专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4958001A Dicyclohexyl-3,4,3',4'-tetracarboxylic acid or dianhydride thereof and polyamide-acid and polyimide obtained therefrom 失效
标题翻译：二环己基-3,4,3'，4'-四羧酸或其二酐和由其获得的聚酰胺 - 酸和聚酰亚胺
公开(公告)号：US4958001A
公开(公告)日：1990-09-18
申请号：US252608
申请日：1988-10-03
申请人： Tohru Kikuchi , Toshiyuki Fujita , Takayuki Saito , Mitsumasa Kojima , Hidetaka Sato , Hiroshi Suzuki
发明人： Tohru Kikuchi , Toshiyuki Fujita , Takayuki Saito , Mitsumasa Kojima , Hidetaka Sato , Hiroshi Suzuki
IPC分类号： C07C61/12 , C08G73/10
CPC分类号： C08G73/1021 , C07C61/12 , C08G73/1028 , C08G73/106 , Y10T428/1018 , Y10T428/1023
摘要： A polyimide obtained from a polyamide-acid or polyamide-acid ester prepared by reacting dicyclohexyl-3,4,3', 4'-tetracarboxylic acid or dinanhydride with a diamine is excellent in transparency, heat resistance and mechanical properties, said polyimide being able to be obtained at a lower temperature, and particularly suitable for an orientation film used in a liquid crystal display device.

2. 发明授权

US5262277A Photosensitive resin composition and photosensitive element using the same 失效
标题翻译：感光树脂组合物和使用其的感光元件
公开(公告)号：US5262277A
公开(公告)日：1993-11-16
申请号：US824088
申请日：1992-01-22
申请人： Kuniaki Sato , Yasunori Kojima , Shigeo Tachiki , Tohru Kikuchi , Toshiaki Ishimaru , Nobuyuki Hayashi , Mitsumasa Kojima
发明人： Kuniaki Sato , Yasunori Kojima , Shigeo Tachiki , Tohru Kikuchi , Toshiaki Ishimaru , Nobuyuki Hayashi , Mitsumasa Kojima
IPC分类号： C08G69/42 , C08G73/10 , C08G77/54 , G03F7/038 , G03F7/075 , G03C1/725
CPC分类号： G03F7/0387 , C08G69/42 , C08G73/1039 , C08G73/106 , C08G77/54 , G03F7/0757
摘要： A photosensitive resin composition comprising (A) a polymer obtained by reacting an isocyanate compound having an ethylenic unsaturated group with a polymer which is a reaction product of a tetracarboxylic acid dianhydride and a diamine, and (B) a photoinitiator, can provide a thick film excellent in heat resistant, adhesiveness, flexibility, electrical and mechanical properties, and is particularly suitable for producing a photosensitive element.
摘要翻译：一种光敏树脂组合物，其包含（A）通过使具有烯属不饱和基团的异氰酸酯化合物与作为四羧酸二酐与二胺的反应产物的聚合物与（B）光引发剂反应而得到的聚合物，可以提供厚膜耐热性，粘合性，柔韧性，电气和机械性能优异，特别适用于制造光敏元件。

3. 发明授权

US4847358A Process for producing polyamide acid having siloxane bonds and polyimide having siloxane bonds and isoindoloquinazolinedione rings 失效
标题翻译：具有硅氧烷键的聚酰胺酸的制造方法和具有硅氧烷键和异吲哚喹啉二酮环的聚酰亚胺的制造方法
公开(公告)号：US4847358A
公开(公告)日：1989-07-11
申请号：US86892
申请日：1987-08-18
申请人： Mitsumasa Kojima , Takayuki Saito , Toul Kikuchi , Shun-ichiro Uchimura , Hidetaka Satou , Daisuke Makino
发明人： Mitsumasa Kojima , Takayuki Saito , Toul Kikuchi , Shun-ichiro Uchimura , Hidetaka Satou , Daisuke Makino
IPC分类号： C08G73/10
CPC分类号： C08G73/106
摘要： There are disclosed a process for producing a polyamide acid having at least one siloxane bond, which comprises carrying out the reaction of:(a) a tetracarboxylic dianhydride having at least one siloxane bond of the formula: ##STR1## wherein R represents a monovalent hydrocarbon group and m is an integer of 1 or more;(b) a diamine; and(c) a diaminoamide compound of the formula (II): ##STR2## wherein Ar represents an aromatic residue, Y represents SO.sub.2 or CO, and one amino group and Y--YNH.sub.2 are positioned in ortho-position to each other,and optinal presence of(d) an aromatic tetracarboxylic dianhydride;with the total amount of the diamine and the diaminoamide compound and the total amount of the tetracarboxylic dianhydride of the formula (I) and the aromatic tetracarboxylic dianhydride optionally contained being substantially equal moles;and a process for producing a polyimide having at least one siloxane bond and at least one isoindoloquinazolinedione ring, which comprises further heating the resulting polyamide acid to dehydration ring closure.
摘要翻译：公开了一种制备具有至少一个硅氧烷键的聚酰胺酸的方法，该方法包括进行以下反应：（a）具有至少一个具有下式的硅氧烷键的四羧酸二酐：其中R表示一价烃基，m为1以上的整数，（b）二胺; 和（c）式（II）的二氨基酰胺化合物：其中Ar表示芳族残基，Y表示SO 2或CO，一个氨基和Y-YNH 2彼此相邻位置，和（d）芳族四羧酸二酐的选择性存在; 二胺和二氨基酰胺化合物的总量和式（I）的四羧酸二酐和任选地含有的芳族四羧酸二酐的总量基本相等; 以及生产具有至少一个硅氧烷键和至少一个异吲哚喹啉二酮环的聚酰亚胺的方法，其包括进一步将所得聚酰胺酸加热至脱水闭环。

4. 发明授权

US5811218A Photoinitiator compositions including amino acids, coumarin and titanocene and photosensitive materials using the same 失效
标题翻译：光引发剂组合物包括氨基酸，香豆素和二茂钛，以及使用其的感光材料
公开(公告)号：US5811218A
公开(公告)日：1998-09-22
申请号：US503274
申请日：1995-07-17
申请人： Makoto Kaji , Yasunori Kojima , Shigeki Katogi , Masataka Nunomura , Hideo Hagiwara , Dai Kawasaki , Mitsumasa Kojima , Hiroshi Suzuki , Hidetaka Satou
发明人： Makoto Kaji , Yasunori Kojima , Shigeki Katogi , Masataka Nunomura , Hideo Hagiwara , Dai Kawasaki , Mitsumasa Kojima , Hiroshi Suzuki , Hidetaka Satou
IPC分类号： G03F7/029 , G03F7/031 , G03F7/037 , G03C1/735 , C08F2/50
CPC分类号： G03F7/031 , G03F7/029 , G03F7/037 , Y10S430/12 , Y10S430/122 , Y10S430/125 , Y10S430/126 , Y10S430/127
摘要： An N-aryl-.alpha.-amino acid (I), which is a novel compound, is effective as a photoinitiator. The photoinitiator composition including this photoinitiator is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation. Further, a photoinitiator composition (A) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and/or an azabenzalcyclohexanone (III), or a photoinitiator composition (B) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and a titanocene (IV), or a photoinitiator composition (C) comprising a 3-substituted coumarin (II), a titanocene (IV) and an oxime ester (V), is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation.
摘要翻译：作为新型化合物的N-芳基-α-氨基酸（I）作为光引发剂是有效的。包含该光引发剂的光引发剂组合物对于改善含有聚（酰胺酸）的感光材料和用于图案形成的加成聚合性化合物的感光性能是有效的。此外，包含N-芳基-α-氨基酸（I）或（I'），3-取代香豆素（II）和/或氮杂苯并环己酮（III）的光引发剂组合物（A）或光引发剂组合物）包含N-芳基-α-氨基酸（I）或（I'），3-取代香豆素（II）和二茂钛（IV）或包含3-取代香豆素（II）的光引发剂组合物（C）），二茂钛（IV）和肟酯（V））对于改善含有聚（酰胺酸）的感光材料和用于图案形成的加成聚合性化合物的感光性能是有效的。

5. 发明授权

US6143475A Polyimide precursor, polyimide and their use 失效
标题翻译：聚酰亚胺前体，聚酰亚胺及其用途
公开(公告)号：US6143475A
公开(公告)日：2000-11-07
申请号：US83056
申请日：1998-05-22
申请人： Hideo Hagiwara , Yasunori Kojima , Makoto Kaji , Mitsumasa Kojima , Haruhiko Kikkawa
发明人： Hideo Hagiwara , Yasunori Kojima , Makoto Kaji , Mitsumasa Kojima , Haruhiko Kikkawa
IPC分类号： C08G73/10 , G03F7/037 , G03F7/038 , H05K1/00 , G03F7/36 , G03F7/012
CPC分类号： G03F7/037 , C08G73/10 , C08G73/1053 , C08G73/1082 , G03F7/0387 , H05K3/4676
摘要： A polyimide precursor having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
摘要翻译：一种具有下式重复单元的聚酰亚胺前体：其中R1是四价有机基团; R2是二价二苯基，图像形成优异，特别适合于使用i线步进机形成图案，并且通过赋予聚酰亚胺前体光敏性得到感光性树脂组合物，所述感光性树脂组合物适于形成表面用于半导体器件的保护膜或用于多层布线板的层间绝缘膜。

6. 发明授权

US4565767A Light-sensitive polymer composition with poly(amic acid), bisazide, and tertiary amine compound 失效
标题翻译：具有聚（酰胺酸），双叠氮化物和叔胺化合物的光敏聚合物组合物
公开(公告)号：US4565767A
公开(公告)日：1986-01-21
申请号：US603451
申请日：1984-04-24
申请人： Fumio Kataoka , Fusaji Shoji , Isao Obara , Issei Takemoto , Hitoshi Yokono , Tokio Isogai , Mitsumasa Kojima
发明人： Fumio Kataoka , Fusaji Shoji , Isao Obara , Issei Takemoto , Hitoshi Yokono , Tokio Isogai , Mitsumasa Kojima
IPC分类号： C08F290/00 , C08F299/00 , C08G73/00 , C08G73/02 , C08G73/10 , C08L79/08 , G03F7/012 , G03F7/038 , G03F7/26 , H01L21/312 , H01L21/47 , G03C1/71
CPC分类号： C08L79/08 , G03F7/0125 , Y10S430/12 , Y10S430/128
摘要： A light-sensitive polymer composition comprising a poly(amic acid), a special bisazide compound and an amine compound can give a film which has high sensitivity and in which portions exposed to light are not easily released by a developing solution at the time of development.
摘要翻译：包含聚（酰胺酸），特殊双叠氮化合物和胺化合物的光敏聚合物组合物可以产生具有高灵敏度的膜，并且其中暴露于光的部分在显影时不容易被显影溶液释放。

7. 发明授权

US06309791B1 Polyimide precursor, polyimide and their use 有权
标题翻译：聚酰亚胺前体，聚酰亚胺及其用途
公开(公告)号：US06309791B1
公开(公告)日：2001-10-30
申请号：US09634582
申请日：2000-08-08
申请人： Hideo Hagiwara , Yasunori Kojima , Makoto Kaji , Mitsumasa Kojima , Haruhiko Kikkawa
发明人： Hideo Hagiwara , Yasunori Kojima , Makoto Kaji , Mitsumasa Kojima , Haruhiko Kikkawa
IPC分类号： G03F7075
CPC分类号： G03F7/037 , C08G73/10 , C08G73/1053 , C08G73/1082 , G03F7/0387 , H05K3/4676
摘要： A polyimide precursor having repeating units of the formula: wherein R1 is a tetravalent organic group; and R2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
摘要翻译：一种具有下式重复单元的聚酰亚胺前体：其中R1是四价有机基团; R2是二价二苯基，图像形成优异，特别适合于使用i线步进机形成图案，并且通过赋予聚酰亚胺前体光敏性得到感光性树脂组合物，所述感光性树脂组合物适于形成表面用于半导体器件的保护膜或用于多层布线板的层间绝缘膜。

8. 发明授权

US6071667A Photosensitive resin composition containing a photosensitive polyamide resin 失效
标题翻译：含有感光性聚酰胺树脂的感光性树脂组合物
公开(公告)号：US6071667A
公开(公告)日：2000-06-06
申请号：US630478
申请日：1996-04-10
申请人： Hideo Hagiwara , Yasunori Kojima , Makoto Kaji , Mitsumasa Kojima , Haruhiko Kikkawa
发明人： Hideo Hagiwara , Yasunori Kojima , Makoto Kaji , Mitsumasa Kojima , Haruhiko Kikkawa
IPC分类号： C08G73/10 , G03F7/037 , G03F7/038 , H05K1/00 , G03F7/012
CPC分类号： G03F7/037 , C08G73/10 , C08G73/1053 , C08G73/1082 , G03F7/0387 , H05K3/4676
摘要： A polyimide precursor having repeating units of the formula: wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
摘要翻译：一种具有下式重复单元的聚酰亚胺前体：其中R1是四价有机基团; R2是二价二苯基，图像形成优异，特别适合于使用i线步进机形成图案，并且通过赋予聚酰亚胺前体光敏性得到感光性树脂组合物，所述感光性树脂组合物适于形成表面用于半导体器件的保护膜或用于多层布线板的层间绝缘膜。

9. 发明申请

US20090020588A1 Method for manufacturing product involving solder joining, solder joining apparatus, soldering condition verification method, reflow apparatus, and solder joining method 审中-公开
标题翻译：用于制造涉及焊料接合的产品的方法，焊料接合装置，焊接条件验证方法，回流装置和焊接方法
公开(公告)号：US20090020588A1
公开(公告)日：2009-01-22
申请号：US12232386
申请日：2008-09-16
申请人： Osamu Saito , Rie Takada , Mitsumasa Kojima , Tetsuji Ishikawa
发明人： Osamu Saito , Rie Takada , Mitsumasa Kojima , Tetsuji Ishikawa
IPC分类号： B23K31/12
CPC分类号： B23K1/0008 , B23K1/008 , B23K2101/42 , H05K3/3494
摘要： A method for manufacturing a product involving solder joining wherein components placed on a board on which the components are to be mounted are solder-joined to the board by subjecting the board to reflow heating under prescribed heating conditions, the method comprising: calculating, at each designated site on the board, a component volume that is occupied by the components mounted within a given area; determining the heating conditions in accordance with the calculated component volume; and performing the reflow heating based on the determined heating conditions.
摘要翻译：一种用于制造涉及焊料接合的产品的方法，其中通过在规定的加热条件下对板进行回流加热，将放置在其上将要安装部件的板上的部件焊接到板上，该方法包括：在每个在板上的指定位置，被安装在给定区域内的部件所占据的部件容积; 根据所计算的部件容积确定加热条件; 以及基于所确定的加热条件执行回流加热。

10. 发明授权

US5115089A Processes for preparation of polyimide-isoindroquinazolinedione and precursor thereof 失效
标题翻译：聚酰胺 - 环糊精溶液的制备方法及其前体
公开(公告)号：US5115089A
公开(公告)日：1992-05-19
申请号：US245157
申请日：1988-09-16
申请人： Masatoshi Yoshida , Katsuji Shibata , Mitsumasa Kojima , Hidetaka Satou , Toshihiko Kato , Yasuo Miyadera , Masami Yusa
发明人： Masatoshi Yoshida , Katsuji Shibata , Mitsumasa Kojima , Hidetaka Satou , Toshihiko Kato , Yasuo Miyadera , Masami Yusa
IPC分类号： C08G73/06 , C08G73/10
CPC分类号： C08G73/06 , C08G73/0677 , C08G73/1007 , C08G73/1042 , C08G73/1053 , C08G73/1064 , C08G73/1085
摘要： Disclosed herein are processes for the preparation of polyimide-isoindroquinazolinediones and precursor thereof. These polymers are useful as heat-resistant electric insulation materials, surface coating films for electronic instrument parts and especially suitable for manufacturing a photoresist. The above precursor is produced by reacting a an alkylenebistrimellitate dianhydride, a diaminoamide compound and the other amine. The precursor is readily dehydrated and ring-closed to produce polyimide-isoindroquinazolinedione, which is often conveniently conducted by producing a varnish of the precursor, applying it onto adequate substrates such as silicon wafers, glass plates, metal plates, etc. and then subjecting the coated film to dehydration. The resulting films have excellent physical properties such as good adherence, high tensile strength, low elasticity, etc.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式