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1. 发明授权

US08986069B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08986069B2
公开(公告)日：2015-03-24
申请号：US13459421
申请日：2012-04-30
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B9/00 , B24B1/00 , B24B21/00 , B24B9/06 , B24B37/04 , B24B37/30
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译：抛光装置抛光基板的周边。该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

2. 发明授权

US08187055B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08187055B2
公开(公告)日：2012-05-29
申请号：US12292662
申请日：2008-11-24
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B1/00 , B24B49/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译：抛光装置抛光基板的周边。该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

3. 发明申请

US20120208437A1 POLISHING APPARATUS AND POLISHING METHOD 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20120208437A1
公开(公告)日：2012-08-16
申请号：US13459421
申请日：2012-04-30
申请人： Tamami TAKAHASHI , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Tamami TAKAHASHI , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B49/00 , B24B21/20
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译：抛光装置抛光基板的周边。该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

4. 发明申请

US20090142992A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20090142992A1
公开(公告)日：2009-06-04
申请号：US12292662
申请日：2008-11-24
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B1/00 , B24B9/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译：本发明提供一种用于抛光基板周边的抛光装置。该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

5. 发明申请

US20080200100A1 Substrate Processing Apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US20080200100A1
公开(公告)日：2008-08-21
申请号：US11630512
申请日：2006-04-18
申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号： B24B9/06 , H01L21/304 , B24B49/12
CPC分类号： H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要： A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译：一种基板处理装置（1）包括：用于研磨基板周边部分的第一和第二研磨单元（70A，70B）;用于清洗基板（W）的主清洁单元（100），二次清洗以及用于干燥在主清洗单元（100）中清洁的基板（W）的干燥单元（110），以及用于测量基板（W）的周边部分的测量单元（30）。测量单元（30）包括用于在第一和第二研磨单元（70A和70B）中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构。

6. 发明授权

US09287158B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US09287158B2
公开(公告)日：2016-03-15
申请号：US11630512
申请日：2006-04-18
申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , H01L21/302 , H01L21/461 , H01L21/687 , B24B9/06 , B24B49/04 , H01L21/67
CPC分类号： H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要： A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译：基板处理装置包括：第一抛光单元，用于抛光基板周边部分;第一清洗单元，用于清洁基板;二次清洁和干燥单元，用于干燥在主清洗单元中清洁的基板;以及测量单元，测量衬底的周边部分。测量单元包括用于在第一和第二抛光单元中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构。

7. 发明授权

US08029333B2 Device for polishing peripheral edge of semiconductor wafer 有权
标题翻译：用于抛光半导体晶片周边边缘的装置
公开(公告)号：US08029333B2
公开(公告)日：2011-10-04
申请号：US11911808
申请日：2007-10-17
申请人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
发明人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
IPC分类号： B24B49/00
CPC分类号： B24B9/065 , B24B21/16
摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.
摘要翻译：用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

8. 发明申请

US20090093192A1 DEVICE FOR AND METHOD OF POLISHING PERIPHERAL EDGE OF SEMICONDUCTOR WAFER 有权
标题翻译：用于抛光半导体波形外围边缘的装置和方法
公开(公告)号：US20090093192A1
公开(公告)日：2009-04-09
申请号：US11911808
申请日：2006-04-18
申请人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
发明人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
IPC分类号： B24B9/00 , B24B49/12
CPC分类号： B24B9/065 , B24B21/16
摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.
摘要翻译：用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

9. 发明申请

US20090017733A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工设备
公开(公告)号：US20090017733A1
公开(公告)日：2009-01-15
申请号：US11629463
申请日：2006-04-18
申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号： B24B9/00
CPC分类号： B24B21/16 , B24B9/065 , H01L21/67046 , H01L21/67092 , H01L21/67161 , H01L21/6719 , H01L21/67219 , H01L21/67766 , H01L21/68707 , H01L21/68728 , H01L21/68792
摘要： A substrate processing apparatus (1) has a first polishing unit (400A) and a second polishing unit (400B) for polishing a peripheral portion of a substrate. Each of the two polishing units (400A, 400B) includes a bevel polishing device (450A, 450B) for polishing a peripheral portion of a substrate and a notch polishing device (480A, 480B) for polishing a notch of a substrate. The substrate processing apparatus (1) has a maintenance space (7) formed between the two polishing units (400A, 400B). The bevel polishing devices (450A, 450B) in the two polishing units (400A, 400B) face the maintenance space (7) so as to be accessible from the maintenance space (7).
摘要翻译：基板处理装置（1）具有用于研磨基板周边部分的第一研磨单元（400A）和第二研磨单元（400B）。两个抛光单元（400A，400B）中的每一个包括用于抛光基板的周边部分的斜面抛光装置（450A，450B）和用于抛光基板的凹口的凹口抛光装置（480A，480B）。基板处理装置（1）具有形成在两个研磨单元（400A，400B）之间的维护空间（7）。两个抛光单元（400A，400B）中的斜面抛光装置（450A，450B）面向维护空间（7），以便从维护空间（7）进入。

10. 发明申请

US20090117828A1 Polishing apparatus and substrate processing apparatus 有权
标题翻译：抛光装置和基板处理装置
公开(公告)号：US20090117828A1
公开(公告)日：2009-05-07
申请号：US10581669
申请日：2005-02-23
申请人： Akihisa Hongo , Kenya Ito , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Akihisa Hongo , Kenya Ito , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B49/04 , B24B1/04 , B24B49/12 , B24B9/02 , B24B57/02
CPC分类号： B24B37/02 , B24B9/065 , B24B21/002
摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (3) for forming a polishing chamber (2) therein, a rotational table (1) for holding and rotating a substrate (W), a polishing tape supply mechanism (6) for supplying a polishing tape (5) into the polishing chamber (2) and supplied to the polishing chamber (2), a polishing head (35) for pressing the polishing tape (5) against a bevel portion of the substrate (W), a liquid supply (50) for supplying a liquid to a front surface and a rear surface of the substrate (W), and a regulation mechanism (16) for making an internal pressure of the polishing chamber (2) being set to be lower than an external pressure of the polishing chamber (2).
摘要翻译：本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。抛光装置包括用于在其中形成研磨室（2）的壳体（3），用于保持和旋转基底（W）的旋转台（1），用于供应研磨带（5）的研磨带供给机构）到抛光室（2）中并供给到抛光室（2），用于将抛光带（5）压靠在基板（W）的斜面部分上的抛光头（35）将液体供给到所述基板（W）的前表面和后表面;以及调节机构（16），用于使所述研磨室（2）的内部压力被设定为低于所述研磨室（2）。

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