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1. 发明授权

US4658494A Apparatus for drilling printed circuit boards 失效
标题翻译：印刷电路板钻孔设备
公开(公告)号：US4658494A
公开(公告)日：1987-04-21
申请号：US867553
申请日：1986-05-28
申请人： Tamio Ohtani , Yasuhiko Kanaya , Hiroshi Aoyama , Nobuyasu Nonaka
发明人： Tamio Ohtani , Yasuhiko Kanaya , Hiroshi Aoyama , Nobuyasu Nonaka
IPC分类号： B23Q3/155 , B23Q3/157 , B23Q17/00 , B23Q17/22 , G05B19/18 , G05B19/404 , H05K3/00
CPC分类号： B23Q3/15706 , B23Q17/006 , B23Q17/2233 , B23Q3/15526 , B23Q3/15713 , G05B19/182 , G05B19/404 , G05B2219/45035 , G05B2219/50185 , G05B2219/50253 , G05B2219/50291 , H05K3/0044 , H05K3/0047 , Y10T408/08 , Y10T408/14 , Y10T408/16 , Y10T408/21 , Y10T483/136 , Y10T483/1783 , Y10T483/1818
摘要： An apparatus for forming openings in printed circuit boards includes a work table for supporting the printed circuit boards, and at least one drilling unit movable relative to the work table. The apparatus uses drills each having a shank, a collar fitted around the shank at a predetermined position. For holding these drills, at least one first tool holding device is provided on the work table, and at least one second tool holding device of a magazine type for containing the drills parallel to each other is removably mounted above the work table. At least one transferring device is provided to operate to push a desired drill out of the second tool holding device of the magazine type, hold the pushed-out drill and transfer the same to a position where it is aligned with the drilling unit.
摘要翻译：一种用于在印刷电路板中形成开口的装置包括用于支撑印刷电路板的工作台以及可相对于工作台移动的至少一个钻孔单元。该装置使用每个具有柄的钻孔，在预定位置处装配在柄上的套环。为了保持这些钻头，在工作台上设置至少一个第一工具保持装置，并且用于容纳彼此平行的钻头的储料盒类型的至少一个第二工具保持装置可拆卸地安装在工作台的上方。提供至少一个传送装置用于操作以将期望的钻子推出钉仓类型的第二工具保持装置，保持推出钻头并将其传送到与钻孔单元对准的位置。

2. 发明申请

US20080145567A1 Laser Machining Method for Printed Circuit Board 审中-公开
标题翻译：印刷电路板激光加工方法
公开(公告)号：US20080145567A1
公开(公告)日：2008-06-19
申请号：US11950859
申请日：2007-12-05
申请人： Goichi OHMAE , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Goichi OHMAE , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： B05D3/06
CPC分类号： H05K3/465 , B23K26/364 , B23K26/389 , H05K3/0032 , H05K3/0035 , H05K3/107 , H05K2203/0557 , H05K2203/108
摘要： A printed circuit board manufacturing method by which the manufacturing time can be shortened and the manufacturing cost can be reduced. A printed circuit board has an insulating layer on its surface. Positions (first positions) of the printed circuit board where lands are disposed are irradiated with a CO2 laser beam (first laser beam) so as to form holes with a depth h from the surface. The printed circuit board is then scanned with an excimer laser beam (second laser beam) through a mask. The beam shape of the excimer laser beam is rectangular. Thus, holes reaching the lands are formed in the positions where the lands are disposed, and grooves for forming lines are formed (second positions). In this case, the holes reaching the lands may be formed by the CO2 laser beam.
摘要翻译：可以缩短制造时间并且可以降低制造成本的印刷电路板制造方法。印刷电路板在其表面上具有绝缘层。用CO 2激光束（第一激光束）照射布置有焊盘的印刷电路板的位置（第一位置），以形成距表面深度为h的孔。然后用准分子激光束（第二激光束）通过掩模扫描印刷电路板。准分子激光束的光束形状是矩形的。因此，在设置焊盘的位置形成到达焊盘的孔，形成用于形成线的槽（第二位置）。在这种情况下，到达焊盘的孔可以由CO 2激光束形成。

3. 发明授权

US5066171A Method for drilling a printed circuit board 失效
标题翻译：钻孔印刷电路板的方法
公开(公告)号：US5066171A
公开(公告)日：1991-11-19
申请号：US324769
申请日：1989-03-17
申请人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： B23B47/18 , B23B35/00 , B23B41/00 , B23B47/22 , B26F1/16 , H05K3/00
CPC分类号： B23B35/005 , H05K3/0047 , G05B2219/45129 , G05B2219/49047 , H05K2203/1536 , Y10T408/03 , Y10T408/23 , Y10T408/5623
摘要： In a method of and an apparatus for drilling a hole in a workpiece, a pressure foot associated with a drill is moved into contact with the workpiece, and a drill bit associated with the drill is moved from a drill-starting position into the workpiece, toward the drill-starting position and again into the workpiece while maintaining the pressure foot in constant contact with the workpiece. The drill is reciprocally fed by a plurality of times under the pressure of the pressure foot acting upon the printed circuit board. In either of the method and the apparatus, a hole with a high aspect ratio can be formed in a workpiece made from a thin, flexible material.

4. 发明授权

US4997319A Apparatus for drilling a hole in a printed circuit board 失效
标题翻译：用于在印刷电路板中钻孔的装置
公开(公告)号：US4997319A
公开(公告)日：1991-03-05
申请号：US394659
申请日：1989-08-16
申请人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： B23B47/18 , B23B35/00 , B23B41/00 , B23B47/22 , B26F1/16 , H05K3/00
CPC分类号： B23B35/005 , H05K3/0047 , G05B2219/45129 , G05B2219/49047 , H05K2203/1536 , Y10T408/03 , Y10T408/23 , Y10T408/5623
摘要： An apparatus for drilling a hole in a workpiece such as, for example, a printed circuit board wherein a pressure foot, associated with a drill, is moved into a position to exert a pressure on the workpiece. A drill bit associated with the drill is moved with respect to the workpiece, and an arrangement is provided for controlling the operations of the pressure foot and the drill bit in such a manner so as to move the drill bit from a drill starting position into the workpiece, then toward the drill starting position and again into the workpiece while maintaining the pressure exerted on the workpiece by the pressure foot.

5. 发明授权

US08075788B2 Fabrication method of printed circuit board and printed circuit board machining apparatus 有权
标题翻译：印刷电路板和印刷电路板加工设备的制造方法
公开(公告)号：US08075788B2
公开(公告)日：2011-12-13
申请号：US11987980
申请日：2007-12-06
申请人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： H05K3/06
CPC分类号： H05K3/465 , B23K26/0604 , B23K26/0661 , B23K26/0738 , B23K26/082 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2101/42 , B23K2103/16 , B23K2103/42 , B23K2103/50 , H05K3/0032 , H05K3/0035 , H05K3/045 , H05K3/107 , H05K3/16 , H05K3/4661 , H05K2201/0166 , H05K2201/09563 , H05K2203/0557 , H05K2203/108 , Y10T29/49155
摘要： A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.
摘要翻译：印刷电路板制造方法可以减少制造时间和制造成本。印刷电路板的制造方法包括以下步骤：在表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射导体图案的部分从绝缘层的表面出来。

6. 发明申请

US20080283491A1 Fabrication method of printed circuit board and printed circuit board machining apparatus 有权
标题翻译：印刷电路板和印刷电路板加工设备的制造方法
公开(公告)号：US20080283491A1
公开(公告)日：2008-11-20
申请号：US11987980
申请日：2007-12-06
申请人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： H01B13/00
CPC分类号： H05K3/465 , B23K26/0604 , B23K26/0661 , B23K26/0738 , B23K26/082 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2101/42 , B23K2103/16 , B23K2103/42 , B23K2103/50 , H05K3/0032 , H05K3/0035 , H05K3/045 , H05K3/107 , H05K3/16 , H05K3/4661 , H05K2201/0166 , H05K2201/09563 , H05K2203/0557 , H05K2203/108 , Y10T29/49155
摘要： There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.
摘要翻译：提供了剥离强度大的印刷电路板和允许制造时间和制造成本降低的印刷电路板制造方法和印刷电路板加工装置。印刷电路板的制造方法包括以下步骤：在其表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射导体图案的部分从绝缘层的表面出来。

7. 发明授权

US4872787A Method of drilling printed circuit board 失效
标题翻译：印刷电路板钻孔方法
公开(公告)号：US4872787A
公开(公告)日：1989-10-10
申请号：US106439
申请日：1987-10-09
申请人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： B23B47/18 , B23B35/00 , B23B41/00 , B23B47/22 , B26F1/16 , H05K3/00
CPC分类号： B23B35/005 , H05K3/0047 , G05B2219/45129 , G05B2219/49047 , H05K2203/1536 , Y10T408/03 , Y10T408/23 , Y10T408/5623
摘要： In a method of drilling a printed circuit board according to the present invention, an entry feed rate at which a drill is fed into the printed circuit boards during the initial stage of drilling is made slightly smaller than a drilling feed rate at which the drill is fed while it is drilling a hole through the printed circuit boards, so as to enhance the accuracy at which holes are located. One drilling operation includes a plurality of drilling feeds of the drill, and pulled-out positions of the drill which are reached by the drill between adjacent drilling feed rate are set within a range in which the pressure of a pressure foot is effective. This can prevent the stacked printed circuit boards from shifting and increase the accuracy at which the holes are located.
摘要翻译：在根据本发明的钻孔印刷电路板的方法中，钻头在初始阶段期间将钻头送入印刷电路板的入料速率略小于钻头的钻孔进给速率在通过印刷电路板钻孔时进给，以提高孔所在的精度。一次钻孔操作包括钻头的多个钻孔进给，并且由钻头在相邻的钻井进给速率之间达到的钻头的拉出位置设定在压脚的压力有效的范围内。这可以防止堆叠的印刷电路板移动并增加孔所在的精度。

8. 发明申请

US20140030417A1 TOMATO KETCHUP 有权
标题翻译：番茄酱
公开(公告)号：US20140030417A1
公开(公告)日：2014-01-30
申请号：US14008698
申请日：2012-03-30
申请人： Hiroshi Aoyama , Atsunobu Fujii , Yuki Kaneko , Shin Koike
发明人： Hiroshi Aoyama , Atsunobu Fujii , Yuki Kaneko , Shin Koike
IPC分类号： A23L1/24
CPC分类号： A23L27/63 , A23L23/00 , A23L27/45
摘要： A tomato ketchup containing the following components (A) to (C): (A) saccharidefrom 12 to 31 mass %, (B) potassiumfrom 0.6 to 1.9 mass %, and (C) sodiumfrom 0.1 to 1.55 mass %.
摘要翻译：含有以下组分（A）至（C）的番茄酱：（A）12至31质量％的糖，（B）0.6至1.9质量％的钾，和（C）0.1至1.55质量％的钠。

9. 发明申请

US20120129669A1 COMPOSITE MATERIAL ROLLER 审中-公开
标题翻译：复合材料滚子
公开(公告)号：US20120129669A1
公开(公告)日：2012-05-24
申请号：US13383778
申请日：2010-02-22
申请人： Hiroshi Aoyama , Takahiko Sawada
发明人： Hiroshi Aoyama , Takahiko Sawada
IPC分类号： F16C13/00 , B32B1/04
CPC分类号： F16C13/006 , B29C53/58 , B29C63/06 , B29C63/10 , B29C63/14 , B29C70/22 , B29C70/222 , B29C70/32 , B29C70/48 , B29C70/86 , B29K2311/10 , B32B1/08 , B32B5/026 , B32B5/26 , B32B2250/20 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/062 , E06C5/04 , F16C2350/00 , Y10T428/31515
摘要： A composite material roller that itself rotates comprises a cylindrical laminate 1 of fiber-knitted cloths 2 impregnated with resin; and a sheet 4, formed of a fiber different from that of the laminate 1, for covering the rotary surface of the laminate 1. The longitudinal elastic modulus of the fiber in the cloths 2 is made lower than that of the resin in the cloths 2. Also, the rigidity of the fiber in the cloths 2 is made lower than that of the resin in cloths 2. The above configuration reduces the contract pressure between the composite material roller and a structure on which the roller slides.
摘要翻译：本身旋转的复合材料辊包括用树脂浸渍的纤维编织布2的圆柱形层压体1; 以及由不同于层压体1的纤维形成的用于覆盖层压体1的旋转表面的片材4.布2中的纤维的纵向弹性模量比布2中的树脂的纵向弹性模量低此外，布2中的纤维的刚性比布2中的树脂低。上述构造降低了复合材料辊与辊滑动的结构之间的收缩压力。

10. 发明申请

US20110228537A1 Adjustable Beam Size Illumination Optical Apparatus and Beam Size Adjusting Method 审中-公开
标题翻译：可调节光束尺寸照明光学装置和光束尺寸调整方法
公开(公告)号：US20110228537A1
公开(公告)日：2011-09-22
申请号：US13049089
申请日：2011-03-16
申请人： Keiko YOSHIMIZU , Hiroshi Aoyama , Shigenobu Maruyama , Yasuhiro Yoshitake
发明人： Keiko YOSHIMIZU , Hiroshi Aoyama , Shigenobu Maruyama , Yasuhiro Yoshitake
IPC分类号： F21V5/04
CPC分类号： G02B27/0955
摘要： An adjustable beam size illumination optical apparatus includes a beam size adjusting optical system which includes groups of cylindrical array lenses disposed correspondingly to the long and short axis directions respectively and having variable intervals among the lenses, and a group of cylindrical telescope lenses disposed correspondingly to one of the long and short axis directions and having variable intervals among the lenses, and adjusts parallel light from a light source in size in accordance with the two axis directions orthogonal to each other. The lens interval of one of the cylindrical array lens groups and the cylindrical telescope lens group is changed to adjust a beam size on a projection surface in accordance with the long axis direction or the short axis direction. Thus, it is possible to adjust the beam size in accordance with the long axis direction and the short axis direction individually, and it is possible to make irradiation with the beam with uniform intensity.
摘要翻译：可调光束尺寸照明光学装置包括光束尺寸调整光学系统，该光束尺寸调整光学系统包括分别对应于长轴和短轴方向设置的圆柱形阵列透镜组，并且在透镜之间具有可变的间隔，以及一组圆柱形望远镜，其对应于一个并且在透镜中具有可变的间隔，并且根据彼此正交的两个轴方向来调整来自光源的尺寸的平行光。根据长轴方向或短轴方向，改变圆柱形阵列透镜组和圆柱形望远镜透镜组中的一个的透镜间隔，以调整投影表面上的光束尺寸。因此，可以分别根据长轴方向和短轴方向调整光束尺寸，并且可以以均匀的强度对光束进行照射。

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