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    • 3. 发明授权
    • Vacuum processing apparatus
    • 真空加工设备
    • US06328864B1
    • 2001-12-11
    • US09055904
    • 1998-04-07
    • Shigeru IshizawaYoshiaki SasakiKeisuke KondohTetsuo Yoshida
    • Shigeru IshizawaYoshiaki SasakiKeisuke KondohTetsuo Yoshida
    • C23C1400
    • H01L21/67167C23C14/564C23C14/568C23C16/4408C23C16/54H01L21/67017
    • A vacuum processing apparatus includes a transfer chamber filled with a gas to have an upper limit of a target pressure range, a gas supply system connected to a gas supply source to supply the gas into the transfer chamber, a gas exhaust system for releasing the gas from within the transfer chamber, first and second vacuum chambers connected to the transfer chamber, first and second gate valves interposed between the transfer chamber and the vacuum chambers, which selectively permit the transfer chamber and the vacuum chambers to communicate with each other and a transfer mechanism for transferring a target object from the first vacuum chamber to the transfer chamber via the first gate valve and for transferring the target object from the transfer chamber to the second vacuum chamber via the second gate valve. An opening/closing valve is provided in the gas supply system for selectively supplying the gas from the gas supply source into the transfer chamber, a gas loading space being defined upstream of the opening/closing valve to permit the gas having a volume and pressure set in accordance with the upper limit of a target pressure range to be stored in the gas loading space when the opening/closing valve is closed.
    • 真空处理装置包括:填充有气体的传送室,其具有目标压力范围的上限;连接到气体供给源的气体供给系统,用于将气体供给到传送室;气体排出系统,用于释放气体 在传送室内,连接到传送室的第一和第二真空室,介于传送室和真空室之间的第一和第二闸阀,其选择性地允许传送室和真空室彼此连通并传送 用于经由第一闸阀将目标物体从第一真空室传送到传送室的机构,用于经由第二闸阀将目标物体从传送室传送到第二真空室。 在气体供应系统中设置一个开/关阀,用于选择性地将气体从气体供应源供应到传送室中,气体装载空间限定在开/关阀的上游,以允许具有体积和压力的气体 根据打开/关闭阀关闭时要存储在气体装载空间中的目标压力范围的上限。
    • 5. 发明申请
    • FILM POSITION ADJUSTING METHOD, MEMORY MEDIUM AND SUBSTRATE PROCESSING SYSTEM
    • 电影位置调整方法,记忆媒体和基板处理系统
    • US20090087542A1
    • 2009-04-02
    • US12298570
    • 2007-04-26
    • Yoshiaki SasakiHirofumi Yamaguchi
    • Yoshiaki SasakiHirofumi Yamaguchi
    • C23C16/52
    • H01L21/681C23C16/04C23C16/52H01L21/67259H01L21/67288
    • A substrate processing system includes a processing chamber 12, and an orienter 16 centering a wafer W. The orienter 16 is provided with an orienter sensor 42 measuring a central position discrepancy of the wafer W, and an image sensor 41 measuring a width of a non-film forming portion at circumferential portions of the wafer W. After a film deposition processing in the processing chamber 12, the wafer W is loaded into the orienter 16 where a central position discrepancy of the wafer W is measured, and the wafer W is then centered. Further, the width of the non-film forming portion of the wafer W is measured, and a film position discrepancy is calculated based on the width of the non-film forming portion. To correct the calculated film position discrepancy, a target transfer position of the wafer W on a mounting table 13 in the processing chamber 12 is adjusted.
    • 基板处理系统包括处理室12和定向晶片W定向器16.定向器16设置有测量晶片W的中心位置偏差的定向传感器42和测量晶片W的宽度的图像传感器41, 在晶片W的圆周部分处形成膜。在处理室12中进行成膜处理之后,将晶片W装载到定向器16中,其中测量晶片W的中心位置差异,然后晶片W 居中 此外,测量晶片W的非成膜部分的宽度,并且基于非成膜部分的宽度计算膜位置差异。 为了校正计算出的胶片位置偏差,调整处理室12中的安装台13上的晶片W的目标转印位置。
    • 7. 发明授权
    • Controlling gas in a multichamber processing system
    • 在多室处理系统中控制气体
    • US06224679B1
    • 2001-05-01
    • US09131280
    • 1998-08-10
    • Yoshiaki SasakiTeruo Asakawa
    • Yoshiaki SasakiTeruo Asakawa
    • C23C1600
    • H01L21/67017B08B5/00H01L21/67772Y10S414/135
    • A wafer processing system comprises a container-housing chamber for housing the conveying container conveyed from the common area, a cleaning chamber disposed adjacent to the container-housing chamber, and a load-lock chamber disposed adjacent to the cleaning chamber. The cleaning chamber has an inlet line for introducing a clean gas into the cleaning chamber and a pressure control means for controlling the pressure in the cleaning chamber. The load-lock chamber has a conveying unit capable of extending to the container-housing chamber through the cleaning chamber, in order to take out the object from the conveying container housed in the container-housing chamber to the load-lock chamber through the cleaning chamber.
    • 晶片处理系统包括用于容纳从公共区域输送的输送容器的容器容纳室,邻近容器容纳室设置的清洁室和邻近清洁室设置的装载锁定室。 清洁室具有用于将清洁气体引入清洁室的入口管线和用于控制清洁室中的压力的​​压力控制装置。 负载锁定室具有能够通过清洁室延伸到容器容纳室的输送单元,以便通过清洁将物体从容纳在容器容纳室中的输送容器取出到装载锁定室 房间。
    • 9. 发明授权
    • Mounting/demounting device for wafer carrier lid
    • 晶圆托架盖的安装/拆卸装置
    • US06984097B1
    • 2006-01-10
    • US10019227
    • 2000-06-28
    • Hiroaki SaekiYoshiaki SasakiKeiichi MatsushimaYasushi TaniyamaShuuji Hagiwara
    • Hiroaki SaekiYoshiaki SasakiKeiichi MatsushimaYasushi TaniyamaShuuji Hagiwara
    • B65G49/07
    • H01L21/50H01L21/67772H01L21/67775
    • An attaching and removing unit of a lid for a wafer carrier according to the invention includes: a lid holding plate that can move forward and backward relatively to a lid for a wafer carrier provided with a lock unit having a keyhole exposed outside, on a side of the keyhole; a driver for causing the lid holding plate to move forward and backward; and a key element protruding from the lid holding plate on a side of the lid in a pivotable manner, the key element disposed opposite the keyhole in a direction of the forward and backward movement. The lock unit is adapted to be locked and unlocked by the key element pivoting in the keyhole. In a locked state, the key element can be inserted into and released from the keyhole, and in an unlocked state, the key element is engaged with and can not be released from the keyhole, while the lid holding plate holds the lid. The lid holding plate is provided with a lid-detecting unit for detecting whether the lid holding plate is holding the lid or not.
    • 根据本发明的用于晶片载体的盖的安装和拆卸单元包括:盖保持板,其能相对于晶片载体的盖子前后移动,所述盖板设置有具有在外侧露出的锁孔的锁定单元, 的钥孔; 用于使盖保持板前后移动的驱动器; 以及从所述盖保持板在所述盖的侧面以可转动的方式突出的键元件,所述键元件在所述向前和向后移动的方向上与所述键孔相对设置。 锁定单元适于通过在键孔中枢转的键元件来锁定和解锁。 在锁定状态下,键元件可以插入钥匙孔中并从钥匙孔释放,并且在解锁状态下,当盖子保持板握住盖子时,钥匙元件与钥匙孔接合并且不能从钥匙孔释放。 盖保持板设置有用于检测盖保持板是否保持盖的盖检测单元。