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    • 2. 发明授权
    • Film position adjusting method, memory medium and substrate processing system
    • 胶片位置调整方法,记忆介质和底物处理系统
    • US08318238B2
    • 2012-11-27
    • US12298570
    • 2007-04-26
    • Yoshiaki SasakiHirofumi Yamaguchi
    • Yoshiaki SasakiHirofumi Yamaguchi
    • C23C16/52C23C16/00
    • H01L21/681C23C16/04C23C16/52H01L21/67259H01L21/67288
    • A substrate processing system includes a processing chamber 12, and an orienter 16 centering a wafer W. The orienter 16 is provided with an orienter sensor 42 measuring a central position discrepancy of the wafer W, and an image sensor 41 measuring a width of a non-film forming portion at circumferential portions of the wafer W. After a film deposition processing in the processing chamber 12, the wafer W is loaded into the orienter 16 where a central position discrepancy of the wafer W is measured, and the wafer W is then centered. Further, the width of the non-film forming portion of the wafer W is measured, and a film position discrepancy is calculated based on the width of the non-film forming portion. To correct the calculated film position discrepancy, a target transfer position of the wafer W on a mounting table 13 in the processing chamber 12 is adjusted.
    • 基板处理系统包括处理室12和定向晶片W定向器16.定向器16设置有测量晶片W的中心位置偏差的定向传感器42和测量晶片W的宽度的图像传感器41, 在晶片W的圆周部分处形成膜。在处理室12中进行成膜处理之后,将晶片W装载到定向器16中,其中测量晶片W的中心位置差异,然后晶片W 居中 此外,测量晶片W的非成膜部分的宽度,并且基于非成膜部分的宽度计算膜位置差异。 为了校正计算出的胶片位置偏差,调整处理室12中的安装台13上的晶片W的目标转印位置。