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1. 发明授权

US08410589B2 Lead frame, resin package, semiconductor device and resin package manufacturing method 有权
标题翻译：引线框架，树脂封装，半导体器件和树脂封装制造方法
公开(公告)号：US08410589B2
公开(公告)日：2013-04-02
申请号：US12545176
申请日：2009-08-21
申请人： Yasuo Matsumi , Mitsuo Maeda
发明人： Yasuo Matsumi , Mitsuo Maeda
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/49565 , H01L21/565 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A pressure loss section H1 (H2) extends from a position corresponding to a corner of a resin package, and S1 is the minimum value of the opening area of the pressure loss section H1 (H2) perpendicular to the direction of resin flow (X axis) in the pressure loss section H1 (H2) during resin molding, while S2 is the average value of the opening areas of excess resin reservoirs H3 to H5 perpendicular to the direction of resin flow (Y axis) within excess resin reservoir H3 to H5 during molding. In this lead frame, S1
摘要翻译：压力损失部H1（H2）从与树脂封装的角部对应的位置延伸，S1是与树脂流动方向（X轴）垂直的压力损失部H1（H2）的开口面积的最小值）在树脂成型期间的压力损失部H1（H2）中，S2是在多余的树脂容器H3〜H5内与树脂流动方向（Y轴）垂直的多余的树脂容器H3〜H5的开口面积的平均值成型。在该引线框中，满足S1

2. 发明申请

US20120238043A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
标题翻译：半导体器件制造方法
公开(公告)号：US20120238043A1
公开(公告)日：2012-09-20
申请号：US13414062
申请日：2012-03-07
申请人： Misato SAKAMOTO , Yoshitake KATOU , Youichi YAMAMOTO , Takashi KYOUNO , Chikara YAMAMOTO , Terukazu MOTOSAWA , Mitsuo MAEDA , Hiroshi ITOU
发明人： Misato SAKAMOTO , Yoshitake KATOU , Youichi YAMAMOTO , Takashi KYOUNO , Chikara YAMAMOTO , Terukazu MOTOSAWA , Mitsuo MAEDA , Hiroshi ITOU
IPC分类号： H01L21/66
CPC分类号： H01L21/67253 , H01L21/67109 , H01L21/6875 , Y10S438/974
摘要： With the stage kept in an as-heated state, the semiconductor wafer is placed over the stage (step S10). Then, with the elapse of first time, a controller causes a pressure inside a vacuum chamber to rise to a second pressure higher than a first pressure (step S40). After the semiconductor wafer is placed over the stage, a pressure difference between a pressure inside the vacuum chamber and a pressure inside the adsorption port is set to a minimum value at which the semiconductor wafer is not allowed to slide over the protrusions. Further, in step S40 as well, the pressure difference is kept at the minimum value at which the semiconductor wafer is not allowed to slide over the protrusions.
摘要翻译：在阶段保持处于加热状态的情况下，将半导体晶片放置在台上（步骤S10）。然后，随着第一次经过，控制器使真空室内的压力上升到高于第一压力的第二压力（步骤S40）。在半导体晶片放置在平台上之后，将真空室内部的压力与吸附口内的压力之间的压力差设定为不允许半导体晶片在突起上滑动的最小值。此外，在步骤S40中，将压差保持在不允许半导体晶片在突起上滑动的最小值。

3. 发明申请

US20120235090A1 METHOD OF PRODUCING LIQUID CRYSTAL POLYESTER COMPOSITION 有权
标题翻译：生产液晶聚酯组合物的方法
公开(公告)号：US20120235090A1
公开(公告)日：2012-09-20
申请号：US13418419
申请日：2012-03-13
申请人： Mitsuo MAEDA , Yasuo MATSUMI
发明人： Mitsuo MAEDA , Yasuo MATSUMI
IPC分类号： C09K19/38
CPC分类号： C08L67/03 , B29C47/0004 , B29C47/1045 , B29C47/1063 , B29C47/1081 , B29C47/40 , B29C47/6056 , B29C47/76 , B29C47/80 , B29C47/827 , B29C47/92 , B29C2947/92514 , B29C2947/92914 , B29K2105/0079 , B29K2105/16 , C08K7/02
摘要： A method of producing a liquid crystal polyester composition, the twin-screw extruder including a cylinder having a supply port for supplying the liquid crystal polyester, a first addition port for adding the filler other than fibrous fillers and a second addition port for adding a fibrous filler which are provided downstream of the supply port, and a screw provided with kneading portions on the upstream side and downstream side of the first addition port, a resin temperature (T1) of the liquid crystal polyester after kneading in the nearest upstream kneading portion satisfying formula (1), and a resin temperature (T2) of the liquid crystal polyester after kneading in the nearest downstream kneading portion satisfying formula (2): FT−100(° C.)≦T1≦FT+20(° C.) (1) FT−100(° C.)≦T2≦FT+30(° C.) (2) wherein FT represents the flow starting temperature of the liquid crystal polyester.
摘要翻译：一种液晶聚酯组合物的制造方法，所述双螺杆挤出机包括具有用于供给液晶聚酯的供给口的圆筒，用于添加纤维状填料以外的填料的第一加料口和第二加料口，设置在供给口下游的填料和在第一加料口的上游侧和下游侧具有混炼部的螺杆，在最近的上游捏合部捏合后的液晶聚酯的树脂温度（T1）满足式（1）和在满足式（2）的最近的下游捏合部分捏合后的液晶聚酯的树脂温度（T2）：FT-100（℃）＆nlE; T1＆nlE; FT + 20（℃））（1）FT-100（℃）＆nlE; T2＆nlE; FT + 30（℃）（2）其中FT表示液晶聚酯的流动起始温度。

4. 发明申请

US20110244208A1 RESIN COMPOSITION FOR LASER BEAM WELDING, ARTICLE FOR LASER BEAM WELDING, AND COMPOSITE MOLDED ARTICLE 审中-公开
标题翻译：激光束焊接用树脂组合物，激光束焊接用品及复合成型品
公开(公告)号：US20110244208A1
公开(公告)日：2011-10-06
申请号：US13074223
申请日：2011-03-29
申请人： Yuichi SAKA , Mitsuo MAEDA , Shintaro SAITO
发明人： Yuichi SAKA , Mitsuo MAEDA , Shintaro SAITO
IPC分类号： B32B27/16 , C08K7/14 , C08L81/06 , B32B27/28 , B32B27/20 , B29C65/16
CPC分类号： B29C65/1677 , B29C65/1616 , B29C65/1635 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/7212 , B29C66/72143 , B29C66/7352 , B29C66/73775 , B29C66/73776 , B29C66/7392 , B29C66/73921 , B29K2105/16 , B29K2509/08 , B29L2031/7172 , C08J5/121 , C08J2381/06 , C08K7/14 , B29K2081/06 , B29K2309/08 , C08L81/06
摘要： A resin composition for laser beam welding, including an aromatic polysulfone resin, a filler and a crystalline resin, wherein the weight ratio of the aromatic polysulfone resin to the filler being 20 to 99:80 to 1, the filler includes a glass fiber having a monofilament diameter of 10 to 50 μm, and the amount of the crystalline resin, relative to 100 parts by weight of the total of the aromatic polysulfone resin and the glass fiber being 0 to 10 parts by weight.
摘要翻译：一种用于激光束焊接的树脂组合物，包括芳族聚砜树脂，填料和结晶树脂，其中芳族聚砜树脂与填料的重量比为20至99:80至1，该填料包括具有单丝直径为10〜50μm，结晶性树脂的量相对于芳香族聚砜树脂和玻璃纤维的总计100重量份为0〜10重量份。

5. 发明授权

US07985351B2 Liquid-crystal polyester resin composition 有权
标题翻译：液晶聚酯树脂组合物
公开(公告)号：US07985351B2
公开(公告)日：2011-07-26
申请号：US11573055
申请日：2005-08-02
申请人： Hiroyasu Yamauchi , Mitsuo Maeda , Fuminori Satoji , Kenji Ito
发明人： Hiroyasu Yamauchi , Mitsuo Maeda , Fuminori Satoji , Kenji Ito
IPC分类号： C09K19/00
CPC分类号： C08K3/04 , C08K7/04 , C08L67/00
摘要： A liquid crystalline polyester resin composition comprising 100 parts by weight of a liquid crystalline polyester; 50 to 150 parts by weight of at least one whisker selected from aluminum borate whisker and titanium oxide whisker; and 1 to 30 parts by weight of carbon black having a specific surface area of at least 200 m2/g. This liquid crystalline polyester resin composition has excellent mechanical properties and provides an insulator which is hardly charged.
摘要翻译：一种液晶聚酯树脂组合物，其包含100重量份的液晶聚酯; 50至150重量份的至少一种选自硼酸铝晶须和氧化钛晶须的晶须; 和1〜30重量份比表面积为至少200m 2 / g的炭黑。该液晶聚酯树脂组合物具有优异的机械性能，并且提供几乎不充电的绝缘体。

6. 发明申请

US20110036833A1 HEATER, RESIN MOLDING APPARATUS, RESIN MOLDING METHOD AND RESIN MOLDED BODY 审中-公开
标题翻译：加热器，树脂成型设备，树脂模塑方法和树脂模制体
公开(公告)号：US20110036833A1
公开(公告)日：2011-02-17
申请号：US12918569
申请日：2009-02-19
申请人： Mitsuo Maeda , Yasuo Matsumi
发明人： Mitsuo Maeda , Yasuo Matsumi
IPC分类号： H05B6/10 , B29C33/02 , B29C45/73
CPC分类号： B29C45/7312 , B29C33/06 , B29C45/14655 , B29C45/2737 , B29C45/78
摘要： Because it is possible to cool down a column member at a higher speed than natural cooling, throughput can be improved further. Especially, when the tubular body M42 and the column part M43 are made of different metals and the column part M43 is pressed into the tubular body M42, a distortion will occur in the column member M42 and M43 and the top board M41 fixed to the column member M42 and M43 due to the difference in thermal expansion coefficients between them, but the cooling paths P1 and P2 can absorb a distortion caused by the difference in thermal expansion coefficients of these metals. In particular, when the top board M41 is used as a mold for resin molding, it is possible to perform resin molding precisely because distortion caused by the difference in thermal expansion coefficients does not easily occur.
摘要翻译：因为可以以比自然冷却更高的速度冷却柱构件，所以可以进一步提高生产率。特别是，当管状体M42和柱部M43由不同的金属制成并且柱部M43被压入管状体M42时，在柱构件M42和M43以及固定到柱的顶板M41上将发生变形由于它们之间的热膨胀系数的差异，M42和M43的构件，而是冷却路径P1和P2可以吸收由这些金属的热膨胀系数差引起的变形。特别地，当顶板M41用作树脂模塑用模具时，由于不易发生由热膨胀系数差引起的变形，所以可以精确地进行树脂成型。

7. 发明授权

US07514672B2 Case for accommodating solid-state imaging device and solid-state imaging apparatus 失效
标题翻译：用于容纳固态成像装置和固态成像装置的情况
公开(公告)号：US07514672B2
公开(公告)日：2009-04-07
申请号：US11276090
申请日：2006-02-14
申请人： Mitsuo Maeda , Tomohiro Sato , Shigehide Yoshida
发明人： Mitsuo Maeda , Tomohiro Sato , Shigehide Yoshida
IPC分类号： H01J40/14 , H01L27/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14643 , H01L27/14683 , H01L27/148 , H01L2224/48091 , H01L2224/48247 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/16195 , H01L2924/3025 , H01L2924/00014
摘要： This solid-state imaging device comprises a rib integrally formed with a bottom plate. A case for accommodating a solid-state imaging device, which can suppress warping from occurring at the time of molding the case and is less deformable by heat at the time of mounting is provided. The solid-state imaging apparatus is less likely to cause readout errors and the like even when the temperature for use varies, and is highly reliable in operation.
摘要翻译：该固态成像装置包括与底板一体形成的肋。提供一种用于容纳固态成像装置的壳体，其可以抑制在成型时发生翘曲并且在安装时由于热而变形较小。即使当使用温度变化时，固态成像装置也不太可能引起读出错误等，并且在操作中是高度可靠的。

8. 发明授权

US07396704B2 Lid made of resin for case for accommodating solid-state imaging device and solid-state imaging apparatus 失效
标题翻译：用于容纳固态成像装置和固态成像装置的壳体的树脂盖
公开(公告)号：US07396704B2
公开(公告)日：2008-07-08
申请号：US11276089
申请日：2006-02-14
申请人： Mitsuo Maeda , Tomohiro Sato , Shigehide Yoshida
发明人： Mitsuo Maeda , Tomohiro Sato , Shigehide Yoshida
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/00 , H01L23/12 , H01L31/0203 , G02B7/02
CPC分类号： B29C45/0025 , B29C45/2669 , B29C45/40 , B29L2031/445 , H01L27/14618 , H01L27/14683 , H01L2924/0002 , H01L2924/00
摘要： This method of manufacturing a lid made of a transparent resin comprises a step of introducing a resin into a cavity for molding a protrusion continuous with a cavity for molding a lid in a die; a step of forming a molded body including a lid and a protrusion continuous with the lid by solidifying the resin in the cavity for molding a lid and the cavity for molding a protrusion, respectively; a step of separating the molded body from the die by ejecting an ejector pin to the protrusion; and a step of separating the protrusion from the lid.
摘要翻译：这种制造由透明树脂制成的盖子的方法包括将树脂引入到用于模制与用于在模具中成型盖子的空腔连续的突起的模腔的模腔中的步骤; 通过将用于成型盖的空腔中的树脂固化并且分别形成突起的空腔来形成包括盖和与盖连续的突起的成型体的步骤; 通过将突出销弹出到所述突起而将模制体与模具分离的步骤; 以及从所述盖分离所述突起的步骤。

9. 发明申请

US20080021146A1 Thermal conductive resin composition 失效
标题翻译：导热树脂组合物
公开(公告)号：US20080021146A1
公开(公告)日：2008-01-24
申请号：US11878216
申请日：2007-07-23
申请人： Shintaro Komatsu , Mitsuo Maeda , Hiroshi Harada
发明人： Shintaro Komatsu , Mitsuo Maeda , Hiroshi Harada
IPC分类号： C08K3/22
CPC分类号： C08K3/22 , C08K7/08 , C08K2003/2227
摘要： A thermal-conductive resin composition which can provide an molded article excellent in thermal conductivity and/or mechanical strength is provided. The resin composition comprising a resin selected from a thermosetting resin and a thermoplastic resin; a granule having a number average particle diameter of 0.5 to 5 mm and comprising alumina fibers with a number average fiber diameter of 1 to 50 μm; and an alumina fine particle.
摘要翻译：提供一种能够提供导热性和/或机械强度优异的成型体的导热性树脂组合物。所述树脂组合物包含选自热固性树脂和热塑性树脂的树脂; 具有数均粒径为0.5〜5mm的包含数均纤维直径为1〜50μm的氧化铝纤维的颗粒; 和氧化铝微粒。

10. 发明授权

US5211762A Photoresponsive element utilizing a molecular heterojunction 失效
标题翻译：使用分子异构体的光电元件
公开(公告)号：US5211762A
公开(公告)日：1993-05-18
申请号：US500496
申请日：1990-03-28
申请人： Satoru Isoda , Satoshi Ueyama , Hiroaki Kawakubo , Mitsuo Maeda
发明人： Satoru Isoda , Satoshi Ueyama , Hiroaki Kawakubo , Mitsuo Maeda
IPC分类号： H01L51/42 , H01L27/30 , H01L31/10 , H01L51/00 , H01L51/30
CPC分类号： H01L51/0075 , B82Y10/00 , H01L27/307 , H01L51/0053 , H01L51/0072 , H01L51/0077 , H01L51/0086 , H01L51/0595 , H01L51/4206 , Y02E10/549
摘要： A photoresponsive element utilizing a molecular heterojunction includes a first redox material film, a second redox material film having a different redox potential from that of the first redox material film and disposed in contact with the first redox material film, a first electrode connected to the first redox material film, and a second electrode connected to the second redox material film. The photoresponsive element is photoconductive and photovoltaic.

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