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1. 发明授权

US06777789B1 Mounting for a package containing a chip 失效
标题翻译：安装一个包含芯片的包装
公开(公告)号：US06777789B1
公开(公告)日：2004-08-17
申请号：US10340256
申请日：2003-01-10
申请人： Thomas P. Glenn , Steven Webster , Roy D. Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy D. Hollaway
IPC分类号： H01L23495
CPC分类号： H05K1/182 , H01L23/5389 , H01L24/45 , H01L24/48 , H01L2224/32145 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/73265 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, such as a leadframe or a laminate sheet, and input/output terminals. A chip is on a first side of the base and is electrically connected (directly or indirectly) to the input/output terminals. A cap, which may be a molded encapsulant, is provided on the first side of the base over the chip. The package is mounted on the substrate so that the cap is in the aperture, and a peripheral portion of the first side of the base is over the mounting surface so as to support the package in the aperture and allow the input/output terminals of the package to be juxtaposed with to the circuit patterns of the mounting surface. Because the cap is within the aperture, a height of the package above the mounting surface is minimized.
摘要翻译：公开了一种用于包含半导体芯片的封装的安装件，以及制造这种安装的方法。安装件包括具有其上具有导电迹线的安装表面的基板和延伸穿过基板的孔。该包装包括底座，例如引线框或层压板，以及输入/输出端子。芯片位于基座的第一侧，并与输入/输出端子电连接（直接或间接）。在芯片上的基座的第一侧上提供可以是模制密封剂的盖。封装被安装在基板上，使得帽位于孔中，并且基座的第一侧的周边部分在安装表面上方，以便将封装支撑在孔中，并且允许端子的输入/输出端子包装与安装表面的电路图案并列。因为盖在孔内，所以在安装表面上方的包装的高度被最小化。

2. 发明授权

US06686580B1 Image sensor package with reflector 有权
标题翻译：带反射镜的图像传感器封装
公开(公告)号：US06686580B1
公开(公告)日：2004-02-03
申请号：US09906992
申请日：2001-07-16
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： H01L2700
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L31/02325 , H01L2224/05553 , H01L2224/32225 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/15311 , H01L2924/3025 , H04N5/2253 , H04N5/2257 , H01L2924/00
摘要： An image sensor package includes a substrate and an image sensor coupled to the substrate. The image sensor includes an upper surface having an active area. A reflector lid is coupled to the substrate. The reflector lid has a first panel having a planar surface. The planar surface is at least partially reflective and is angled relative to the upper surface of the image sensor to reflect electromagnetic radiation to the active area of image sensor.
摘要翻译：图像传感器封装包括衬底和耦合到衬底的图像传感器。图像传感器包括具有有效区域的上表面。反射器盖连接到基板。反射器盖具有具有平坦表面的第一面板。平坦表面至少部分地是反射性的并且相对于图像传感器的上表面成角度，以将电磁辐射反射到图像传感器的有效区域。

3. 发明授权

US06684496B2 Method of making an integrated circuit package 有权
标题翻译：制造集成电路封装的方法
公开(公告)号：US06684496B2
公开(公告)日：2004-02-03
申请号：US10007337
申请日：2001-10-22
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H05K320
CPC分类号： H01L23/49503 , H01L21/4842 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01037 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49171 , Y10T428/24207 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.
摘要翻译：制造包装的方法包括提供具有矩形框架中的管芯焊盘的金属引线框架。标签从框架向模片垫延伸。管芯焊盘和突片具有侧表面，其具有凹入部分和凹凸。芯片贴在裸片上。模具电连接到突片。将密封剂施加到引线框架的上表面和侧表面。最后，将引线框架原位切割，使得芯片焊盘和突片从框架上切断，形成封装的侧面，并将封装与引线框架切断。

4. 发明授权

US06657298B1 Integrated circuit chip package having an internal lead 失效
标题翻译：具有内部引线的集成电路芯片封装
公开(公告)号：US06657298B1
公开(公告)日：2003-12-02
申请号：US09909160
申请日：2001-07-18
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L2304
CPC分类号： H01L23/49575 , H01L21/565 , H01L23/3107 , H01L23/495 , H01L23/49548 , H01L24/31 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19107 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A package for an integrated circuit chip is disclosed, along with structures and methods for making and mounting the package. An exemplary embodiment of the package includes a molded body having leads embedded therein with an aperture adjacent each of the leads. A portion of each lead that is internal to the periphery of the package body is exposed through the corresponding aperture. Electrical connection to the leads is made within the respective corresponding apertures.
摘要翻译：公开了用于集成电路芯片的封装以及用于制造和安装封装的结构和方法。封装的示例性实施例包括具有嵌入其中的引线的模制体，其中每个引线附近具有孔。每个引线的位于封装主体周边内部的部分通过相应的孔露出。在相应的孔内进行与引线的电连接。

5. 发明授权

US06627864B1 Thin image sensor package 有权
标题翻译：薄图像传感器封装
公开(公告)号：US06627864B1
公开(公告)日：2003-09-30
申请号：US09447202
申请日：1999-11-22
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： H01L2700
CPC分类号： H01L24/97 , H01L27/14618 , H01L2224/97 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2224/81
摘要： A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.
摘要翻译：薄图像传感器封装包括具有响应于辐射的有效区域的图像传感器。图像传感器安装在对辐射透明的基板上。图像传感器被安装成使得图像传感器的有效区域面向基板。重要的是，衬底具有双重功能。特别地，衬底是覆盖图像传感器的有效区域的窗口。此外，基板是制造图像传感器封装的平台。因此，图像传感器封装薄，重量轻且制造成本低廉。

6. 发明授权

US06586824B1 Reduced thickness packaged electronic device 有权
标题翻译：减薄厚度电子装置
公开(公告)号：US06586824B1
公开(公告)日：2003-07-01
申请号：US09916716
申请日：2001-07-26
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： H01L2302
CPC分类号： H01L27/14618 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/97 , H01L27/14625 , H01L27/14683 , H01L31/0203 , H01L31/02327 , H01L31/18 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/85001 , H01L2224/85399 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2224/85 , H01L2924/00015 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： An electronic device, such as a sensor die, is packaged by first forming a hole through a substrate. The hole is made large enough to position the entire electronic device within the hole. A tape is then applied to the second surface of the substrate to cover a second side of the hole, thereby creating a tape surface at the bottom of the hole. The electronic device is then positioned within the hole such that the electronic device is in contact with, and adhered to, the tape surface at the bottom of the hole. Electronic connections are made between the electronic device and the substrate and a layer of encapsulant is applied. In one embodiment, the electronic device is a sensor die and an optical element is positioned over an active region of the sensor die before the encapsulant is applied. The encapsulant then surrounds and holds the optical element in position over the active region of the sensor die.
摘要翻译：通过首先通过基板形成孔来封装诸如传感器管芯的电子装置。孔足够大以将整个电子设备定位在孔内。然后将带施加到基板的第二表面以覆盖孔的第二侧，从而在孔的底部形成带表面。然后将电子设备定位在孔内，使得电子设备与孔的底部接触并粘附到带表面。在电子设备和基板之间形成电子连接，并且施加一层密封剂。在一个实施例中，电子设备是传感器管芯，并且在施加密封剂之前，光学元件位于传感器管芯的有源区域之上。然后，密封剂围绕并将光学元件保持在传感器管芯的有源区域上的适当位置。

7. 发明授权

US06586677B2 Plastic integrated circuit device package having exposed lead surface 有权
公开(公告)号：US06586677B2
公开(公告)日：2003-07-01
申请号：US09863359
申请日：2001-05-22
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L2328
CPC分类号： H01L21/568 , H01L21/56 , H01L21/561 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0401 , H01L2224/05624 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48724 , H01L2224/48799 , H01L2224/49175 , H01L2224/85001 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18301 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
摘要： Methods for forming packages for housing an integrated circuit device are disclosed. In one embodiment, a plastic sheet having an first surface is provided. An array of package sites is formed on the first surface of the plastic sheet. The package sites each include a metal die pad and leads surrounding the die pad. The package sites may be formed by applying a first metal layer on the first surface of the plastic sheet, and then applying a second metal layer in a pattern that defines the die pads and leads of the package sites. The first metal layer is then selectively etched using the second metal layer as an etch mask. Next, an integrated circuit die is placed on each die pad of the array. The die is electrically connected to the leads surrounding the respective die pad. An encapsulant is applied onto the first surface of the plastic sheets so as to cover the package sites. The plastic layer is removed by peeling, by dissolving the plastic sheet, or dissolving an adhesive connection between the plastic sheet and the encapsulated array. The packages are then singulated from the array.

8. 发明授权

US06580153B1 Structure for protecting a micromachine with a cavity in a UV tape 有权
标题翻译：用于在UV胶带中用腔保护微机械的结构
公开(公告)号：US06580153B1
公开(公告)日：2003-06-17
申请号：US09811183
申请日：2001-03-14
申请人： Thomas P. Glenn , Roy Dale Hollaway , Steven Webster
发明人： Thomas P. Glenn , Roy Dale Hollaway , Steven Webster
IPC分类号： H01L21304
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/544 , H01L2221/68327 , H01L2221/6834 , H01L2223/54453 , H01L2224/48463 , H01L2924/3025
摘要： A protective layer includes a polymerized region, which forms a cavity in an interior surface of the protective layer. The protective layer is mounted to a micromachine chip such that an active area of the micromachine chip is located within the cavity of the protective layer. The protective layer protects the active area during front-side or back-side singulation of the micromachine chip from a micromachine substrate.
摘要翻译：保护层包括在保护层的内表面中形成空腔的聚合区域。保护层安装到微机械芯片，使得微机械芯片的有效区域位于保护层的空腔内。保护层在微机械基片的前侧或后侧分割期间保护有源区域。

9. 发明授权

US06563204B1 Microcircuit die-sawing protector 有权
标题翻译：微电路模切保护器
公开(公告)号：US06563204B1
公开(公告)日：2003-05-13
申请号：US09615670
申请日：2000-07-14
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L2302
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2224/32225 , Y10S438/928
摘要： A method and apparatus for protecting hypersensitive microcircuits on the face of a semiconductor wafer from contamination and mechanical damage during die sawing and subsequent die handling operations include the provision of a plastic sheet having an array of protective domes formed into it, the array corresponding to the array of microcircuits on the wafer, and the temporary adhesion of the sheet to the face of the wafer such that each die in the wafer is covered by a respective one of the domes, with an associated one of the microcircuits protectively sealed therein. Die sawing is performed with the component side of the wafer facing up, the cut passing between the domes and through the thicknesses of both the domed sheet and the wafer such that each die is separated from the wafer, with a corresponding one of the domes still attached to it. The domes may be removed later when the dies are located in a more benign environment by simply peeling them off the die. The invention enables the use of conventional die-handling equipment and results in improved device yield.
摘要翻译：用于保护半导体晶片的表面上的超敏感微电路的方法和装置不受模具切割期间的污染和机械损伤以及随后的模具处理操作，包括提供一种具有形成在其中的保护圆顶阵列的塑料片，该阵列对应于晶片上的微电路阵列，以及薄片临时粘附到晶片的表面，使得晶片中的每个晶片被相应的一个圆顶覆盖，其中一个微型电路被保护地密封在其中。在晶片的部件侧面朝上，切割通过圆顶和圆顶片和晶片的厚度之间进行切割，使得每个管芯与晶片分离，相应的一个圆顶仍然附于它当模具位于较温和的环境中时，可以通过简单地将它们从模具上剥离而将后盖移除。本发明能够使用常规的模具处理设备并导致提高的装置产量。

10. 发明授权

US06528875B1 Vacuum sealed package for semiconductor chip 有权
标题翻译：用于半导体芯片的真空密封封装
公开(公告)号：US06528875B1
公开(公告)日：2003-03-04
申请号：US09839305
申请日：2001-04-20
申请人： Thomas P. Glenn , Roy D. Hollaway , Steven Webster
发明人： Thomas P. Glenn , Roy D. Hollaway , Steven Webster
IPC分类号： H01L2312
CPC分类号： B81B7/007 , B81B2207/096 , H01L23/10 , H01L23/13 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/16152 , H01L2924/16195 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A vacuum sealed package for a semiconductor chip, such as a micro-electromechanical (MEM) chip, is disclosed, along with a method of making such a package. In an exemplary embodiment, the package includes a ceramic substrate and a lid that together define a cavity wherein the chip is mounted. The substrate includes a conductive (e.g., metal) interconnect pattern that extends, at least in part, vertically through the substrate. I/O terminals are provided on an external surface of the substrate. A vent hole, at least partially lined with a metal coating, extends through the substrate into the cavity. A metal plug seals the vent hole. The vent hole is sealed by placing the package in a vacuum chamber, evacuating the chamber, and heating the chamber so as to cause a metal preform on the substrate to flow into the vent hole and form the plug.
摘要翻译：公开了一种用于诸如微机电（MEM）芯片的半导体芯片的真空密封封装以及制造这种封装的方法。在示例性实施例中，封装包括陶瓷基板和盖，其一起限定其中安装芯片的空腔。衬底包括至少部分地垂直延伸穿过衬底的导电（例如，金属）互连图案。 I / O端子设置在基板的外表面上。至少部分衬有金属涂层的排气孔延伸穿过衬底进入空腔。金属插头密封通气孔。通过将包装物放置在真空室中，排空室并加热室以使基板上的金属预成型件流入通气孔并形成插塞来密封通气孔。

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