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1. 发明授权

US4565767A Light-sensitive polymer composition with poly(amic acid), bisazide, and tertiary amine compound 失效
标题翻译：具有聚（酰胺酸），双叠氮化物和叔胺化合物的光敏聚合物组合物
公开(公告)号：US4565767A
公开(公告)日：1986-01-21
申请号：US603451
申请日：1984-04-24
申请人： Fumio Kataoka , Fusaji Shoji , Isao Obara , Issei Takemoto , Hitoshi Yokono , Tokio Isogai , Mitsumasa Kojima
发明人： Fumio Kataoka , Fusaji Shoji , Isao Obara , Issei Takemoto , Hitoshi Yokono , Tokio Isogai , Mitsumasa Kojima
IPC分类号： C08F290/00 , C08F299/00 , C08G73/00 , C08G73/02 , C08G73/10 , C08L79/08 , G03F7/012 , G03F7/038 , G03F7/26 , H01L21/312 , H01L21/47 , G03C1/71
CPC分类号： C08L79/08 , G03F7/0125 , Y10S430/12 , Y10S430/128
摘要： A light-sensitive polymer composition comprising a poly(amic acid), a special bisazide compound and an amine compound can give a film which has high sensitivity and in which portions exposed to light are not easily released by a developing solution at the time of development.
摘要翻译：包含聚（酰胺酸），特殊双叠氮化合物和胺化合物的光敏聚合物组合物可以产生具有高灵敏度的膜，并且其中暴露于光的部分在显影时不容易被显影溶液释放。

2. 发明授权

US4451551A Radiation-sensitive poly(amic acid) polymer composition 失效
标题翻译：辐射敏感聚（酰胺酸）聚合物组合物
公开(公告)号：US4451551A
公开(公告)日：1984-05-29
申请号：US331875
申请日：1981-12-17
申请人： Fumio Kataoka , Fusaji Shoji , Isao Obara , Hitoshi Yokono , Tokio Isogai , Mitumasa Kojima
发明人： Fumio Kataoka , Fusaji Shoji , Isao Obara , Hitoshi Yokono , Tokio Isogai , Mitumasa Kojima
IPC分类号： C08K5/00 , C08L79/08 , G03F7/008 , G03F7/038 , G03C1/68
CPC分类号： G03F7/0387 , C08K5/0041 , C08L79/08 , G03F7/008 , Y10S430/12 , Y10S430/121 , Y10S522/904
摘要： A light- or radiation-sensitive polymer composition comprising (a) a poly(amic acid) having as a major component a repeating unit of the formula: ##STR1## (b) one or more light- or radiation-sensitive compounds having an amino group and an aromatic azide group or aromatic sulfonylazide group in one molecule, and if necessary (c) one or more photosensitizers and/or amine compounds having at least one unsaturated bonding, and/or (d) one or more compounds having at least two unsaturated bonding in one molecule, is highly sensitive to light and radiation and can give a precise relief pattern on a substrate. Further, a finally obtained polyimide film is excellent in heat resistance.
摘要翻译：一种光或辐射敏感性聚合物组合物，其包含（a）作为主要组分的具有下式的重复单元的聚（酰胺酸）：（b）一种或多种具有氨基的光或辐射敏感性化合物（c）一种或多种具有至少一个不饱和键的光敏剂和/或胺化合物，和/或（d）一种或多种具有至少两个不饱和键的化合物，在一个分子中的不饱和键，对光和辐射具有高度敏感性，并且可以在基底上给出精确的浮雕图案。此外，最终得到的聚酰亚胺膜的耐热性优异。

3. 发明授权

US4736012A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US4736012A
公开(公告)日：1988-04-05
申请号：US625968
申请日：1984-06-29
申请人： Fusaji Shoji , Akihiro Kenmotsu , Isao Obara , Hitoshi Yokono , Takeshi Komaru
发明人： Fusaji Shoji , Akihiro Kenmotsu , Isao Obara , Hitoshi Yokono , Takeshi Komaru
IPC分类号： C08G73/00 , C08G73/10 , H01L23/06 , H01L23/29 , H01L23/31 , H01L23/556 , C08G69/26
CPC分类号： H01L23/3171 , H01L23/293 , H01L23/556 , H01L2224/45144 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/3025
摘要： A semiconductor device containing an .alpha.-rays shielding resin layer on at least active portion of a semiconductor element, said .alpha.-rays shielding resin being a special polyimide resin, is excellent in thermal resistance at the time of sealing the semiconductor element, adhesion of the .alpha.-rays shielding layer to the semiconductor element, and .alpha.-rays shielding ability.
摘要翻译：一种在半导体元件的至少有效部分上含有α-阵列屏蔽树脂层的半导体器件，所述α-阵列屏蔽树脂是特殊的聚酰亚胺树脂，其密封半导体元件时的耐热性优异，半导体元件的α-阵列屏蔽层和α射线屏蔽能力。

4. 发明授权

US6087006A Surface-protecting film and resin-sealed semiconductor device having said film 失效
标题翻译：具有所述膜的表面保护膜和树脂密封的半导体器件
公开(公告)号：US6087006A
公开(公告)日：2000-07-11
申请号：US517613
申请日：1995-08-22
申请人： Jun Tanaka , Fumio Kataoka , Haruhiko Kikkawa , Isao Obara , Keiko Isoda
发明人： Jun Tanaka , Fumio Kataoka , Haruhiko Kikkawa , Isao Obara , Keiko Isoda
IPC分类号： C08G73/10 , H01L23/31 , H01L23/495 , B32B9/00 , H01L23/00 , B29C13/00
CPC分类号： H01L23/3171 , C08G73/10 , H01L23/4951 , H01L2224/274 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/92147 , H01L24/45 , H01L24/48 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01039 , H01L2924/01046 , H01L2924/01077 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , Y10S428/901 , Y10T428/31504 , Y10T428/31721
摘要： A surface-protecting film is formed on the surface of the semiconductor element of a resin-sealed semiconductor device to prevent the peeling and cracking of the sealing member used in said device, by coating on said surface a polyimide precursor composition containing a polyimide precursor having a recurring unit constitution represented by the following general formula (1) and heat-curing the coated polyimide precursor composition: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic group; R.sup.2 and R.sup.3 are each a tetravalent organic group having 4 or more carbon atoms; R.sup.4 is a bivalent organic group having 4 or more carbon atoms; X is a bivalent organic group containing at least one member selected from the group consisting of oxygen and nitrogen: Y is a monovalent organic group having 15 or less carbon atoms; n=5-100 and m=0-95 with a proviso that n+m=100; and p is 1 or 2).
摘要翻译：在树脂密封半导体装置的半导体元件的表面上形成表面保护膜，以防止在所述装置中使用的密封构件的剥离和破裂，通过在所述表面上涂覆含有聚酰亚胺前体的聚酰亚胺前体组合物，由下述通式（1）表示的重复单元结构和热固化涂覆的聚酰亚胺前体组合物：其中R1是三价或四价芳族基团; R2和R3各自为具有4个或更多个碳原子的四价有机基团; R4是碳原子数为4以上的二价有机基团， X是含有选自氧和氮的至少一种的二价有机基团：Y是碳原子数为15以下的一价有机基团; n = 5-100和m = 0-95，条件是n + m = 100; p为1或2）。

5. 发明授权

US06200831B1 Surface-protecting film and resin-sealed semiconductor device having said film 有权
标题翻译：具有所述膜的表面保护膜和树脂密封的半导体器件
公开(公告)号：US06200831B1
公开(公告)日：2001-03-13
申请号：US09528439
申请日：2000-03-17
申请人： Jun Tanaka , Fumio Kataoka , Haruhiko Kikkawa , Isao Obara , Keiko Isoda
发明人： Jun Tanaka , Fumio Kataoka , Haruhiko Kikkawa , Isao Obara , Keiko Isoda
IPC分类号： H01L2144
CPC分类号： H01L23/3171 , C08G73/10 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L2224/274 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/92147 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01039 , H01L2924/01046 , H01L2924/01077 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , Y10S428/901 , Y10T428/31504 , Y10T428/31721 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A surface-protecting film is formed on the surface of the semiconductor element of a resin-sealed semiconductor device to prevent the peeling and cracking of the sealing member used in said device, by coating on said surface a polyimide precursor composition containing a polyimide precursor having a recurring unit constitution represented by the following general formula (1) and heat-curing the coated polyimide precursor composition: wherein R1 is a trivalent or tetravalent aromatic group; R2 and R3 are each a tetravalent organic group having 4 or more carbon atoms; R4 is a bivalent organic group having 4 or more carbon atoms; X is a bivalent organic group containing at least one member selected from the group consisting of oxygen and nitrogen: Y is a monovalent organic group having 15 or less carbon atoms; n=5-100 and m=0-95 with a proviso that n+m=100; and p is 1 or 2).
摘要翻译：在树脂密封半导体装置的半导体元件的表面上形成表面保护膜，以防止在所述装置中使用的密封构件的剥离和破裂，通过在所述表面上涂覆含有聚酰亚胺前体的聚酰亚胺前体组合物，由下述通式（1）表示的重复单元结构和热固化涂覆的聚酰亚胺前体组合物：其中R1是三价或四价芳族基团; R2和R3各自为具有4个或更多个碳原子的四价有机基团; R4是碳原子数为4以上的二价有机基团， X是含有选自氧和氮的至少一种的二价有机基团：Y是碳原子数为15以下的一价有机基团; n = 5-100和m = 0-95，条件是n + m = 100; p为1或2）。

6. 发明授权

US4041144A Process for preparing stannic oxide hydrate 失效
标题翻译：制备氧化锡水合物的方法
公开(公告)号：US4041144A
公开(公告)日：1977-08-09
申请号：US575228
申请日：1975-05-07
申请人： Isao Obara , Kazuo Yagami
发明人： Isao Obara , Kazuo Yagami
IPC分类号： C08K3/00 , C01G19/00 , C01G19/02 , C08K3/16 , C08K3/20 , C08K3/22 , C08L77/00 , C09K21/02
CPC分类号： C01G19/02 , C08K3/22
摘要： A flame resisting agent to be incorporated into an aqueous spinning dope containing chlorine-containing polymer as a main polymer ingredient for improving the flame resistant property of the fiber spun from the spinning dope which includes a stannic oxide hydrate being substantially amorphous with respect to X-ray diffraction and having a bound water in the range of about 0.5 to about 0.7 mole of H.sub.2 O per 1 mole of SnO.sub.2. The flame resisting agent has a superior dispersibility in an aqueous spinning dope containing chlorine-containing polymer as a main polymer ingredient and the aqueous spinning dope in which the flame resisting agent is incorporated has a superior stability, filtering property and spinning property to give a uniform quality of fibers having a durable, superior flame resistant property.
摘要翻译：含有含氯聚合物作为主要聚合物成分的水性纺丝原液的阻燃剂，用于提高由纺丝原液纺丝的纤维的阻燃性，其包括相对于X射线的基本上无定形的氧化锡水合物，并且每1摩尔SnO 2具有约0.5至约0.7摩尔H 2 O的结合水。阻燃剂在含有含氯聚合物作为主要聚合物成分的水性纺丝原液中具有优异的分散性，并且其中引入阻燃剂的水性纺丝原液具有优异的稳定性，过滤性能和纺丝性能，使其均匀纤维的质量具有耐用，优异的阻燃性能。

7. 发明授权

US4239944A Spider of loudspeaker 失效
标题翻译：扬声器蜘蛛
公开(公告)号：US4239944A
公开(公告)日：1980-12-16
申请号：US5247
申请日：1979-01-22
申请人： Isao Obara , Atsuya Kamada , Aizo Kaneda
发明人： Isao Obara , Atsuya Kamada , Aizo Kaneda
IPC分类号： H04R9/02 , H04R7/16 , H04R9/00 , H04R9/06
CPC分类号： H04R9/00 , H04R7/16
摘要： A spider of loudspeaker having a base material in the form of a plain-woven fabric of warps and wefts each of which constituted by fibers of an inorganic material. The warps and wefts are coated with a thermosetting resin which in turn is coated with a thermoplastic resin. The spider thus formed is less liable to absorb the ambient moisture and, therefore, is free from distortion.
摘要翻译：一种扬声器的蜘蛛，其具有由无机材料的纤维构成的经纱和纬纱的平纹织物形式的基材。经纱和纬纱涂有热固性树脂，热固性树脂又用热塑性树脂涂覆。这样形成的蜘蛛不易吸收周围的水分，因此没有变形。

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