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1. 发明申请

US20050103270A1 Port structure in semiconductor processing system 失效
标题翻译：半导体处理系统中的端口结构
公开(公告)号：US20050103270A1
公开(公告)日：2005-05-19
申请号：US10503940
申请日：2003-02-17
申请人： Tetsuo Yoshida , Yoshiaki Sasaki , Hiroaki Saeki , Yasushi Taniyama , Hiroshi Takizawa
发明人： Tetsuo Yoshida , Yoshiaki Sasaki , Hiroaki Saeki , Yasushi Taniyama , Hiroshi Takizawa
IPC分类号： B65G49/00 , H01L21/00 , H01L21/677 , C23C16/00
CPC分类号： H01L21/67017 , H01L21/67772 , Y10S414/135 , Y10S414/137
摘要： In a port structure 16A in a semiconductor processing system 2, a door 20A is disposed in a port 12A defined by upright wall 52 and 54. A table 48 opposed to the port is disposed outside the system. Defined on the table is a mount region 76 for mounting an open type cassette 18A for a process subject substrate W. A hood 50 is disposed rotatable relative to the table. The hood defines in its closed position a closed space surrounding the mount region and port, the space having a size to receive the cassette. First ventholes 58 are formed in the upright walls and/or the door so as to introduce gas from within the system into the closed space in the hood. Second ventholes 72 are formed in the table so as to discharge the gas can be discharged out of the closed space.
摘要翻译：在半导体处理系统2中的端口结构16A中，门20A设置在由直立壁52和54限定的端口12A中。与该端口相对的一个表48设置在系统外部。在桌子上定义的是安装区域76，用于安装用于处理对象衬底W的打开型盒18A。罩50可相对于桌子旋转设置。罩在其关闭位置限定围绕安装区域和端口的封闭空间，该空间具有用于容纳盒的尺寸。第一通气孔58形成在直立壁和/或门中，以将来自系统内的气体引入罩内的封闭空间。第二通气孔72形成在工作台中，以便排出气体可以排出封闭空间。

2. 发明授权

US07279067B2 Port structure in semiconductor processing system 失效
标题翻译：半导体处理系统中的端口结构
公开(公告)号：US07279067B2
公开(公告)日：2007-10-09
申请号：US10503940
申请日：2003-02-17
申请人： Tetsuo Yoshida , Yoshiaki Sasaki , Hiroaki Saeki , Yasushi Taniyama , Hiroshi Takizawa
发明人： Tetsuo Yoshida , Yoshiaki Sasaki , Hiroaki Saeki , Yasushi Taniyama , Hiroshi Takizawa
IPC分类号： C23F1/00 , H01L21/306 , C23C16/00 , B65G49/07
CPC分类号： H01L21/67017 , H01L21/67772 , Y10S414/135 , Y10S414/137
摘要： In a port structure 16A in a semiconductor processing system 2, a door 20A is disposed in a port 12A defined by upright wall 52 and 54. A table 48 opposed to the port is disposed outside the system. Defined on the table is a mount region 76 for mounting an open type cassette 18A for a process subject substrate W. A hood 50 is disposed rotatable relative to the table. The hood defines in its closed position a closed space surrounding the mount region and port, the space having a size to receive the cassette. First ventholes 58 are formed in the upright walls and/or the door so as to introduce gas from within the system into the closed space in the hood. Second ventholes 72 are formed in the table so as to discharge the gas can be discharged out of the closed space.
摘要翻译：在半导体处理系统2中的端口结构16A中，门20A设置在由直立壁52和54限定的端口12A中。与该端口相对的一个表48设置在系统外部。在桌子上定义的是安装区域76，用于安装用于处理对象衬底W的打开型盒18A。罩50可相对于桌子旋转设置。罩在其关闭位置限定围绕安装区域和端口的封闭空间，该空间具有用于容纳盒的尺寸。第一通气孔58形成在直立壁和/或门中，以将来自系统内的气体引入罩内的封闭空间。第二通气孔72形成在工作台中，以便排出气体可以排出封闭空间。

3. 发明授权

US06676356B2 Device for attaching target substrate transfer container to semiconductor processing apparatus 有权
标题翻译：用于将目标基板转移容器附着到半导体处理装置的装置
公开(公告)号：US06676356B2
公开(公告)日：2004-01-13
申请号：US09950640
申请日：2001-09-13
申请人： Hiroaki Saeki , Yoshiaki Sasaki , Yasushi Taniyama
发明人： Hiroaki Saeki , Yoshiaki Sasaki , Yasushi Taniyama
IPC分类号： H01J502
CPC分类号： H01L21/67775
摘要： A table for a transfer container is provided with an opening portion formed therein. A clamp is swingably supported on the lower side of the table. The clamp has a second engaging portion hook to project upward from the table through the opening portion, and to engage with the first engaging portion of the transfer container. A first actuator is disposed to apply a swing-driving force to the clamp. The first actuator has a reciprocation rod pivotally connected to the clamp, and is swingably supported on the lower side of the table.
摘要翻译：用于转移容器的工作台设置有形成在其中的开口部分。夹具可摆动地支撑在桌子的下侧。夹具具有第二接合部分钩，以从桌子向上突出穿过开口部分，并与转移容器的第一接合部分接合。第一致动器设置成向夹具施加摆动驱动力。第一致动器具有枢转地连接到夹具的往复杆，并且可摆动地支撑在工作台的下侧。

4. 发明授权

US06984097B1 Mounting/demounting device for wafer carrier lid 失效
标题翻译：晶圆托架盖的安装/拆卸装置
公开(公告)号：US06984097B1
公开(公告)日：2006-01-10
申请号：US10019227
申请日：2000-06-28
申请人： Hiroaki Saeki , Yoshiaki Sasaki , Keiichi Matsushima , Yasushi Taniyama , Shuuji Hagiwara
发明人： Hiroaki Saeki , Yoshiaki Sasaki , Keiichi Matsushima , Yasushi Taniyama , Shuuji Hagiwara
IPC分类号： B65G49/07
CPC分类号： H01L21/50 , H01L21/67772 , H01L21/67775
摘要： An attaching and removing unit of a lid for a wafer carrier according to the invention includes: a lid holding plate that can move forward and backward relatively to a lid for a wafer carrier provided with a lock unit having a keyhole exposed outside, on a side of the keyhole; a driver for causing the lid holding plate to move forward and backward; and a key element protruding from the lid holding plate on a side of the lid in a pivotable manner, the key element disposed opposite the keyhole in a direction of the forward and backward movement. The lock unit is adapted to be locked and unlocked by the key element pivoting in the keyhole. In a locked state, the key element can be inserted into and released from the keyhole, and in an unlocked state, the key element is engaged with and can not be released from the keyhole, while the lid holding plate holds the lid. The lid holding plate is provided with a lid-detecting unit for detecting whether the lid holding plate is holding the lid or not.
摘要翻译：根据本发明的用于晶片载体的盖的安装和拆卸单元包括：盖保持板，其能相对于晶片载体的盖子前后移动，所述盖板设置有具有在外侧露出的锁孔的锁定单元，的钥孔; 用于使盖保持板前后移动的驱动器; 以及从所述盖保持板在所述盖的侧面以可转动的方式突出的键元件，所述键元件在所述向前和向后移动的方向上与所述键孔相对设置。锁定单元适于通过在键孔中枢转的键元件来锁定和解锁。在锁定状态下，键元件可以插入钥匙孔中并从钥匙孔释放，并且在解锁状态下，当盖子保持板握住盖子时，钥匙元件与钥匙孔接合并且不能从钥匙孔释放。盖保持板设置有用于检测盖保持板是否保持盖的盖检测单元。

5. 发明授权

US06328864B1 Vacuum processing apparatus 失效
标题翻译：真空加工设备
公开(公告)号：US06328864B1
公开(公告)日：2001-12-11
申请号：US09055904
申请日：1998-04-07
申请人： Shigeru Ishizawa , Yoshiaki Sasaki , Keisuke Kondoh , Tetsuo Yoshida
发明人： Shigeru Ishizawa , Yoshiaki Sasaki , Keisuke Kondoh , Tetsuo Yoshida
IPC分类号： C23C1400
CPC分类号： H01L21/67167 , C23C14/564 , C23C14/568 , C23C16/4408 , C23C16/54 , H01L21/67017
摘要： A vacuum processing apparatus includes a transfer chamber filled with a gas to have an upper limit of a target pressure range, a gas supply system connected to a gas supply source to supply the gas into the transfer chamber, a gas exhaust system for releasing the gas from within the transfer chamber, first and second vacuum chambers connected to the transfer chamber, first and second gate valves interposed between the transfer chamber and the vacuum chambers, which selectively permit the transfer chamber and the vacuum chambers to communicate with each other and a transfer mechanism for transferring a target object from the first vacuum chamber to the transfer chamber via the first gate valve and for transferring the target object from the transfer chamber to the second vacuum chamber via the second gate valve. An opening/closing valve is provided in the gas supply system for selectively supplying the gas from the gas supply source into the transfer chamber, a gas loading space being defined upstream of the opening/closing valve to permit the gas having a volume and pressure set in accordance with the upper limit of a target pressure range to be stored in the gas loading space when the opening/closing valve is closed.
摘要翻译：真空处理装置包括：填充有气体的传送室，其具有目标压力范围的上限;连接到气体供给源的气体供给系统，用于将气体供给到传送室;气体排出系统，用于释放气体在传送室内，连接到传送室的第一和第二真空室，介于传送室和真空室之间的第一和第二闸阀，其选择性地允许传送室和真空室彼此连通并传送用于经由第一闸阀将目标物体从第一真空室传送到传送室的机构，用于经由第二闸阀将目标物体从传送室传送到第二真空室。在气体供应系统中设置一个开/关阀，用于选择性地将气体从气体供应源供应到传送室中，气体装载空间限定在开/关阀的上游，以允许具有体积和压力的气体根据打开/关闭阀关闭时要存储在气体装载空间中的目标压力范围的上限。

6. 发明申请

US20070009085A1 Enclosure inspection method and apparatus thereof 有权
标题翻译：外壳检查方法及其装置
公开(公告)号：US20070009085A1
公开(公告)日：2007-01-11
申请号：US11452525
申请日：2006-06-14
申请人： Chiko Otani , Yoshiaki Sasaki , Gosei Okazaki , Kazunori Ninomiya , Masahiro Yamashita , Kengo Takahashi , Atsushi Takasuka , Toru Kitaguchi
发明人： Chiko Otani , Yoshiaki Sasaki , Gosei Okazaki , Kazunori Ninomiya , Masahiro Yamashita , Kengo Takahashi , Atsushi Takasuka , Toru Kitaguchi
IPC分类号： G01N23/04
CPC分类号： G01N21/3581 , G01N21/3563 , G01N22/00 , G01T1/1603 , G01V5/0033
摘要： In an enclosure inspection apparatus 11, when a sealed letter 2 is inputted into a sealed letter loading station A, visual inspecting means 27 and X-ray inspecting means 33 determine thickness of the sealed letter and whether an enclosure in the sealed letter is a predetermined suspected object. The sealed letter not less than a predetermined thickness is rejected in first sorting station D, and the sealed letter which is not thicker than the predetermined thickness and in which the suspected object is not detected is conveyed as it is to second sorting station G. As for the sealed letter which is not thicker than the predetermined thickness and in which the suspected object is detected, after the suspected object in the sealed letter is positioned in a positioning station E, a suspected object inspecting station F determines whether the above-described suspected object is a predetermined object, such as an explosive or a narcotic drug, using a terahertz wave. It is possible to detect promptly the presence of the objects even if there are a large number of sealed letters.
摘要翻译：在外壳检查装置11中，当将密封字母2输入到密封信函装载站A中时，目视检查装置27和X射线检查装置33确定密封字母的厚度以及密封字母中的外壳是否是预定的怀疑对象。在第一分拣站D中拒绝不小于预定厚度的密封字母，并且将未被检测到可疑物体的不厚于预定厚度的密封字母原样传送到第二分拣站G. 对于不厚于预定厚度并且其中检测到可疑物体的密封字母，在密封字母中的可疑物体位于定位站E中之后，疑似物体检查站F确定上述可疑物体物体是使用太赫兹波的预定物体，例如爆炸物或麻醉药物。即使有大量的密封字母，也可以及时检测物体的存在。

7. 发明申请

US20090087542A1 FILM POSITION ADJUSTING METHOD, MEMORY MEDIUM AND SUBSTRATE PROCESSING SYSTEM 有权
标题翻译：电影位置调整方法，记忆媒体和基板处理系统
公开(公告)号：US20090087542A1
公开(公告)日：2009-04-02
申请号：US12298570
申请日：2007-04-26
申请人： Yoshiaki Sasaki , Hirofumi Yamaguchi
发明人： Yoshiaki Sasaki , Hirofumi Yamaguchi
IPC分类号： C23C16/52
CPC分类号： H01L21/681 , C23C16/04 , C23C16/52 , H01L21/67259 , H01L21/67288
摘要： A substrate processing system includes a processing chamber 12, and an orienter 16 centering a wafer W. The orienter 16 is provided with an orienter sensor 42 measuring a central position discrepancy of the wafer W, and an image sensor 41 measuring a width of a non-film forming portion at circumferential portions of the wafer W. After a film deposition processing in the processing chamber 12, the wafer W is loaded into the orienter 16 where a central position discrepancy of the wafer W is measured, and the wafer W is then centered. Further, the width of the non-film forming portion of the wafer W is measured, and a film position discrepancy is calculated based on the width of the non-film forming portion. To correct the calculated film position discrepancy, a target transfer position of the wafer W on a mounting table 13 in the processing chamber 12 is adjusted.
摘要翻译：基板处理系统包括处理室12和定向晶片W定向器16.定向器16设置有测量晶片W的中心位置偏差的定向传感器42和测量晶片W的宽度的图像传感器41，在晶片W的圆周部分处形成膜。在处理室12中进行成膜处理之后，将晶片W装载到定向器16中，其中测量晶片W的中心位置差异，然后晶片W 居中此外，测量晶片W的非成膜部分的宽度，并且基于非成膜部分的宽度计算膜位置差异。为了校正计算出的胶片位置偏差，调整处理室12中的安装台13上的晶片W的目标转印位置。

8. 发明授权

US06224679B1 Controlling gas in a multichamber processing system 有权
标题翻译：在多室处理系统中控制气体
公开(公告)号：US06224679B1
公开(公告)日：2001-05-01
申请号：US09131280
申请日：1998-08-10
申请人： Yoshiaki Sasaki , Teruo Asakawa
发明人： Yoshiaki Sasaki , Teruo Asakawa
IPC分类号： C23C1600
CPC分类号： H01L21/67017 , B08B5/00 , H01L21/67772 , Y10S414/135
摘要： A wafer processing system comprises a container-housing chamber for housing the conveying container conveyed from the common area, a cleaning chamber disposed adjacent to the container-housing chamber, and a load-lock chamber disposed adjacent to the cleaning chamber. The cleaning chamber has an inlet line for introducing a clean gas into the cleaning chamber and a pressure control means for controlling the pressure in the cleaning chamber. The load-lock chamber has a conveying unit capable of extending to the container-housing chamber through the cleaning chamber, in order to take out the object from the conveying container housed in the container-housing chamber to the load-lock chamber through the cleaning chamber.
摘要翻译：晶片处理系统包括用于容纳从公共区域输送的输送容器的容器容纳室，邻近容器容纳室设置的清洁室和邻近清洁室设置的装载锁定室。清洁室具有用于将清洁气体引入清洁室的入口管线和用于控制清洁室中的压力的压力控制装置。负载锁定室具有能够通过清洁室延伸到容器容纳室的输送单元，以便通过清洁将物体从容纳在容器容纳室中的输送容器取出到装载锁定室房间。

9. 发明授权

US4482382A Pouring repair material for mortar or the like wall 失效
标题翻译：浇筑砂浆或类似墙体的修补材料
公开(公告)号：US4482382A
公开(公告)日：1984-11-13
申请号：US494933
申请日：1983-05-16
申请人： Hisayasu Kanayama , Yoshiaki Sasaki , Naoki Furuno , Yoshitaka Sasaoka , Osamu Tokita
发明人： Hisayasu Kanayama , Yoshiaki Sasaki , Naoki Furuno , Yoshitaka Sasaoka , Osamu Tokita
IPC分类号： C04B28/08 , C04B28/02 , E04G23/02 , C04B7/35
CPC分类号： C04B28/02 , C04B2111/72 , Y02W30/94
摘要： The pouring repair material for mortar or the like wall characterized in that it consists essentially of a synthetic resin emulsion, cement and slags with particle size less than 0.5 mm, and in that the weight ratios P/C, C/S and W/C are adjusted to 0.1 to 3, 1.5 to 2.5 and 0.35 to 0.40, wherein P designates solid contents of the synthetic resin, C cement, S slags and W water.
摘要翻译：用于砂浆等的浇注修补材料，其特征在于，其基本上由合成树脂乳液，水泥和粒度小于0.5mm的炉渣组成，并且重量比P / C，C / S和W / C 调整为0.1至3,1.5至2.5和0.35至0.40，其中P表示合成树脂，C水泥，S炉渣和W水的固体含量。

10. 发明申请

US20060219171A1 Substrate processing apparatus 有权
公开(公告)号：US20060219171A1
公开(公告)日：2006-10-05
申请号：US11391390
申请日：2006-03-29
申请人： Yoshiaki Sasaki , Yusuke Muraki , Eiichi Nishimura , Yuko Ono
发明人： Yoshiaki Sasaki , Yusuke Muraki , Eiichi Nishimura , Yuko Ono
IPC分类号： C23F1/00 , H01L21/306 , C23C16/00
CPC分类号： H01L21/67742 , C23C16/4412 , C23C16/54 , H01L21/67017
摘要： In a substrate processing apparatus comprising a processing unit where a specific type of processing is executed on a wafer and a transfer chamber through which a wafer is carried into/out of the processing unit, the transfer chamber includes an air intake unit through which external air is drawn into the transfer chamber, a discharge unit disposed so as to face opposite the air intake unit, through which the discharge gas in the transfer chamber is discharged and a discharge gas filtering means disposed at the discharge unit and constituted with a harmful constituent eliminating filter through which a harmful constituent contained in the discharge gas, at least, is eliminated.

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