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    • 1. 发明授权
    • Memory cell configuration and corresponding fabrication method
    • 存储单元配置及相应的制造方法
    • US06258658B1
    • 2001-07-10
    • US09250362
    • 1999-02-12
    • Thomas BöhmVolker WeinrichManfred HainArmin KohlhaseYoichi OtaniAndreas RuschTill Schlösser
    • Thomas BöhmVolker WeinrichManfred HainArmin KohlhaseYoichi OtaniAndreas RuschTill Schlösser
    • H01L218242
    • H01L27/10823H01L27/10808
    • The memory cell configuration has a multiplicity of preferably ferroelectric memory cells in a semiconductor substrate. Mutually parallel bit line trenches run in the longitudinal direction in the main surface of the semiconductor substrate. Bit lines are disposed in the bottoms of the trenches. Source/drain regions are formed in the crowns of the trenches. Channel regions are provided in the walls of the trenches. The channel region on a wall in each case is configured such that a drivable selection transistor of the relevant memory cell is formed there, while the channel region on the other wall is configured such that the transistor located there is closed. Insulated word lines for driving the selection transistors run in the transverse direction along the main surface of the semiconductor substrate through the bit line trenches. Insulation trenches for insulating the source/drain regions in the longitudinal direction of neighboring memory cells run in the transverse direction in the main surface of the semiconductor substrate. A respective, preferably ferroelectric, capacitor is connected to the source/drain region of the respective memory cell and is arranged above the word lines.
    • 存储单元配置在半导体衬底中具有多个优选铁电存储单元。 相互并行的位线沟槽在半导体衬底的主表面中沿纵向延伸。 位线设置在沟槽的底部。 源极/漏极区域形成在沟槽的冠部中。 通道区域设置在沟槽的壁中。 在每种情况下,壁上的沟道区域被构造成使得相关存储单元的可驱动选择晶体管形成在其中,而另一壁上的沟道区域被配置为使得位于那里的晶体管闭合。 用于驱动选择晶体管的绝缘字线通过位线沟槽沿着半导体衬底的主表面在横向方向上延伸。 用于绝缘沟槽,用于使相邻存储单元的纵向上的源极/漏极区域绝缘,在半导体衬底的主表面中沿横向延伸。 相应的优选铁电电容器连接到相应存储单元的源极/漏极区域并且被布置在字线之上。
    • 3. 发明授权
    • Read/write amplifier having vertical transistors for a DRAM memory
    • 具有用于DRAM存储器的垂直晶体管的读/写放大器
    • US06822916B2
    • 2004-11-23
    • US09796207
    • 2001-06-01
    • Alexander FreyWerner WeberTill Schlösser
    • Alexander FreyWerner WeberTill Schlösser
    • G11C700
    • H01L27/10894G11C11/4091H01L27/10876H01L27/10897
    • As a consequence of DRAM memory cell miniaturization, the available space for read/write amplifiers decreases in width from hitherto 4 bit line grids to 2 bit lines grids. Conventionally previously known read/write amplifiers cannot be accommodated on this reduced, still available space. Therefore, it has not been possible hitherto to provide read/write amplifiers arranged beside one another which would manage with the novel DRAM memory cell spacings. The principle underlying the invention is based on replacing at least some of the transistors of conventional design which are usually used for read/write circuits by “vertical transistors” in which the differently doped regions are arranged one above the other or practically one above the other. Compared with the use of conventional transistors, the use of vertical transistors saves enough space to ensure an arrangement of a read/write circuit in the grid even with a reduced grid width.
    • 作为DRAM存储单元小型化的结果,用于读/写放大器的可用空间从迄今为止的4位线栅格宽度减小到2位线栅格。 常规的已知的读/写放大器不能适应这个缩小的仍然可用的空间。 因此,到目前为止还不可能提供一个旁边配置的读/写放大器,这些放大器将利用新颖的DRAM存储器单元间隔进行管理。 本发明的原理是基于将通常用于读/写电路的常规设计的至少一些晶体管替换为“垂直晶体管”,其中不同掺杂区域一个在另一个上方布置或实际上一个在另一个之上 。 与使用常规晶体管相比,垂直晶体管的使用节省了足够的空间,以确保即使在减小的栅格宽度的情况下也能在网格中布置读/写电路。
    • 4. 发明授权
    • Integrated semiconductor memory and fabrication method
    • 集成半导体存储器和制造方法
    • US06750098B2
    • 2004-06-15
    • US10619970
    • 2003-07-15
    • Till SchlösserDirk Manger
    • Till SchlösserDirk Manger
    • H01L218242
    • H01L27/10864H01L27/10876H01L27/10888H01L27/10891H01L29/66666
    • In semiconductor memories having a surrounding gate configuration, webs, i.e. vertical rectangular pillars made of substrate material, are formed at the surface of a semiconductor substrate and are surrounded by the gate electrodes in a lower region. Conventionally, it is not possible for word lines to make contact with the gate electrodes in the lower region of the webs without at the same time electrically influencing substrate regions at a higher level in the webs or short-circuiting bit lines from their sidewalls, unless complicated methods requiring additional lithography steps are used. A method for the self-aligning, selective contact-connection of the peripheral gate electrodes is performed with the aid of an insulation layer having a smaller layer thickness than the peripheral gate electrodes.
    • 在具有围绕栅极结构的半导体存储器中,在半导体衬底的表面上形成由衬底材料制成的腹板,即垂直矩形柱,并且在下部区域中由栅电极包围。 通常,字线不可能与幅材的下部区域中的栅极电极接触,而不会同时在幅材或短路位线从其侧壁电位影响衬底区域的较高水平,除非 使用需要额外光刻步骤的复杂方法。 借助于具有比外围栅极电极更薄的层厚度的绝缘层来执行外围栅电极的自对准,选择性接触连接的方法。
    • 6. 发明授权
    • Integrated DRAM memory cell and DRAM memory
    • 集成DRAM存储单元和DRAM存储器
    • US06445609B2
    • 2002-09-03
    • US09801715
    • 2001-03-09
    • Alexander FreyWerner WeberTill Schlösser
    • Alexander FreyWerner WeberTill Schlösser
    • G11C1194
    • H01L27/10882G11C11/4097H01L27/0207H01L27/10829H01L27/10885H01L27/10897
    • A DRAM memory (50) having a number of DRAM memory cells (51) is described, the memory cells (51) in each case having a storage capacitor (52) and a selection transistor (12) which are formed in the area of an at least essentially rectangular cell area (59), the cell areas (59) having a greater extent in the longitudinal direction (L) than in the width direction (B) and which are wired or can be wired to the cell periphery via a word line (56, 57) and a bit line (55). The word lines (56, 57) and the bit line (55) are conducted over the memory cells (51) and are at least essentially oriented perpendicularly to one another. To achieve, with increasing miniaturization of the DRAM memory patterns, during the transition from so-called “folded” bit line architectures to so-called “open” bit line architectures that the bit line grid, and thus also the grid of corresponding read/write amplifiers, varies linearly in scale with the longitudinal extent (L) of the memory cells (51), it is provided according to the invention that the bit lines (55) are now oriented perpendicularly to the longitudinal extent (L) of the memory cells (51) in the direction of the lateral extent (B) of the memory cells (51)
    • 描述了具有多个DRAM存储单元(51)的DRAM存储器(50),每个情况下的存储单元(51)具有存储电容器(52)和选择晶体管(12) 至少基本上矩形的单元区域(59),所述单元区域(59)在纵向方向(L)上比在宽度方向(B)上具有更大的程度,并且它们被布线或可以经由字连接到单元周边 线(56,57)和位线(55)。 字线(56,57)和位线(55)在存储器单元(51)上传导,并且至少基本上彼此垂直定向。 为了实现随着DRAM存储器模式的小型化,在从所谓的“折叠”位线结构转变到所谓的“开放”位线架构,即位线格栅,从而也是对应读/ 写放大器随着存储器单元(51)的纵向延伸(L)而在尺度上线性变化,根据本发明,提供了位线(55)垂直于存储器的纵向延伸(L)定向 在存储单元(51)的横向范围(B)的方向上的单元(51)
    • 10. 发明授权
    • Substrate assembly having a depression suitable for an integrated circuit configuration and method for its fabrication
    • 具有适于集成电路结构的凹陷的衬底组件及其制造方法
    • US06608340B1
    • 2003-08-19
    • US09821853
    • 2001-03-30
    • Franz HofmannTill SchlösserJosef Willer
    • Franz HofmannTill SchlösserJosef Willer
    • H01L2972
    • H01L27/10864
    • A depression extends from a main surface of the substrate to the inside of said substrate and has an upper area and an adjacent lower area. A cross-section of the upper area, parallel to the main surface, is provided with at least one corner. A cross-section of the lower area, parallel to the main surface, matches the cross-section of the upper area, particularly in the vicinity the upper area, with the following difference: each corner is rounded, whereby the cross section of the lower area is smaller than the cross-section of the upper area. In order to produce the indentation, the upper area is provided with an auxiliary spacer that is rounded by isotropic etching. The lower area is produced by selectively etching the substrate to form an auxiliary spacer.
    • 凹陷从基板的主表面延伸到所述基板的内部,并且具有上部区域和相邻的下部区域。 平行于主表面的上部区域的横截面设置有至少一个角部。 平行于主表面的下部区域的横截面与上部区域的横截面特别是在上部区域附近匹配,具有以下差异:每个角都是圆形的,由此下部区域的横截面 面积小于上部区域的横截面。 为了产生凹陷,上部区域设置有通过各向同性蚀刻而被圆化的辅助间隔件。 通过选择性地蚀刻基板以形成辅助间隔物来产生下部区域。