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1. 发明申请

US20180039176A1 COLORED RESIN COMPOSITION, COLORED FILM, DECORATIVE SUBSTRATE AND TOUCH PANEL 审中-公开
公开(公告)号：US20180039176A1
公开(公告)日：2018-02-08
申请号：US15715985
申请日：2017-09-26
申请人： TORAY INDUSTRIES, INC.
发明人： Yoshihiko Inoue , Ryosuke Aihara
IPC分类号： G03F7/038 , G03F7/00 , G03F7/004 , G03F7/16 , G03F7/20 , H01L27/32 , G03F7/40 , G03F7/037 , G03F7/028 , H01L51/00 , G06F3/044 , C08G73/10 , G03F7/32
CPC分类号： G03F7/0387 , C08G73/1039 , C08G73/1042 , C08G73/1046 , C08G73/1053 , C08G73/106 , C08G73/1082 , C08L79/08 , C08L101/02 , C09D7/40 , C09D179/08 , G03F7/0007 , G03F7/0046 , G03F7/0048 , G03F7/028 , G03F7/037 , G03F7/162 , G03F7/168 , G03F7/2004 , G03F7/322 , G03F7/40 , G06F3/044 , H01L27/3258 , H01L27/3272 , H01L51/0035 , H01L51/5284
摘要： A colored resin composition is disclosed including a polyimide resin having a specified structure to achieve remarkable heat resistance and enabling the formation of a colored film which is excellent in reliability because a coloring material is highly dispersed and stabilized therein. A colored resin composition is disclosed including (A) an alkali-soluble polyimide resin having a structural unit containing a phenolic hydroxyl group, a sulfonic acid group or a thiol group, (B) a coloring material, (C) a polymeric dispersant, and (D) an organic solvent. A patterned colored layer obtained from the composition of the present invention is useful for a decorative substrate, a touch panel, an organic EL display device and the like.

2. 发明授权

US09873767B2 Polyimide resin 有权
公开(公告)号：US09873767B2
公开(公告)日：2018-01-23
申请号：US15321762
申请日：2016-03-10
申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
发明人： Yuuki Sato
IPC分类号： C08G73/10 , C08J5/18
CPC分类号： C08G73/1082 , C08G73/1042 , C08J5/18 , C08J2379/08
摘要： A polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being 20 mol % or more and less than 40 mol %, and the polyimide resin satisfying predetermined conditions:wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.

3. 发明授权

US09856399B2 Polyamic acid, varnish containing same, and polyimide film 有权
公开(公告)号：US09856399B2
公开(公告)日：2018-01-02
申请号：US14781931
申请日：2014-04-01
申请人： Mitsui Chemicals, Inc.
发明人： Kenichi Fukukawa , Masaki Okazaki , Yoshihiro Sakata , Tatsuhiro Urakami , Atsushi Okubo
IPC分类号： C08G73/10 , C09D179/08 , C08G73/14 , B29C37/00 , B29C41/02 , B29C41/46 , C08J5/18 , B29K79/00 , B29L7/00 , B29L31/34
CPC分类号： C09D179/08 , B29C37/0025 , B29C41/02 , B29C41/46 , B29K2079/08 , B29K2995/0018 , B29K2995/0097 , B29L2007/008 , B29L2031/3475 , C08G73/1064 , C08G73/1071 , C08G73/1078 , C08G73/1082 , C08G73/14 , C08J5/18 , C08J2379/08
摘要： The present invention addresses the problem of providing a high-transparency polyimide film in which the thickness-direction phase difference Rth is kept within a predetermined range. The present invention also addresses the problem of providing a polyamic acid and a varnish used to obtain the polyimide film. In order to overcome the aforementioned problem, the present invention is a polyimide film containing a polyimide obtained by bringing about a reaction between a tetracarboxylic dianhydride and a diamine, the polyimide film having (a) a thickness-direction phase difference Rth of −5 to 100 nm per 10 μm of thickness, (b) a transmittance of 80% or more with respect to light having a wavelength of 400 nm, (c) a haze of 3% or less, and (d) a glass transition point of 250° C. or higher.

4. 发明申请

US20170334837A1 DIAMINE COMPOUND, AND HEAT-RESISTANT RESIN OR HEAT-RESISTANT RESIN PRECURSOR USING SAME 审中-公开
公开(公告)号：US20170334837A1
公开(公告)日：2017-11-23
申请号：US15670447
申请日：2017-08-07
申请人： TORAY INDUSTRIES, INC.
发明人： Yusuke KOMORI , Satoshi KAMEMOTO , Kazuto MIYOSHI
IPC分类号： C07C235/64 , C08G73/14 , H01L51/00 , G03F7/40 , G03F7/32 , C08G69/42 , G03F7/037 , G03F7/031 , G03F7/023 , G03F7/004 , G03F7/039 , G03F7/20 , H01L27/32
CPC分类号： C07C235/64 , C07C233/80 , C08G69/32 , C08G69/42 , C08G73/1039 , C08G73/1042 , C08G73/1053 , C08G73/106 , C08G73/1082 , C08G73/14 , C08G73/18 , C08G73/22 , C08G75/32 , C09D177/10 , C09D179/04 , C09D179/08 , G03F7/0048 , G03F7/0233 , G03F7/0236 , G03F7/031 , G03F7/037 , G03F7/038 , G03F7/039 , G03F7/2004 , G03F7/322 , G03F7/40 , H01L27/3258 , H01L51/0035 , H01L2227/323 , C08K5/136
摘要： Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

5. 发明申请

US20170309971A1 ELECTRODE FOR LITHIUM BATTERY, LITHIUM BATTERY AND PASTE FOR ELECTROCHEMICAL CELL 审中-公开
公开(公告)号：US20170309971A1
公开(公告)日：2017-10-26
申请号：US15515727
申请日：2015-09-30
申请人： Mitsui Chemicals, Inc.
发明人： Han ZHANG , Ayumi KOISO , Akihito SHIGEMATSU , Yu IIMURO , Keita NAGAKAWA , Mitsuaki CHIDA , Takaomi HAYASHI , Hitoshi ONISHI , Masataka MIYASATO , Satoko FUJIYAMA
IPC分类号： H01M10/42 , C08L9/08 , H01M10/0569 , H01M10/0568 , C08L27/16 , H01M4/62 , C08G73/10 , H01M4/525 , H01M4/505 , H01M4/587 , H01M10/0525
CPC分类号： H01M10/4235 , C08G73/1082 , C08L9/08 , C08L27/16 , C08L2203/20 , H01M4/13 , H01M4/505 , H01M4/525 , H01M4/587 , H01M4/62 , H01M4/625 , H01M10/0525 , H01M10/0568 , H01M10/0569 , H01M2300/0037
摘要： An electrode for a lithium battery, containing a current collector (A) and a mixture layer (B) contacting the current collector (A) and including an active material (a), an organic solvent binder (b), a conduction assistant (c) comprising carbon black in which an average particle diameter of a primary particle is 1 μm or less, and a nitrogen-containing polymer (d).

6. 发明授权

US09752030B2 Polyamic acid and polyimide, processes for the production of same, compositions containing same, and uses thereof 有权
公开(公告)号：US09752030B2
公开(公告)日：2017-09-05
申请号：US13203343
申请日：2010-02-26
申请人： Kenichi Fukukawa , Masaki Okazaki , Yoshihiro Sakata , Ichiro Fujio , Wataru Yamashita
发明人： Kenichi Fukukawa , Masaki Okazaki , Yoshihiro Sakata , Ichiro Fujio , Wataru Yamashita
IPC分类号： C08L79/08 , B32B15/08 , B32B15/20 , B32B27/34 , B32B27/36 , C09D179/08 , C08G73/10 , H05K1/03
CPC分类号： C08L79/08 , B32B15/08 , B32B15/20 , B32B27/34 , B32B27/36 , C08G73/1082 , C09D179/08 , H05K1/0346 , Y10T428/31681
摘要： The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).

7. 发明授权

US09716026B2 Resin composition, cured film, laminated film, and method for manufacturing semiconductor device 有权
公开(公告)号：US09716026B2
公开(公告)日：2017-07-25
申请号：US14430361
申请日：2013-09-25
申请人： TORAY Industries, Inc.
发明人： Takuo Watanabe , Chungseon Lee
IPC分类号： B32B27/34 , C08G73/10 , C09J7/00 , H01L21/683 , C08K5/05 , C09J179/08 , C08G77/455 , C09J183/10 , B32B27/28 , H01L21/302 , C08L79/08
CPC分类号： H01L21/6836 , B32B27/281 , B32B27/34 , B32B2457/14 , C08G73/1042 , C08G73/106 , C08G73/1082 , C08G77/455 , C08K5/05 , C08L61/24 , C08L61/28 , C08L61/32 , C08L79/08 , C09J7/00 , C09J179/08 , C09J183/10 , C09J2203/10 , C09J2203/326 , C09J2479/08 , H01L21/302 , Y10T428/31663
摘要： [Problem] To provide a highly heat resistant resin composition which exhibits good tackiness at low temperatures less than or equal to 180° C., and whose production of a volatile portion due to decomposition or the like is small even at high temperatures greater than or equal to 250° C., and whose increase in adhesive force is small even after passage through a heat treatment step, and therefore which allows a base material to be easily peeled off at room temperature when the base material is to be peeled off, and a cured membrane and a laminate film that employ this resin composition.[Solution Means] A resin composition containing a polyimide-based resin and a methylol-based compound, the resin composition being characterized in that the polyimide-based resin has an acid dianhydride residue and a diamine residue, and has as the diamine residue at least a residue of a polysiloxane-based diamine represented by General formula (1) and a residue of an aromatic diamine having a hydroxyl group, and a cured product and a laminate film that employ this resin composition. (n is a natural number, and an average value thereof calculated from an average molecular weight of the polysiloxane-based diamine is in a range of 5 to 30. R1 and R2 may be individually the same or different, indicating an alkylene group or a phenylene group whose carbon number is 1 to 30. R3 to R6 may be individually the same or different, indicating an alkyl group, a phenyl group or a phenoxy group whose carbon number is 1 to 30.)

8. 发明授权

US09688881B1 Low-melt polyamic acid based powder coatings 有权
公开(公告)号：US09688881B1
公开(公告)日：2017-06-27
申请号：US14199975
申请日：2014-03-06
申请人： The United States of America as Represented by the Administrator of the National Aeronautics and Space Administration
发明人： Scott T. Jolley
IPC分类号： C09D179/08
CPC分类号： C09D179/08 , C08G73/1014 , C08G73/1053 , C08G73/1082 , C09D5/03 , C09D5/08 , C08L79/08 , C08K5/20 , C08L33/08 , C08L63/00
摘要： The present invention is directed to a method for powder coating a metal substrate using a low-melt polyamic acid (PAA) polymer that readily imidizes to polyimides. These low-melt PAAs have been shown to be useful in resins applied as powder coatings to metal surfaces. The resin includes an end-capping material capable of providing crosslinking functionality to at least one end of the low-melt PAA polymer. The end-capping material functions dually as a polymerization chain terminator and crosslinking agent, thus producing resins that have molecular weights low enough to flow well and form good cured films applicable for use in powder coating.

9. 发明授权

US09670320B2 Method for producing polyimide resin powder, and thermoplastic polyimide resin powder 有权
公开(公告)号：US09670320B2
公开(公告)日：2017-06-06
申请号：US14905637
申请日：2014-08-04
申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
发明人： Yuuki Sato , Jun Mitadera
IPC分类号： C08G75/00 , C08G73/10 , C09J179/08 , C08G63/00
CPC分类号： C08G73/1032 , C08G73/1028 , C08G73/1042 , C08G73/105 , C08G73/1082 , C09J179/08
摘要： The present invention provides a method for producing a polyimide resin powder, including the step of reacting (A) a tetracarboxylic acid component containing a tetracarboxylic dianhydride with (B) a diamine component containing an aliphatic diamine in the presence of (C) a solvent containing an alkylene glycol-based solvent represented by the formula (1): wherein Ra1 represents a hydrogen atom or an alkyl group having from 1 to 4 carbon atoms, Ra2 represents a linear alkylene group having from 2 to 6 carbon atoms, and n represents an integer of 1-3.

10. 发明申请

US20160369055A1 A QUICK RESPONSIVE, SHAPE MEMORY THERMOSET POLYIMIDE AND PREPARATION METHOD THEREOF 审中-公开
标题翻译：快速响应，形状记忆热固性聚酰亚胺及其制备方法
公开(公告)号：US20160369055A1
公开(公告)日：2016-12-22
申请号：US15110143
申请日：2015-01-07
申请人： HARBIN INSTITUTE OF TECHNOLOGY
发明人： Jingsong LENG , Xinli XIAO , Yanju LIU , Deyan KONG
IPC分类号： C08G73/10
CPC分类号： C08G73/1078 , C08G73/026 , C08G73/0273 , C08G73/101 , C08G73/1028 , C08G73/1042 , C08G73/1071 , C08G73/1082
摘要： A fast-response thermoplastic shape-memory polyimide and a preparation method thereof, related to a polyimide and a preparation method thereof. The present invention aims to solve the problem in high-temperature conditions of slow shape recovery poor stability, and poor mechanical properties of a shape-memory polymer prepared by utilizing an existing method. The structural formula of the polyamide of the present invention is as represented by formula (I). The preparation method is: 1. preparation of a diamine solution; 2. preparation of an anhydride-terminated high molecular weight polyamic acid; 3. preparation of a viscous sol-gel; and, 4. preparation of the thermoplastic shape-memory polyimide. The thermoplastic shape-memory polyimide prepared per the present invention is provided with a very fast shape recovery rate and improved shape-memory effect. The present invention is applicable in the field of polyimide preparation.
摘要翻译：一种快速反应热塑性形状记忆聚酰亚胺及其制备方法，涉及一种聚酰亚胺及其制备方法。本发明的目的是解决高温条件下的慢速形状恢复不稳定性以及通过利用现有方法制备的形状记忆聚合物的机械性能差的问题。本发明的聚酰胺的结构式如式（I）所示。制备方法是：1.制备二胺溶液; 2.制备酸酐封端的高分子量聚酰胺酸; 3.制备粘稠溶胶 - 凝胶; 和4.制备热塑性形状记忆聚酰亚胺。根据本发明制备的热塑性形状记忆聚酰亚胺具有非常快的形状恢复率和改善的形状记忆效应。本发明可应用于聚酰亚胺制备领域。

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