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1. 发明授权

US09305813B2 Pressure transmitting device for bonding chips onto a substrate 有权
标题翻译：用于将芯片接合到基板上的压力传递装置
公开(公告)号：US09305813B2
公开(公告)日：2016-04-05
申请号：US14374244
申请日：2012-03-16
申请人： Markus Wimplinger , Alfred Sigl
发明人： Markus Wimplinger , Alfred Sigl
IPC分类号： H01L21/67 , H01L21/687 , H01L23/00
CPC分类号： H01L21/67144 , H01L21/68771 , H01L21/68778 , H01L24/75 , H01L24/89 , H01L24/97 , H01L2224/75251 , H01L2224/75252 , H01L2224/75316 , H01L2224/75317 , H01L2224/75318 , H01L2224/7532 , H01L2224/757 , H01L2224/75704 , H01L2224/75724 , H01L2224/75744 , H01L2224/75822 , H01L2224/75823 , H01L2224/75824 , H01L2224/7598 , H01L2224/9205 , H01L2224/94 , H01L2224/97 , H01L2924/351 , H01L2924/00
摘要： This invention relates to a pressure transmission apparatus for bonding a plurality of chips to a substrate. The pressure transmission apparatus includes a pressure body for applying a bonding force which acts in the bonding direction (B) to the chip. The pressure body has a first pressure side and an opposite second pressure side, both oriented to be transverse to the bonding direction (B). Fixing means are provided to attach to the periphery of the pressure transmission apparatus for fixing of the pressure transmission apparatus on a retaining body in the bonding direction (B). A sliding layer is provided for sliding motion of the pressure body transversely to the bonding direction (B).
摘要翻译：本发明涉及将多个芯片接合到基板上的压力传递装置。压力传递装置包括用于将与键合方向（B）作用的接合力施加到芯片的压力体。压力体具有第一压力侧和相对的第二压力侧，两者均定向成横向于接合方向（B）。提供固定装置以附接到压力传递装置的周边，用于将压力传递装置固定在粘合方向（B）上的保持体上。提供滑动层，用于使压力体横向于接合方向（B）滑动。

2. 发明授权

US6146912A Method for parallel alignment of a chip to substrate 有权
标题翻译：芯片与衬底平行排列的方法
公开(公告)号：US6146912A
公开(公告)日：2000-11-14
申请号：US309945
申请日：1999-05-11
申请人： Thomas S. Tighe , Gershon Akerling
发明人： Thomas S. Tighe , Gershon Akerling
IPC分类号： H01L21/00 , H01L21/68 , H01L21/66 , G01R31/26
CPC分类号： H01L21/6835 , H01L21/67144 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/75 , H01L2224/75302 , H01L2224/75745 , H01L2224/75823 , H01L2924/00014 , H01L2924/01079
摘要： A method and apparatus for bonding a chip to a substrate is described, wherein the apparatus includes a chip holder assembly comprising an outer holder having a cavity formed therein and an inner holder for holding the chip, and by releaseably securing the inner holder within the outer holder cavity and contacting the chip to the substrate the inner holder has selective angular rotation within the cavity to make parallel the chip and the substrate.
摘要翻译：描述了一种用于将芯片接合到基板的方法和装置，其中该装置包括一个芯片保持器组件，该芯片保持器组件包括形成在其中的腔体的外部保持器和用于保持芯片的内部保持器，并且通过将内部保持器可释放地固定在外部保持器腔并将芯片接触到衬底，内部保持器在空腔内具有选择性的角度旋转以使芯片和衬底平行。

3. 发明申请

US20160155721A1 Bonding Method, Storage Medium, Bonding Apparatus and Bonding System 有权
标题翻译：粘合方法，存储介质，粘合设备和粘合系统
公开(公告)号：US20160155721A1
公开(公告)日：2016-06-02
申请号：US14950281
申请日：2015-11-24
申请人： TOKYO ELECTRON LIMITED
发明人： Kenji SUGAKAWA , Yuji MIMURA , Shuhei MATSUMOTO , Takahiro MASUNAGA , Makoto TSUKISHIMA
IPC分类号： H01L23/00 , H01L21/67 , H01L21/66
CPC分类号： H01L21/67248 , H01L21/67092 , H01L21/681 , H01L21/8221 , H01L22/12 , H01L22/20 , H01L24/08 , H01L24/75 , H01L24/80 , H01L24/94 , H01L2224/08145 , H01L2224/7501 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75601 , H01L2224/7565 , H01L2224/75702 , H01L2224/75704 , H01L2224/75705 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75802 , H01L2224/75804 , H01L2224/75822 , H01L2224/75823 , H01L2224/75824 , H01L2224/759 , H01L2224/75981 , H01L2224/80003 , H01L2224/80013 , H01L2224/80048 , H01L2224/8013 , H01L2224/80132 , H01L2224/80201 , H01L2224/80894 , H01L2224/80908 , H01L2224/83201 , H01L2224/94 , H01L2924/3511 , H01L2924/00012 , H01L2224/80 , H01L2924/00014
摘要： There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.
摘要翻译：提供了将基板彼此接合的方法，其包括：将第一基板保持在第一保持部的下表面上; 通过温度调节部分调节第二基板的温度以变得高于第一基板的温度; 将第二基板保持在第二保持部的上表面上; 通过用第一成像部分对第二基板的多个参考点进行成像来检查第二基板的状态，测量参考点的位置，并将测量结果与预定的允许范围进行比较; 并且用按压部件按压所述第一基板的中央部，使所述第一基板的中央部与所述第二基板的中央部接触，并顺序地接合所述第一基板和所述第二基板。

4. 发明申请

US20140311652A1 Method And Apparatus For Mounting Electronic Or Optical Components On A Substrate 审中-公开
标题翻译：用于在基板上安装电子或光学部件的方法和装置
公开(公告)号：US20140311652A1
公开(公告)日：2014-10-23
申请号：US14256830
申请日：2014-04-18
申请人： Besi Switzerland AG
发明人： Hannes Kostner , Andreas Mayr , Harald Meixner , Hugo Pristauz
IPC分类号： H01L21/68
CPC分类号： H01L21/67144 , H01L24/75 , H01L2224/75823 , H01L2224/7592 , Y10T156/10 , Y10T156/17
摘要： A method for mounting components on a substrate includes receiving a component with a suction member which is mounted on a bonding head, displacing the bonding head relative to the substrate by means of a first movement axis and a second movement axis in order to position the component in a target position above the substrate, lowering the suction member by means of a third movement axis until the component touches the substrate, producing a predetermined bonding force with which the suction member presses the component against the substrate, and displacing at least one of the bonding head and the substrate by means of at least one of the first movement axis by a corrective value W1 and the second movement axis by a corrective value W2 in order to correct an inclined position of the suction member produced during the build-up of the bonding force.
摘要翻译：用于将部件安装在基板上的方法包括：接收部件，其具有安装在接合头上的抽吸部件，借助于第一移动轴线和第二移动轴线使接合头相对于基板移位，以便将部件在基板上方的目标位置中，通过第三移动轴线降低吸引构件直到部件接触基板，产生预定的结合力，吸引构件通过该粘合力将部件压靠在基板上，并且使至少一个通过第一移动轴线中的至少一个通过校正值W1和第二移动轴线通过校正值W2来接合头部和基板，以便校正在积聚期间产生的抽吸构件的倾斜位置粘合力。

5. 发明申请

US20160176045A1 MASS TRANSFER TOOL MANIPULATOR ASSEMBLY 有权
标题翻译：大量转运工具操纵器总成
公开(公告)号：US20160176045A1
公开(公告)日：2016-06-23
申请号：US15054977
申请日：2016-02-26
申请人： LuxVue Technology Corporation
发明人： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
IPC分类号： B25J9/10 , B25J15/00 , H01L23/00 , H01L21/677 , H01L21/68 , B25J7/00 , H01L21/683
CPC分类号： B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
摘要翻译：公开了用于从载体衬底传送微器件的系统和方法。在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。

6. 发明申请

US20140241843A1 Mass Transfer Tool Manipulator Assembly 有权
标题翻译：传质工具机械手组装
公开(公告)号：US20140241843A1
公开(公告)日：2014-08-28
申请号：US13776158
申请日：2013-02-25
申请人： LUXVUE TECHNOLOGY CORPORATION
发明人： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
IPC分类号： B25J15/00 , B25J11/00
CPC分类号： B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
摘要翻译：公开了用于从载体衬底传送微器件的系统和方法。在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。

7. 发明申请

US20140123454A1 Adjustable Pick-up Head and Method for Manufacturing a Device 有权
标题翻译：可调头皮及其制造方法
公开(公告)号：US20140123454A1
公开(公告)日：2014-05-08
申请号：US13669339
申请日：2012-11-05
申请人： INFINEON TECHNOLOGIES AG
发明人： Abdul Rahman Mohamed , Subaramaniym Senivasan , Zakaria Abdullah , Ralf Otremba
IPC分类号： B23P19/00 , B23P11/00
CPC分类号： H01L21/6838 , H01L24/75 , H01L24/83 , H01L2224/75702 , H01L2224/75823 , H01L2224/8382 , H01L2224/8385 , H01L2924/07802 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , Y10T29/49716 , Y10T29/49826 , Y10T29/53174 , H01L2924/00014 , H01L2924/00
摘要： An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a shank having a holder and an intermediate body connected to the holder by a first joint. The pick-up head further includes a collet head connected to the intermediate body by a second joint.
摘要翻译：公开了一种可调节拾取头，夹头，调节拾取头的方法和制造装置的方法。在一个实施例中，拾取头包括具有保持器的柄和通过第一接头连接到保持器的中间体。拾取头还包括通过第二关节连接到中间体的夹头。

8. 发明申请

US20180153060A1 ELECTRONIC COMPONENT BONDING DEVICE AND ELECTRONIC COMPONENT MOUNTER 审中-公开
公开(公告)号：US20180153060A1
公开(公告)日：2018-05-31
申请号：US15575987
申请日：2015-05-22
申请人： FUJI MACHINE MFG. CO., LTD.
发明人： Masaki MURAI , Toshihiko YAMASAKI , Toshinori SHIMIZU
IPC分类号： H05K13/04 , H05K3/32 , H05K13/02
CPC分类号： H05K13/046 , H01L24/75 , H01L2224/75301 , H01L2224/75651 , H01L2224/75823 , H01L2224/7592 , H01L2224/7598 , H01L2924/3511 , H05K3/32 , H05K13/0413
摘要： An electronic component bonding device includes multiple pressing tools that apply pressure to a die on the bonding section of a circuit board, the multiple pressing tools are supported on a support block via a following mechanism so as to be able to be inclined in any direction around 360 degrees, and a driving mechanism that moves the support blocks vertically is provided. The multiple support blocks are arranged in a width direction of the circuit board, and when the circuit board is conveyed by a conveyor such that the die on the bonding section of the circuit board has reached below one of the multiple support blocks, conveyance of the circuit board is stopped, the support block is lowered by the support block driving mechanism, and the die is bonded to the bonding section of the circuit board using the pressing tool of the support block.

9. 发明授权

US09741595B2 Bonding method, storage medium, bonding apparatus and bonding system 有权
公开(公告)号：US09741595B2
公开(公告)日：2017-08-22
申请号：US14950281
申请日：2015-11-24
申请人： TOKYO ELECTRON LIMITED
发明人： Kenji Sugakawa , Yuji Mimura , Shuhei Matsumoto , Takahiro Masunaga , Makoto Tsukishima
IPC分类号： H01L21/67 , H01L21/66 , H01L23/00 , H01L21/68 , H01L21/822
CPC分类号： H01L21/67248 , H01L21/67092 , H01L21/681 , H01L21/8221 , H01L22/12 , H01L22/20 , H01L24/08 , H01L24/75 , H01L24/80 , H01L24/94 , H01L2224/08145 , H01L2224/7501 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75601 , H01L2224/7565 , H01L2224/75702 , H01L2224/75704 , H01L2224/75705 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75802 , H01L2224/75804 , H01L2224/75822 , H01L2224/75823 , H01L2224/75824 , H01L2224/759 , H01L2224/75981 , H01L2224/80003 , H01L2224/80013 , H01L2224/80048 , H01L2224/8013 , H01L2224/80132 , H01L2224/80201 , H01L2224/80894 , H01L2224/80908 , H01L2224/83201 , H01L2224/94 , H01L2924/3511 , H01L2924/00012 , H01L2224/80 , H01L2924/00014
摘要： There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.

10. 发明授权

US09308649B2 Mass transfer tool manipulator assembly 有权
标题翻译：传质工具机械手组装
公开(公告)号：US09308649B2
公开(公告)日：2016-04-12
申请号：US13776158
申请日：2013-02-25
申请人： LuxVue Technology Corporation
发明人： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
IPC分类号： B25J7/00 , B25J15/00 , B25J9/00 , B25J17/02 , H01L21/67 , H01L23/00
CPC分类号： B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
摘要翻译：公开了用于从载体衬底传送微器件的系统和方法。在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。

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