专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07560804B1 Integrated circuit package and method of making the same 有权
标题翻译：集成电路封装及其制作方法
公开(公告)号：US07560804B1
公开(公告)日：2009-07-14
申请号：US11970712
申请日：2008-01-08
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L23/28 , H01L23/495
CPC分类号： H01L23/49541 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2924/00012
摘要： Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant. A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.
摘要翻译：公开了用于集成电路管芯的封装以及用于制造这种封装的方法和引线框。封装包括管芯，管芯焊盘，外围金属触点，接合线和密封剂。管芯焊盘和触点位于封装的下表面。管芯焊盘和触头具有侧表面，其包括凹入部分和粗糙度以接合密封剂。制造包装的方法包括提供具有矩形框架中的管芯焊盘的金属引线框架。标签从框架向模片垫延伸。管芯焊盘和突片具有侧表面，其具有凹入部分和凹凸。芯片贴在裸片上。模具电连接到突片。将密封剂施加到引线框架的上表面和侧表面。最后，将引线框架原位切割，使得芯片焊盘和突片从框架上切断，形成封装的侧面，并将封装与引线框架切断。

2. 发明申请

US20080308717A1 Camera module with window mechanical attachment 有权
标题翻译：相机模块与窗口机械附件
公开(公告)号：US20080308717A1
公开(公告)日：2008-12-18
申请号：US12221948
申请日：2008-08-08
申请人： Thomas P. Glenn , Steven Webster
发明人： Thomas P. Glenn , Steven Webster
IPC分类号： H01J5/02
CPC分类号： H01L27/14625 , B29C33/0022 , B29C43/36 , B29C2043/023 , H01L24/73 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L27/14683 , H01L27/14687 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/12042 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.
摘要翻译：图像传感器封装包括具有锁定特征的模制件。该包装还包括具有突片的卡扣盖，其中突片附接到模制件的锁定特征。为了形成图像传感器封装，将窗口放置在模制品的口袋中。卡扣盖固定就位。一旦固定，卡扣盖压靠窗口外表面的周边区域。窗口夹在模制件和卡扣盖之间并保持就位。

3. 发明授权

US07332375B1 Method of making an integrated circuit package 有权
标题翻译：制造集成电路封装的方法
公开(公告)号：US07332375B1
公开(公告)日：2008-02-19
申请号：US11503752
申请日：2006-08-14
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L21/48 , H01L21/50
CPC分类号： H01L23/49541 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2924/00012
摘要： A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.
摘要翻译：制造包装的方法包括提供具有矩形框架中的管芯焊盘的金属引线框架。标签从框架向模片垫延伸。管芯焊盘和突片具有侧表面，其具有凹入部分和凹凸。芯片贴在裸片上。模具电连接到突片。将密封剂施加到引线框架的上表面和侧表面。最后，将引线框架原位切割，使得芯片焊盘和突片从框架上切断，形成封装的侧面，并将封装与引线框架切断。

4. 发明授权

US06784534B1 Thin integrated circuit package having an optically transparent window 有权
标题翻译：薄的集成电路封装，具有光学透明的窗口
公开(公告)号：US06784534B1
公开(公告)日：2004-08-31
申请号：US10067068
申请日：2002-02-06
申请人： Thomas P. Glenn , Vincent Di Caprio , Steven Webster
发明人： Thomas P. Glenn , Vincent Di Caprio , Steven Webster
IPC分类号： H01L2348
CPC分类号： H01L31/0203 , H01L2924/15311
摘要： A thin integrated circuit package having an optically transparent window provides a small profile optical integrated circuit assembly for use in digital cameras, video cellular telephones and other devices requiring a small physical size and optical integrated circuit technology. A tape having a conductive metal layer on a surface is used to interface the optical integrated circuit die with electrical interconnects disposed on a surface of the tape opposite the die. A supporting structure surrounds the die and a glass cover is either bonded to the top of the supporting structure over the die, or the glass cover is bonded to the top of the die and the gap between the glass cover and supporting structure filled with encapsulant. The resulting assembly yields a very thin optical integrated circuit package.
摘要翻译：具有光学透明窗口的薄集成电路封装提供了用于数字照相机，视频蜂窝电话和需要较小物理尺寸和光学集成电路技术的其它设备的小型光学集成电路组件。使用在表面上具有导电金属层的带将光学集成电路管芯与设置在与管芯相对的带的表面上的电互连接合。支撑结构围绕模具，并且玻璃盖或者结合到模具上方的支撑结构的顶部，或者玻璃盖结合到模具的顶部以及玻璃盖和填充有密封剂的支撑结构之间的间隙。所得组件产生非常薄的光学集成电路封装。

5. 发明授权

US06730536B1 Pre-drilled image sensor package fabrication method 有权
标题翻译：预钻图像传感器封装制造方法
公开(公告)号：US06730536B1
公开(公告)日：2004-05-04
申请号：US09896074
申请日：2001-06-28
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： H01L2100
CPC分类号： H01L27/14618 , H01L23/49816 , H01L27/14636 , H01L27/14683 , H01L2924/0002 , H01L2924/00
摘要： A central aperture is formed in a substrate. Traces are formed on a lower surface of the substrate, the traces having tabs protecting beyond a sidewall of the central aperture. An image sensor is supported in the central aperture by the tabs. By mounting the image sensor in the central aperture, the resulting image sensor package is relatively thin.
摘要翻译：在基板中形成中心孔。迹线形成在基底的下表面上，迹线具有保护超过中心孔的侧壁的突出部。图像传感器由中央孔径被支架支撑。通过将图像传感器安装在中心孔中，所得到的图像传感器封装相对较薄。

6. 发明授权

US06667544B1 Stackable package having clips for fastening package and tool for opening clips 失效
标题翻译：可堆叠包装，具有用于紧固包的夹子和用于打开夹子的工具
公开(公告)号：US06667544B1
公开(公告)日：2003-12-23
申请号：US09608419
申请日：2000-06-30
申请人： Thomas P. Glenn
发明人： Thomas P. Glenn
IPC分类号： H01L2302
CPC分类号： H01L23/3107 , G02B6/4214 , G02B6/4245 , G02B6/4249 , G02B6/4261 , G02B6/4274 , H01L23/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1005 , H01L2225/1029 , H01L2225/1041 , H01L2225/1076 , H01L2225/1082 , H01L2924/01013 , H01L2924/01028 , H01L2924/01046 , H01L2924/0105 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1532 , H01L2924/1627 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00014 , H01L2924/00012
摘要： Embodiments of stackable packages for an electronic device, such as an integrated circuit chip or a micro-machine, are disclosed. The packages may be stacked and electrically interconnected without soldering. The package includes a molded plastic body. Stacking clips are molded into the package body. Leads formed of spring metal are embedded at the bottom of the package so that a surface of the lead is exposed through the mold compound. The leads extend upwards adjacent to the sides of the package body, and extend over the top surface of the package body. A spring member, such as a crook spring, is bent into the leads. The spring member, along with the inherent spring of the spring metal, causes the leads to press against juxtaposed lead portions of a package stacked therewith, which forces the leads of the two packages against each other, thereby forming a secure electrical connection between the packages. A tool for disengaging the interconnected clips of stacked packages also is described.
摘要翻译：公开了用于诸如集成电路芯片或微机的电子设备的可堆叠封装的实施例。封装可以堆叠并电连接，无需焊接。包装包括模制塑料体。堆叠夹子被模制到包装体中。由弹簧金属形成的引线嵌入在封装的底部，使得引线的表面通过模具化合物暴露。引线相邻于封装主体的侧面向上延伸，并且在封装主体的顶表面上延伸。诸如弯曲弹簧的弹簧构件弯曲成引线。弹簧构件以及弹簧金属的固有弹簧使得引线压靠与其堆叠的包装的并置的引线部分，这些引线部分迫使两个封装的引线相互抵靠，从而在封装之间形成牢固的电连接。还描述了用于分离堆叠包装的互连夹子的工具。

7. 发明授权

US06627987B1 Ceramic semiconductor package and method for fabricating the package 有权
标题翻译：陶瓷半导体封装及其制造方法
公开(公告)号：US06627987B1
公开(公告)日：2003-09-30
申请号：US09881343
申请日：2001-06-13
申请人： Thomas P. Glenn , Roy D. Hollaway , Steven Webster
发明人： Thomas P. Glenn , Roy D. Hollaway , Steven Webster
IPC分类号： H01L2348
CPC分类号： H01L23/10 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/16195 , Y10T428/239 , H01L2224/45015 , H01L2924/207
摘要： A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a substrate top surface. A semiconductor die is disposed within each cavity, and is electrically connected through the substrate to input/output terminals of the substrate. The substrate has a metal film on the top surface thereof around the opening of the respective the cavities. A metal lid panel, covering the cavity openings, is soldered to the metal film by reflowing a layer of solder disposed over a lid panel bottom surface, thereby sealing the die in each cavity. Subsequently, individual packages are singulated from the ceramic substrate.
摘要翻译：公开了一种用于半导体器件的密封陶瓷封装及其制造方法。在一个实施例中，陶瓷衬底具有一组空腔，每个空腔在衬底顶表面具有开口。半导体管芯设置在每个腔内，并且通过衬底电连接到衬底的输入/输出端子。衬底在其顶表面上具有围绕各腔的开口的金属膜。覆盖空腔开口的金属盖板通过回流设置在盖板底部表面上的焊料层而焊接到金属膜，从而将模具密封在每个空腔中。随后，从陶瓷衬底分离各个封装。

8. 发明授权

US06624921B1 Micromirror device package fabrication method 有权
标题翻译：微镜器件封装制造方法
公开(公告)号：US06624921B1
公开(公告)日：2003-09-23
申请号：US09804805
申请日：2001-03-12
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： G02B2600
CPC分类号： B81B7/0067 , B81B2201/042 , B81C1/00865 , B81C1/00904 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/16235 , H01L2224/05599
摘要： A window is mounted directly to an upper surface of a micromirror device chip. More particularly, the window is mounted above a micromirror device area on the upper surface of the micromirror device chip by a bead. The window in combination with the bead form a hermetic enclosure about the micromirror device area thus protecting the micromirror device area from moisture and contamination.
摘要翻译：窗口直接安装在微镜器件芯片的上表面。更具体地，窗口通过珠缘安装在微反射镜装置芯片的上表面上的微镜装置区域上方。窗口与珠组合形成围绕微镜装置区域的密封外壳，从而保护微镜装置区域免受潮湿和污染。

9. 发明授权

US06620646B1 Chip size image sensor wirebond package fabrication method 有权
标题翻译：芯片尺寸图像传感器引线封装制造方法
公开(公告)号：US06620646B1
公开(公告)日：2003-09-16
申请号：US09712314
申请日：2000-11-13
申请人： Thomas P. Glenn , Steven Webster , Markus K. Liebhard
发明人： Thomas P. Glenn , Steven Webster , Markus K. Liebhard
IPC分类号： H01L2148
CPC分类号： H01L27/14618 , H01L27/14636 , H01L31/0203 , H01L2224/48091 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. A noncritical region of the upper surface of the image sensor is between the active area and bond pads of the image sensor. A lower surface of a step up ring is mounted above the noncritical region of the upper surface of the image sensor. An upper surface of the step up ring includes a plurality of electrically conductive traces. Bond wires are formed between the bond pads of the image sensor and the electrically conductive traces on the upper surface of the step up ring. The step up ring is mounted so that the window is located in or adjacent a central aperture of the step up ring.
摘要翻译：为了形成图像传感器封装，将窗口安装在图像传感器的上表面上的有效区域上方。图像传感器的上表面的非临界区域在图像传感器的有源区域和接合焊盘之间。升压环的下表面安装在图像传感器的上表面的非关键区域上方。升压环的上表面包括多个导电迹线。接合线形成在图像传感器的接合焊盘和升压环的上表面上的导电迹线之间。安装升降环使得窗口位于升压环的中心孔中或其附近。

10. 发明授权

US06610167B1 Method for fabricating a special-purpose die using a polymerizable tape 有权
标题翻译：使用可聚合胶带制造专用模具的方法
公开(公告)号：US06610167B1
公开(公告)日：2003-08-26
申请号：US09764166
申请日：2001-01-16
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： B32B3100
CPC分类号： H01L27/14685 , H01L27/1462 , Y10T156/1158
摘要： A method includes adhesively mounting an adhesive lower surface of a protective layer to a top surface of a die such as an image sensor die or a micromachine die. A special-purpose area on the top surface of the die is contacted and protected by said protective layer. The protective layer includes a polymerizable material, which includes the adhesive lower surface. The method further includes rendering the adhesive lower surface to be nonadhesive. The adhesive lower surface is rendered nonadhesive by polymerizing the polymerizable material of the protective layer with ultraviolet radiation.
摘要翻译：一种方法包括将保护层的粘合剂下表面粘合地安装到诸如图像传感器模具或微机械模具的模具的顶表面上。模具顶表面上的专用区域被所述保护层接触和保护。保护层包括可聚合材料，其包括粘合剂下表面。该方法还包括使粘合剂下表面不粘附。通过用紫外线辐射聚合保护层的可聚合材料，使粘合剂下表面变得不粘附。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式