率和高耐热性的反射板。此外，通过使用反射板可以获得诸如亮度等性质优异的发光装置。

4. 发明申请

US20110204406A1 RESIN COMPOSITION, REFLECTIVE BOARD AND LIGHT-EMITTING APPARATUS 有权
标题翻译：树脂组合物，反光板和发光装置
公开(公告)号：US20110204406A1
公开(公告)日：2011-08-25
申请号：US13125348
申请日：2009-10-23
申请人： Yasuo Matsumi , Mitsuo Maeda , Shintaro Saito
发明人： Yasuo Matsumi , Mitsuo Maeda , Shintaro Saito
IPC分类号： H01L33/60 , C08L67/00 , C08K3/22
CPC分类号： C09K19/3809 , C08K3/013 , C08K3/22 , C08L67/03 , C09K19/52 , G02B5/0808 , H01L31/0232 , H01L33/60
摘要： The present invention provides a resin composition comprising a liquid crystal polyester and a titanium oxide filler, wherein when a value obtained by converting the content of aluminum in the titanium oxide filler to the content of aluminum oxide is A (% by weight) and the volume average particle diameter of the titanium oxide filler is B (μm), A and B satisfy the formula (I): A≧0.1 and the formula (II): A/B2≦25, a reflective board obtained by molding the resin composition, and a light-emitting apparatus comprising the reflective board and a light-emitting element. According to the resin composition of the present invention, a reflective board having high reflectance and high heat resistance can be obtained. Furthermore, a light-emitting apparatus which is excellent in properties such as luminance can be obtained by using the reflective board.
摘要翻译：本发明提供一种包含液晶聚酯和氧化钛填料的树脂组合物，其中当将氧化钛填料中的铝含量转化为氧化铝含量而获得的值为A（重量％）和体积氧化钛填料的平均粒径为B（μm），A和B满足式（I）：A≥0.1和式（II）：A / B2＆nlE; 25，通过模塑树脂组合物获得的反射板，以及包括反射板和发光元件的发光装置。根据本发明的树脂组合物，可以获得具有高反射率和高耐热性的反射板。此外，通过使用反射板可以获得诸如亮度等性质优异的发光装置。

5. 发明申请

US20100044844A1 LEAD FRAME, RESIN PACKAGE, SEMICONDUCTOR DEVICE AND RESIN PACKAGE MANUFACTURING METHOD 有权
标题翻译：引线框架，树脂包装，半导体器件和树脂包装制造方法
公开(公告)号：US20100044844A1
公开(公告)日：2010-02-25
申请号：US12545176
申请日：2009-08-21
申请人： Yasuo Matsumi , Mitsuo Maeda
发明人： Yasuo Matsumi , Mitsuo Maeda
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49565 , H01L21/565 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A pressure loss section H1 (H2) extends from a position corresponding to a corner of a resin package, and S1 is the minimum value of the opening area of the pressure loss section H1 (H2) perpendicular to the direction of resin flow (X axis) in the pressure loss section H1 (H2) during resin molding, while S2 is the average value of the opening areas of excess resin reservoirs H3 to H5 perpendicular to the direction of resin flow (Y axis) within excess resin reservoir H3 to H5 during molding. In this lead frame, S1
摘要翻译：压力损失部H1（H2）从与树脂封装的角部对应的位置延伸，S1是与树脂流动方向（X轴）垂直的压力损失部H1（H2）的开口面积的最小值）在树脂成型期间的压力损失部H1（H2）中，S2是在多余的树脂容器H3〜H5内与树脂流动方向（Y轴）垂直的多余的树脂容器H3〜H5的开口面积的平均值成型。在该引线框中，满足S1

6. 发明授权

US08410589B2 Lead frame, resin package, semiconductor device and resin package manufacturing method 有权
标题翻译：引线框架，树脂封装，半导体器件和树脂封装制造方法
公开(公告)号：US08410589B2
公开(公告)日：2013-04-02
申请号：US12545176
申请日：2009-08-21
申请人： Yasuo Matsumi , Mitsuo Maeda
发明人： Yasuo Matsumi , Mitsuo Maeda
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/49565 , H01L21/565 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A pressure loss section H1 (H2) extends from a position corresponding to a corner of a resin package, and S1 is the minimum value of the opening area of the pressure loss section H1 (H2) perpendicular to the direction of resin flow (X axis) in the pressure loss section H1 (H2) during resin molding, while S2 is the average value of the opening areas of excess resin reservoirs H3 to H5 perpendicular to the direction of resin flow (Y axis) within excess resin reservoir H3 to H5 during molding. In this lead frame, S1
摘要翻译：压力损失部H1（H2）从与树脂封装的角部对应的位置延伸，S1是与树脂流动方向（X轴）垂直的压力损失部H1（H2）的开口面积的最小值）在树脂成型期间的压力损失部H1（H2）中，S2是在多余的树脂容器H3〜H5内与树脂流动方向（Y轴）垂直的多余的树脂容器H3〜H5的开口面积的平均值成型。在该引线框中，满足S1

7. 发明申请

US20110036833A1 HEATER, RESIN MOLDING APPARATUS, RESIN MOLDING METHOD AND RESIN MOLDED BODY 审中-公开
标题翻译：加热器，树脂成型设备，树脂模塑方法和树脂模制体
公开(公告)号：US20110036833A1
公开(公告)日：2011-02-17
申请号：US12918569
申请日：2009-02-19
申请人： Mitsuo Maeda , Yasuo Matsumi
发明人： Mitsuo Maeda , Yasuo Matsumi
IPC分类号： H05B6/10 , B29C33/02 , B29C45/73
CPC分类号： B29C45/7312 , B29C33/06 , B29C45/14655 , B29C45/2737 , B29C45/78
摘要： Because it is possible to cool down a column member at a higher speed than natural cooling, throughput can be improved further. Especially, when the tubular body M42 and the column part M43 are made of different metals and the column part M43 is pressed into the tubular body M42, a distortion will occur in the column member M42 and M43 and the top board M41 fixed to the column member M42 and M43 due to the difference in thermal expansion coefficients between them, but the cooling paths P1 and P2 can absorb a distortion caused by the difference in thermal expansion coefficients of these metals. In particular, when the top board M41 is used as a mold for resin molding, it is possible to perform resin molding precisely because distortion caused by the difference in thermal expansion coefficients does not easily occur.
摘要翻译：因为可以以比自然冷却更高的速度冷却柱构件，所以可以进一步提高生产率。特别是，当管状体M42和柱部M43由不同的金属制成并且柱部M43被压入管状体M42时，在柱构件M42和M43以及固定到柱的顶板M41上将发生变形由于它们之间的热膨胀系数的差异，M42和M43的构件，而是冷却路径P1和P2可以吸收由这些金属的热膨胀系数差引起的变形。特别地，当顶板M41用作树脂模塑用模具时，由于不易发生由热膨胀系数差引起的变形，所以可以精确地进行树脂成型。

8. 发明授权

US10131081B2 Heater, resin molding apparatus, resin molding method and resin molded body 有权
公开(公告)号：US10131081B2
公开(公告)日：2018-11-20
申请号：US12918569
申请日：2009-02-19
申请人： Mitsuo Maeda , Yasuo Matsumi
发明人： Mitsuo Maeda , Yasuo Matsumi
IPC分类号： H05B6/10 , B29C33/02 , B29C45/73 , B29C45/27 , B29C45/78 , B29C33/06 , B29C45/14
摘要： Because it is possible to cool down a column member at a higher speed than natural cooling, throughput can be improved further. Especially, when the tubular body M42 and the column part M43 are made of different metals and the column part M43 is pressed into the tubular body M42, a distortion will occur in the column member M42 and M43 and the top board M41 fixed to the column member M42 and M43 due to the difference in thermal expansion coefficients between them, but the cooling paths P1 and P2 can absorb a distortion caused by the difference in thermal expansion coefficients of these metals. In particular, when the top board M41 is used as a mold for resin molding, it is possible to perform resin molding precisely because distortion caused by the difference in thermal expansion coefficients does not easily occur.

9. 发明授权

US08920695B2 Method of producing liquid crystal polyester composition 有权
标题翻译：制备液晶聚酯组合物的方法
公开(公告)号：US08920695B2
公开(公告)日：2014-12-30
申请号：US13418419
申请日：2012-03-13
申请人： Mitsuo Maeda , Yasuo Matsumi
发明人： Mitsuo Maeda , Yasuo Matsumi
IPC分类号： B29C47/60 , C08L67/03 , B29C47/80 , B29C47/00 , B29C47/10 , B29C47/40 , B29C47/76 , B29K105/00 , B29K105/16 , C08K7/02
CPC分类号： C08L67/03 , B29C47/0004 , B29C47/1045 , B29C47/1063 , B29C47/1081 , B29C47/40 , B29C47/6056 , B29C47/76 , B29C47/80 , B29C47/827 , B29C47/92 , B29C2947/92514 , B29C2947/92914 , B29K2105/0079 , B29K2105/16 , C08K7/02
摘要： A method of producing a liquid crystal polyester composition, the twin-screw extruder including a cylinder having a supply port for supplying the liquid crystal polyester, a first addition port for adding the filler other than fibrous fillers and a second addition port for adding a fibrous filler which are provided downstream of the supply port, and a screw provided with kneading portions on the upstream side and downstream side of the first addition port, a resin temperature (T1) of the liquid crystal polyester after kneading in the nearest upstream kneading portion satisfying formula (1), and a resin temperature (T2) of the liquid crystal polyester after kneading in the nearest downstream kneading portion satisfying formula (2): FT−100(° C.)≦T1≦FT+20(° C.) (1) FT−100(° C.)≦T2≦FT+30(° C.) (2) wherein FT represents the flow starting temperature of the liquid crystal polyester.
摘要翻译：一种液晶聚酯组合物的制造方法，所述双螺杆挤出机包括具有用于供给液晶聚酯的供给口的圆筒，用于添加纤维状填料以外的填料的第一加料口和第二加料口，设置在供给口下游的填料和在第一加料口的上游侧和下游侧具有混炼部的螺杆，在最近的上游捏合部捏合后的液晶聚酯的树脂温度（T1）满足式（1）和在满足式（2）的最近的下游捏合部分捏合后的液晶聚酯的树脂温度（T2）：FT-100（℃）＆nlE; T1＆nlE; FT + 20（℃））（1）FT-100（℃）＆nlE; T2＆nlE; FT + 30（℃）（2）其中FT表示液晶聚酯的流动起始温度。

10. 发明申请

US20070225420A1 Granule useful for highly thermal-conductive resin composition 审中-公开
标题翻译：颗粒可用于高导热性树脂组合物
公开(公告)号：US20070225420A1
公开(公告)日：2007-09-27
申请号：US11723439
申请日：2007-03-20
申请人： Shintaro Komatsu , Mitsuo Maeda
发明人： Shintaro Komatsu , Mitsuo Maeda
IPC分类号： C04B26/06
CPC分类号： C04B20/0016 , C04B26/10 , C04B26/18 , C04B2111/90 , Y10T428/2982 , C04B14/386 , C04B14/4625 , C04B24/40
摘要： Granules useful for highly thermal-conductive resin composition are provided. The Granules have a number average particle diameter of 0.5 to 5 mm, obtained by granulating fibers mainly containing fibers selected from alumina fibers and carbon fibers, wherein the fibers to be granulated have a number average fiber diameter of 1 to 50 μm.
摘要翻译：提供了用于高导热性树脂组合物的颗粒。颗粒的数均粒径为0.5〜5mm，通过将主要含有选自氧化铝纤维和碳纤维的纤维的纤维造粒得到，其中待粒化的纤维的数均纤维直径为1〜50μm。

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