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1. 发明授权

US4875614A Alignment device 失效
标题翻译：对准装置
公开(公告)号：US4875614A
公开(公告)日：1989-10-24
申请号：US264713
申请日：1988-10-31
申请人： Thomas M. Cipolla , Raymond R. Horton , Philip Murphy , Michael J. Palmer
发明人： Thomas M. Cipolla , Raymond R. Horton , Philip Murphy , Michael J. Palmer
IPC分类号： H01L21/60 , B23K20/02 , F16C19/50 , H01L21/00
CPC分类号： F16C19/50 , B23K20/02 , H01L21/67144 , H01L24/78 , H01L2224/75745 , H01L2224/75823 , H01L2224/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , Y10S269/903
摘要： Apparatus for automatically adjusting the orientation of a first surface of a first body to be against a second surface of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.

2. 发明授权

US5052606A Tape automated bonding feeder 失效
标题翻译：胶带自动接合给料机
公开(公告)号：US5052606A
公开(公告)日：1991-10-01
申请号：US546496
申请日：1990-06-29
申请人： Thomas M. Cipolla , Raymond R. Horton , Alphonso P. Lanzetta , Michael J. Palmer , Mark B. Ritter
发明人： Thomas M. Cipolla , Raymond R. Horton , Alphonso P. Lanzetta , Michael J. Palmer , Mark B. Ritter
IPC分类号： H01L21/60 , H01L21/00
CPC分类号： H01L21/67144 , H01L21/67132 , Y10T156/1734
摘要： A hitch feeder for a TAB tape is described which comprises: a stationary jas assembly having opposing jaws for gripping edges of the tape when closed, and not gripping the edges when open; a movable gripping assembly which includes a lower movable gripper positioned below the tape and an upper movable gripper positioned above the tape. The lower and upper movable grippers may be moved both towards and away from the tape, each said movable gripper gripping the tape when moved towards it and releasing the tape when moved away from it. Both grippers are physically clear of any features on the tape when moved away from it. A tape feeder is provided for reciprocally moving the movable gripper assembly along the tape length, both towards and away from the stationary jaw assembly. A feed control is operative when the movable gripping assembly moves towards the stationary jaw assembly, to move the gripper jaws to grip the tape and to open the opposing jaws, and is further operative when the movable gripper assembly moves away from the stationary jaw assembly, to move the gripper jaws away from the tape and to close the opposing jaws.

3. 发明授权

US5113565A Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames 失效
标题翻译：半导体芯片和导电引线框架的检查和对准的装置和方法
公开(公告)号：US5113565A
公开(公告)日：1992-05-19
申请号：US549577
申请日：1990-07-06
申请人： Thomas M. Cipolla , Paul W. Coteus , Glen W. Johnson , Philip Murphy , Christopher W. Oden
发明人： Thomas M. Cipolla , Paul W. Coteus , Glen W. Johnson , Philip Murphy , Christopher W. Oden
IPC分类号： H01L21/60 , H01L21/00 , H01L21/66 , H01L21/68
CPC分类号： H01L21/67144 , H01L22/12 , H01L2924/0002 , Y10T29/41 , Y10T29/49121 , Y10T29/49131 , Y10T29/49133 , Y10T29/53178
摘要： A method is described for aligning a contact pattern on an electronic device held by a first movable support, with a bond site pattern on a lead frame held by a second movable support. The method includes the steps of: (a) creating and storing models of a chip's contact pattern and a lead frame's bond site pattern; (b) imaging the electronic device and lead frame; (c) determining the position of contacts on said electronic device and reorienting the contact pattern model to a best fit with the imaged contact position; (d) determining the position of each bond site on the imaged lead frame and reorienting the bond site model to a best fit with the imaged bond site position; (e) determining positional differences between the reoriented lead frame and contact pattern models; and (f) generating signals to reorient the first and second movable supports to minimize the positional differences when they are moved into a bonding positon. A machine is described for performing the above method wherein each of three main movable elements of the machine is assigned a dimensional axis in which its travel is non-adjustable, so that other movable elements can be calibrated thereagainst.

4. 发明授权

US07761687B2 Ultrascalable petaflop parallel supercomputer 失效
标题翻译：超平面petaflop平行超级计算机
公开(公告)号：US07761687B2
公开(公告)日：2010-07-20
申请号：US11768905
申请日：2007-06-26
申请人： Matthias A. Blumrich , Dong Chen , George Chiu , Thomas M. Cipolla , Paul W. Coteus , Alan G. Gara , Mark E. Giampapa , Shawn Hall , Rudolf A. Haring , Philip Heidelberger , Gerard V. Kopcsay , Martin Ohmacht , Valentina Salapura , Krishnan Sugavanam , Todd Takken
发明人： Matthias A. Blumrich , Dong Chen , George Chiu , Thomas M. Cipolla , Paul W. Coteus , Alan G. Gara , Mark E. Giampapa , Shawn Hall , Rudolf A. Haring , Philip Heidelberger , Gerard V. Kopcsay , Martin Ohmacht , Valentina Salapura , Krishnan Sugavanam , Todd Takken
IPC分类号： G06F15/173
CPC分类号： G06F15/17337
摘要： A massively parallel supercomputer of petaOPS-scale includes node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC) having up to four processing elements. The ASIC nodes are interconnected by multiple independent networks that optimally maximize the throughput of packet communications between nodes with minimal latency. The multiple networks may include three high-speed networks for parallel algorithm message passing including a Torus, collective network, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. The use of a DMA engine is provided to facilitate message passing among the nodes without the expenditure of processing resources at the node.
摘要翻译： petaOPS规模的大规模并行超级计算机包括基于片上系统技术的节点架构，其中每个处理节点包括具有多达四个处理元件的单个专用集成电路（ASIC）。 ASIC节点通过多个独立网络互连，以最小的延迟最大化节点之间的数据包通信的吞吐量。多个网络可以包括用于并行算法消息传递的三个高速网络，包括Torus，集合网络和提供全局障碍和通知功能的全球异步网络。这些多个独立网络可以根据用于优化算法处理性能的算法的需求或阶段来协同或独立地利用。提供DMA引擎的使用以促进节点之间的消息传递，而不需要节点处理资源。

5. 发明申请

US20080026627A1 PIN GRID ARRAY ZERO INSERTION FORCE CONNECTORS CONFIGURABLE FOR SUPPORTING LARGE PIN COUNTS 有权
标题翻译： PIN网格阵列插入力连接器可配置为支持大量PIN码
公开(公告)号：US20080026627A1
公开(公告)日：2008-01-31
申请号：US11496153
申请日：2006-07-31
申请人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
发明人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
IPC分类号： H01R4/50
CPC分类号： H01R13/193 , H05K7/1007
摘要： A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.
摘要翻译：包括多个子插座部件的PGA插座，当组合使用时形成较大的有效插座，包括配置成接收IC的相应引脚的多个孔。 PGA插座还包括多个接触构件，每个接触构件对应于相应的一个孔。接触构件被构造成在孔的相应移动时可移动地接合IC的相应销，以便提供与其的电和机械接触。每个子插座部件被构造成机械地接合其他子插座部件中的至少一个，使得每个子插座部件中的接触部件能够基本上同时电连接到IC的相应引脚。

6. 发明授权

US07217144B1 Connector drawer 有权
标题翻译：连接器抽屉
公开(公告)号：US07217144B1
公开(公告)日：2007-05-15
申请号：US11329632
申请日：2006-01-11
申请人： Thomas M. Cipolla , Lawrence S. Mok
发明人： Thomas M. Cipolla , Lawrence S. Mok
IPC分类号： H01L21/82
CPC分类号： H01R27/02 , H01R13/73
摘要： An arrangement and a method of increasing the quantity of input and output connectors, which are available for the attachment to connection cables of electronic equipment. More particularly, the present invention relates to an arrangement, such as a connector drawer, which is adapted to be installed in a selectively retractable and extendable mode in a laptop computer and which provides for a versatile structure facilitating a elective increase in the quantity of input and output connectors as may be necessitated by specific utilization of the electronic equipment or laptop computers, particularly in conjunction with the connection therewith of auxiliary operating devices or components.
摘要翻译：一种增加输入和输出连接器的数量的装置和方法，其可用于连接到电子设备的连接电缆。更具体地，本发明涉及一种诸如连接器抽屉的装置，其适于以笔记本电脑中的可选择性地伸缩和可延伸的方式安装，并且其提供通用结构，便于输入量的选择性增加以及通过电子设备或膝上型计算机的特定利用可能需要的输出连接器，特别是与辅助操作装置或部件的连接。

7. 发明授权

US4349277A Non-contact measurement of surface profile 失效
标题翻译：非接触式测量表面轮廓
公开(公告)号：US4349277A
公开(公告)日：1982-09-14
申请号：US158372
申请日：1980-06-11
申请人： Joseph L. Mundy , Gilbert B. Porter, III , Thomas M. Cipolla
发明人： Joseph L. Mundy , Gilbert B. Porter, III , Thomas M. Cipolla
IPC分类号： G01B11/24 , G01B11/25 , G01B11/30 , G01B11/00 , G01C3/20
CPC分类号： G01B11/2509
摘要： A parallax method of wavelength labeling is based on optical triangulation. A complementary color pattern projected onto the surface is characterized by a continuous variation of the power ratio of two wavelength bands, and the profile can be measured at all points in the field of view. Shifts of the wavelength bands on separate detector arrays correspond to profile deviations. A signal processor calculates a normalized signal that is independent of surface reflectivity and roughness variations; the phase shift of this signal yields depth data from which the surface profile can be mapped.
摘要翻译：波长标注的视差法基于光学三角测量。投影到表面上的互补色图案的特征在于两个波段的功率比的连续变化，并且可以在视场中的所有点处测量轮廓。分离的检测器阵列上的波段的移位对应于轮廓偏差。信号处理器计算独立于表面反射率和粗糙度变化的归一化信号; 该信号的相移产生可以映射表面轮廓的深度数据。

8. 发明授权

US08081473B2 Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages 失效
标题翻译：直接水冷几种并行电路卡的装置和方法，每个包含几个芯片封装
公开(公告)号：US08081473B2
公开(公告)日：2011-12-20
申请号：US12185520
申请日：2008-08-04
申请人： Thomas M. Cipolla , Evan George Colgan , Paul W. Coteus , Shawn Anthony Hall , Shurong Tian
发明人： Thomas M. Cipolla , Evan George Colgan , Paul W. Coteus , Shawn Anthony Hall , Shurong Tian
IPC分类号： H05K5/00 , H05K7/20 , G06F1/20 , F28D15/00 , H01L23/495
CPC分类号： H01L23/473 , F28D15/00 , F28D15/02 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies. The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader. A thermally conductive support structure supports the heat conduit and thermally communicates with the heat transfer assemblies via the heat spreader transferring heat to the fluid of the heat conduit from the support structure.
摘要翻译：电子设备的冷却装置，系统等方法包括固定在布线基板上的多个发热电子器件。多个传热组件各自包括散热器，并与制热电子设备热连通，用于将热量从发热电子设备传递到传热组件。多个发热电子器件和各个传热组件位于具有重叠区域的布线基板上。热导管与传热组件热连通。热导管将导热流体循环通过其中的闭环，用于通过散热器将热量传递给来自传热组件的流体。导热支撑结构支撑热导管，并且通过散热器与传热组件热连通，散热器将热量从支撑结构传递到热导管的流体。

9. 发明申请

US20110173488A1 NON-VOLATILE MEMORY FOR CHECKPOINT STORAGE 失效
标题翻译：用于检查点存储的非易失性存储器
公开(公告)号：US20110173488A1
公开(公告)日：2011-07-14
申请号：US13004005
申请日：2011-01-10
申请人： Matthias A. Blumrich , Dong Chen , Thomas M. Cipolla , Paul W. Coteus , Alan Gara , Philip Heidelberger , Mark J. Jeanson , Gerard V. Kopcsay , Martin Ohmacht , Todd E. Takken
发明人： Matthias A. Blumrich , Dong Chen , Thomas M. Cipolla , Paul W. Coteus , Alan Gara , Philip Heidelberger , Mark J. Jeanson , Gerard V. Kopcsay , Martin Ohmacht , Todd E. Takken
IPC分类号： G06F11/00 , G06F11/14
CPC分类号： G06F11/1438 , G06F2201/82 , G06F2201/84
摘要： A system, method and computer program product for supporting system initiated checkpoints in high performance parallel computing systems and storing of checkpoint data to a non-volatile memory storage device. The system and method generates selective control signals to perform checkpointing of system related data in presence of messaging activity associated with a user application running at the node. The checkpointing is initiated by the system such that checkpoint data of a plurality of network nodes may be obtained even in the presence of user applications running on highly parallel computers that include ongoing user messaging activity. In one embodiment, the non-volatile memory is a pluggable flash memory card.
摘要翻译：一种用于在高性能并行计算系统中支持系统发起的检查点并将检查点数据存储到非易失性存储器存储设备的系统，方法和计算机程序产品。系统和方法产生选择性控制信号，以在存在与在节点处运行的用户应用相关联的消息传送活动的情况下执行系统相关数据的检查点。检查点由系统启动，使得即使在存在包括正在进行的用户消息活动的高度并行计算机上的用户应用的情况下，也可以获得多个网络节点的检查点数据。在一个实施例中，非易失性存储器是可插拔闪存卡。

10. 发明申请

US20100025010A1 APPARATUS AND METHOD OF DIRECT WATER COOLING SEVERAL PARALLEL CIRCUIT CARDS EACH CONTAINING SEVERAL CHIP PACKAGES 失效
标题翻译：直接水冷却装置和方法几个并行电路卡每个包含几个芯片包
公开(公告)号：US20100025010A1
公开(公告)日：2010-02-04
申请号：US12185520
申请日：2008-08-04
申请人： Thomas M. Cipolla , Evan George Colgan , Paul W. Coteus , Shawn Anthony Hall , Shurong Tian
发明人： Thomas M. Cipolla , Evan George Colgan , Paul W. Coteus , Shawn Anthony Hall , Shurong Tian
IPC分类号： F28D21/00 , F28D15/00
CPC分类号： H01L23/473 , F28D15/00 , F28D15/02 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader. A thermally conductive support structure supports the heat conduit and thermally communicates with the heat transfer assemblies via the heat spreader transferring heat to the fluid of the heat conduit from the support structure.
摘要翻译：电子设备的冷却装置，系统等方法包括固定在布线基板上的多个发热电子器件。多个传热组件各自包括散热器并与用于将热量从发热电子器件传递到传热组件的发热电子器件热连通。多个发热电子器件和相应的传热组件位于布线具有区域重叠的基板。热导管与传热组件热连通。热导管将导热流体循环通过其中的闭环，用于通过散热器将热量传递给来自传热组件的流体。导热支撑结构支撑热导管，并且通过散热器与传热组件热连通，散热器将热量从支撑结构传递到热导管的流体。

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