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1. 发明授权

US4831712A Method for manufacturing siamese-type cylinder block and apparatus for casting blank for such cylinder block 失效
标题翻译：用于制造ese型气缸体的方法和用于这种气缸体的铸坯的设备
公开(公告)号：US4831712A
公开(公告)日：1989-05-23
申请号：US177770
申请日：1988-04-05
申请人： Tetsuya Suzuki , Masuo Ebisawa , Kiyoshi Shibata , Shigeo Kaiho , Akio Kawase , Shuji Kobayashi , Yoshikazu Kanzawa
发明人： Tetsuya Suzuki , Masuo Ebisawa , Kiyoshi Shibata , Shigeo Kaiho , Akio Kawase , Shuji Kobayashi , Yoshikazu Kanzawa
IPC分类号： B22D19/00 , F02B75/18 , F02F1/10 , F02F7/00
CPC分类号： F02F1/108 , B22D19/0009 , F02F7/0007 , F02B2075/1816 , F02F2001/106 , F02F2200/06 , Y10T29/49989
摘要： A method for manufacturing a siamese-type cylinder block, which comprises the steps of pouring under pressure a molten metal of aluminum alloy into a siamese-type cylinder barrel molding cavity with an expansion force applied to the sleeve placed in such cavity, and then removing the expansion force after the completion of solidification of the molten metal to cast a cylinder block blank, and subjecting the resulting blank to a working operation for forming the peripheral inner surface of the sleeve into a true circle.
摘要翻译：一种制造ese式气缸体的方法，包括以下步骤：在压力下将铝合金熔融金属浇铸到暹罗型气缸筒形模腔中，并将膨胀力施加到放置在该空腔中的套筒上，然后移除在熔融金属凝固完成之后的膨胀力，铸造气缸体坯料，并使所得到的坯料经受用于将套筒的周向内表面形成真圆的工作操作。

2. 发明授权

US4905642A Siamese-type cylinder block blank and apparatus for casting the same 失效
标题翻译：暹罗型气缸体坯料及其铸造设备
公开(公告)号：US4905642A
公开(公告)日：1990-03-06
申请号：US794498
申请日：1985-11-01
申请人： Tetsuya Suzuki , Masuo Ebisawa , Kiyoshi Shibata , Shigeo Kaiho , Akio Kawase , Shuji Kobayashi , Yoshikazu Kanzawa
发明人： Tetsuya Suzuki , Masuo Ebisawa , Kiyoshi Shibata , Shigeo Kaiho , Akio Kawase , Shuji Kobayashi , Yoshikazu Kanzawa
IPC分类号： F02B75/18 , F02F1/10 , F02F7/00
CPC分类号： F02F1/108 , F02F7/0007 , F02B2075/1816 , F02F2001/106 , F02F2200/06
摘要： A siamese-type cylinder block blank which is composed so that upon the pouring a molten metal under a pressure, a sleeve of cast iron is cast in each cylinder barrel of a siamese-type cylinder barrel made of an aluminum alloy and consisting of a plurality of cylinder barrels connected in series. The cylinder block blank is characterized in that each sleeve cast presents a substantially oval configuration in section with the lengthwise axis parallel to the direction of cylinder barrels arranged, as a result of the reception of the solidification shrinkage force of each cylinder barrel.
摘要翻译：一种暹罗型气缸体坯料，其特征在于，在压力下浇注熔融金属时，将铸铁套筒铸造在由铝合金制成的暹粒型气缸筒的每个气缸筒中，由多个气缸筒串联连接。气缸体坯料的特征在于，由于接收每个气缸筒的凝固收缩力，每个套筒铸件呈纵截面的基本上椭圆形的构造，纵向轴线平行于气缸筒的方向布置。

3. 发明授权

US5121786A Process for manufacturing siamese-type cylinder block 失效
标题翻译：制造ese式气缸体的工艺
公开(公告)号：US5121786A
公开(公告)日：1992-06-16
申请号：US51622
申请日：1987-05-19
申请人： Akio Kawase , Shuji Kobayashi , Toshio Hamashima , Kiyoshi Shibata , Yoshikazu Kanzawa , Masuo Ebisawa , Shigeo Kaiho
发明人： Akio Kawase , Shuji Kobayashi , Toshio Hamashima , Kiyoshi Shibata , Yoshikazu Kanzawa , Masuo Ebisawa , Shigeo Kaiho
IPC分类号： B22D17/00 , B22D17/32 , B22D19/00 , F02B75/18 , F02F1/10 , F02F7/00
CPC分类号： B22D17/32 , B22D17/00 , B22D19/00 , B22D19/0009 , F02F1/108 , F02F7/0007 , F02B2075/1816 , F02F2001/106 , F02F2200/06
摘要： A process for manufacturing a siamese-type clyinder block which is disclosed herein comprises a blank making step of providing a cylinder block blank in which a sleeve made of a cast iron is cast in each cylinder barrel of a siamese-type barrel made of an aluminum alloy and consisting of a plurality of cylinder barrels connected in series, and a mechanically working or machining step of forming the inner peripheral surface of each sleeve of the cylinder block blank into a true circle. The process is characterized in that the blank making step includes placing highly rigid sleeves each having a thickness set as large as 10% or more of the inner diameter thereof into a siamese-type cylinder barrel molding cavity in a mold and then pouring a molten metal of aluminum alloy under a pressure into the cavity to effect a casting. The sleeve is cast-in as it is at an ambient temperature or in a heated state. A cylinder block blank resulting from the casting-in of sleeves at an ambient temperature is subjected to a thermal treatment for reducing the casting strain in each cylinder barrel.
摘要翻译：一种本文公开的暹粒型煤渣块的制造方法包括坯料制造步骤，该坯料制造步骤提供一种气缸体坯料，其中由铸铁制成的套筒铸造在由铝制成的暹罗型桶的每个气缸筒中合金，并且由串联连接的多个缸筒组成，以及将气缸体坯料的每个套筒的内周面形成为真圆的机械加工或加工步骤。该方法的特征在于，坯料制造步骤包括将具有设定为其内径的10％或更多的厚度的高度刚性的套管放置在模具中的暹粒型缸筒模制腔中，然后将熔融金属的铝合金在压力下进入腔体进行铸造。套筒在环境温度或加热状态下被铸造。在环境温度下由套管浇铸而产生的气缸体坯料经受热处理以减少每个气缸筒中的铸造应变。

4. 发明授权

US08490676B2 Multi-cavity mold 失效
标题翻译：多腔模具
公开(公告)号：US08490676B2
公开(公告)日：2013-07-23
申请号：US12919960
申请日：2009-02-18
申请人： Kiyoshi Shibata , Hideo Hazekawa , Keizou Tanoue , Masamitsu Yamashita
发明人： Kiyoshi Shibata , Hideo Hazekawa , Keizou Tanoue , Masamitsu Yamashita
IPC分类号： B22D17/22 , B22C9/08
CPC分类号： B22D17/22 , B22C9/082 , B22D17/2272
摘要： Four cavities are arranged on a concentric circle “C” with respect to the center “O” of a flow divider and a gate sleeve. Each of the cavities is connected to a sleeve stamp portion through each of four die side runners and each of four stamp side runners formed in a radial direction and separated from the neighboring runners. A semicircular arc-shaped reservoir is provided between the lower half side of the flow divider and the lower half side of the gate sleeve. This reservoir is connected to the sleeve stamp portion. A semi-solidified layer formed by pouring the molten metal into a sleeve is filled into the reservoir, so that the molten metal from which the semi-solidified layer is separated can be filled directly from each of the stamp side runners via the die side runners into each of the cavities evenly and simultaneously.
摘要翻译：四个空腔相对于分流器和门套筒的中心“O”布置在同心圆“C”上。每个空腔通过四个模具侧流道中的每一个连接到套筒印模部分，并且四个印模侧滑块中的每一个沿径向方向形成并与相邻流道分离。在分流器的下半侧和浇口套筒的下半侧之间设置有一个半圆形的弧形储存器。该储存器连接到套筒印章部分。通过将熔融金属浇注到套筒中形成的半固化层被填充到储存器中，使得半固化层分离的熔融金属可以通过模头侧浇口直接从每个印模侧浇道填充均匀地并入到每个腔中。

5. 发明授权

US08258620B2 Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module 有权
标题翻译：电路装置，制造电路装置的方法，装置安装板和半导体模块
公开(公告)号：US08258620B2
公开(公告)日：2012-09-04
申请号：US12673409
申请日：2008-08-08
申请人： Mayumi Nakasato , Ryosuke Usui , Kiyoshi Shibata
发明人： Mayumi Nakasato , Ryosuke Usui , Kiyoshi Shibata
IPC分类号： H01L23/053 , H01L23/12
CPC分类号： H01L23/145 , H01L21/4857 , H01L21/486 , H01L21/563 , H01L21/6835 , H01L23/13 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L24/83 , H01L24/90 , H01L29/0657 , H01L2221/68345 , H01L2224/05001 , H01L2224/05008 , H01L2224/05026 , H01L2224/0508 , H01L2224/05144 , H01L2224/05147 , H01L2224/05569 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13021 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81192 , H01L2224/81193 , H01L2224/81801 , H01L2224/83101 , H01L2224/83104 , H01L2224/83192 , H01L2224/838 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H05K1/0366 , H05K1/0373 , H05K1/113 , H05K3/002 , H05K3/305 , H05K3/4007 , H05K2201/0209 , H05K2201/0367 , H05K2201/0394 , H05K2201/09509 , H05K2201/09527 , H05K2201/09563 , H05K2201/10674 , H05K2201/10977 , H05K2203/1152 , Y02P70/613 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2224/05599
摘要： A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved.
摘要翻译：电路装置包括：绝缘基体，设置有与纤维填料混合的树脂层，设置在绝缘基底中的凸起，用作连接用电极，倒装芯片安装的半导体器件，以及填充半导体之间的间隙的底部填充物设备和绝缘基座。通过使通过树脂层的上表面突出的纤维状填料与底部填充剂接触，提高了底部填充剂和绝缘基材之间的粘合强度。

6. 发明授权

US08258409B2 Circuit board and circuit device 失效
标题翻译：电路板和电路设备
公开(公告)号：US08258409B2
公开(公告)日：2012-09-04
申请号：US12058040
申请日：2008-03-28
申请人： Yasuhiro Kohara , Kiyoshi Shibata , Masayuki Nagamatsu , Ryosuke Usui , Toshiya Shimizu
发明人： Yasuhiro Kohara , Kiyoshi Shibata , Masayuki Nagamatsu , Ryosuke Usui , Toshiya Shimizu
IPC分类号： H05K1/00
CPC分类号： H05K3/383 , H01L23/3128 , H01L23/498 , H01L23/49838 , H01L23/564 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/056 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48599 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H05K3/243 , H05K3/3452 , H05K2201/09727 , H05K2201/09772 , H05K2201/0989 , H05K2203/0307 , H05K2203/0361 , H05K2203/049 , H05K2203/0542 , H05K2203/0723 , H05K2203/1152 , H05K2203/1476 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.
摘要翻译：提供了一种具有增强的抗湿性的电路板和制造该电路板的方法，以及电路装置和该电路装置的制造方法。本发明的电路板包括：基板; 在基板的主表面上形成的布线; 覆盖除了作为连接器的区域的布线的覆盖层; 形成在基板的底面上的背面电极; 以及形成为穿透基板的通孔电极，从而连接布线和背面电极。在该电路基板的各配线的表面上，基板周边的凸部的宽度比基板的中央部的凸部的宽度大。利用这种结构，可以提高热循环负载下的布线与覆盖层之间的粘附可靠性。

7. 发明授权

US08166643B2 Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device 失效
标题翻译：电路装置的制造方法，电路基板的制造方法以及电路装置的制造方法
公开(公告)号：US08166643B2
公开(公告)日：2012-05-01
申请号：US12702865
申请日：2010-02-09
申请人： Kiyoshi Shibata , Ryosuke Usui , Yasunori Inoue
发明人： Kiyoshi Shibata , Ryosuke Usui , Yasunori Inoue
IPC分类号： H05K3/36
CPC分类号： H05K3/445 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H05K1/056 , H05K3/0047 , H05K3/44 , H05K2201/0382 , H05K2201/09054 , H05K2201/09609 , H05K2201/0969 , H05K2203/0323 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165
摘要： A method of manufacturing a circuit apparatus includes forming a plurality of pierced holes in a metal substrate. A first wiring layer is formed on one side of the metal substrate via a first insulating layer, and a second wiring layer is formed on the other side of the metal substrate via a second insulating layer. A conductor layer is formed in at least some of the plurality of pierced holes to establish a connection between the first wiring layer and the second wiring layer. A circuit element is connected to the first wiring layer on the one side of the metal substrate. When a plurality of pierced holes are formed, protrusions are formed on a surface of the metal substrate at least along either edge of each of the pierced holes provided with the conductor layer to protrude in a convex manner from the surface of the metal substrate.
摘要翻译：电路装置的制造方法包括在金属基板上形成多个穿孔。第一布线层经由第一绝缘层在金属基板的一侧上形成，并且第二布线层经由第二绝缘层形成在金属基板的另一侧上。在多个穿孔中的至少一些穿孔中形成导体层，以建立第一布线层和第二布线层之间的连接。电路元件连接到金属基板的一侧上的第一布线层。当形成多个穿孔时，至少沿着设置有导体层的每个穿孔的任一边缘，在金属基板的表面上形成突起，以从金属基板的表面凸出突出。

8. 发明授权

US07683266B2 Circuit board and circuit apparatus using the same 失效
标题翻译：电路板及使用该电路的电路设备
公开(公告)号：US07683266B2
公开(公告)日：2010-03-23
申请号：US11494744
申请日：2006-07-28
申请人： Kiyoshi Shibata , Ryosuke Usui , Yasunori Inoue
发明人： Kiyoshi Shibata , Ryosuke Usui , Yasunori Inoue
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K3/445 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H05K1/056 , H05K3/0047 , H05K3/44 , H05K2201/0382 , H05K2201/09054 , H05K2201/09609 , H05K2201/0969 , H05K2203/0323 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165
摘要： A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are formed on the top ends of the pierced holes, and depressions are formed in the bottom ends of the pierced holes. Wiring pattern layers are formed on both sides of this metal substrate via respective insulating layers. In order to establish electrical connection between the wiring pattern layers, a conductor layer which connects the wiring pattern layers is formed through the metal substrate via the pierced holes. The conductor layer thereby establishes electrical conduction between the wiring pattern layers. Furthermore, a semiconductor chip is directly connected to the surface side of the circuit board via solder balls.
摘要翻译：一种电路板和使用该电路板的电路装置，其可以防止由于热膨胀而引起的位移和膜剥落，并且抑制在升高的温度下的可靠性降低。电路装置的电路板包括具有穿孔作为芯构件的金属基板。在穿孔的顶端形成突起，在穿孔的底端形成凹部。接线图案层通过各自的绝缘层形成在该金属基板的两侧上。为了建立布线图案层之间的电连接，通过穿孔穿过金属基板形成连接布线图案层的导体层。导体层由此在布线图案层之间建立导电。此外，半导体芯片通过焊球直接连接到电路板的表面侧。

9. 发明授权

US4386845A Electrostatic copying apparatus 失效
标题翻译：静电复印机
公开(公告)号：US4386845A
公开(公告)日：1983-06-07
申请号：US220721
申请日：1980-12-29
申请人： Yoshitake Miyoshi , Kiyoshi Shibata , Toshio Watanabe , Masami Kai , Yousuke Ohata
发明人： Yoshitake Miyoshi , Kiyoshi Shibata , Toshio Watanabe , Masami Kai , Yousuke Ohata
IPC分类号： G03G15/00 , G03G21/12 , G03G21/00
CPC分类号： B82Y15/00 , G03G15/70 , G03G21/0047 , G03G21/12
摘要： An electrostatic copying apparatus is provided wherein a stationary original document image is projected onto a photosensitive member during movement of an optical device for exposure. An electrostatic latent image formed on the photosensitive member is transferred onto a copy sheet and is fixed. A jam detecting means is provided for immediately detecting a copy sheet being jammed along a transport path. A cleaning device removes residual toner particles remaining on the photosensitive member by means of magnetic force and stores the removed toner particles after a transferring operation. The occurrence of a jam is detected immediately, and thus a fault or an accident of the electrostatic copying apparatus due to the jam is prevented from continuing.
摘要翻译：提供了一种静电复印装置，其中在用于曝光的光学装置的移动期间将静止原稿图像投影到感光构件上。形成在感光构件上的静电潜像被转印到复印纸上并被固定。提供卡纸检测装置，用于立即检测沿传送路径卡住的复印纸。清洁装置通过磁力去除残留在感光构件上的残留调色剂颗粒，并在转印操作之后存储去除的调色剂颗粒。立即检测到卡纸的发生，从而防止由于卡纸而导致的静电复印设备的故障或事故继续。

10. 发明授权

US4362502A Fixing and heating device for electrostatic copying apparatus 失效
标题翻译：静电复印设备固定加热装置
公开(公告)号：US4362502A
公开(公告)日：1982-12-07
申请号：US298771
申请日：1981-09-02
申请人： Minoru Motomura , Kiyoshi Shibata , Toshio Watanabe
发明人： Minoru Motomura , Kiyoshi Shibata , Toshio Watanabe
IPC分类号： G03G15/20 , G03G15/00 , F27B9/28
CPC分类号： G03G15/2064 , Y10T74/19014 , Y10T74/19056
摘要： A fixing and heating device for an electrostatic copying apparatus includes a fixing roller which (a) remains stationary at least until a toner is softened, (b) is driven at a low speed to even the surface temperature of the fixing roller when the surface temperature is lower than a temperature suitable for fixing when the surface temperature and is equal to the temperature suitable for fixing except during a fixing operation, and (c) is driven at a speed suitable for fixing when the surface temperature is suitable for fixing during the fixing operation.
摘要翻译：一种用于静电复印设备的固定和加热装置包括定影辊，（a）至少直到调色剂软化为止保持静止，（b）当表面温度低于定影辊的表面温度时，以低速驱动至甚至表面温度低于适于固定的温度，除了在定影操作期间，表面温度等于适合于固定的温度，和（c）当表面温度适合于定影期间固定时，以适于固定的速度驱动操作。

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