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1. 发明申请

US20080200100A1 Substrate Processing Apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US20080200100A1
公开(公告)日：2008-08-21
申请号：US11630512
申请日：2006-04-18
申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号： B24B9/06 , H01L21/304 , B24B49/12
CPC分类号： H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要： A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译：一种基板处理装置（1）包括：用于研磨基板周边部分的第一和第二研磨单元（70A，70B）;用于清洗基板（W）的主清洁单元（100），二次清洗以及用于干燥在主清洗单元（100）中清洁的基板（W）的干燥单元（110），以及用于测量基板（W）的周边部分的测量单元（30）。测量单元（30）包括用于在第一和第二研磨单元（70A和70B）中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构。

2. 发明申请

US20090017733A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工设备
公开(公告)号：US20090017733A1
公开(公告)日：2009-01-15
申请号：US11629463
申请日：2006-04-18
申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号： B24B9/00
CPC分类号： B24B21/16 , B24B9/065 , H01L21/67046 , H01L21/67092 , H01L21/67161 , H01L21/6719 , H01L21/67219 , H01L21/67766 , H01L21/68707 , H01L21/68728 , H01L21/68792
摘要： A substrate processing apparatus (1) has a first polishing unit (400A) and a second polishing unit (400B) for polishing a peripheral portion of a substrate. Each of the two polishing units (400A, 400B) includes a bevel polishing device (450A, 450B) for polishing a peripheral portion of a substrate and a notch polishing device (480A, 480B) for polishing a notch of a substrate. The substrate processing apparatus (1) has a maintenance space (7) formed between the two polishing units (400A, 400B). The bevel polishing devices (450A, 450B) in the two polishing units (400A, 400B) face the maintenance space (7) so as to be accessible from the maintenance space (7).
摘要翻译：基板处理装置（1）具有用于研磨基板周边部分的第一研磨单元（400A）和第二研磨单元（400B）。两个抛光单元（400A，400B）中的每一个包括用于抛光基板的周边部分的斜面抛光装置（450A，450B）和用于抛光基板的凹口的凹口抛光装置（480A，480B）。基板处理装置（1）具有形成在两个研磨单元（400A，400B）之间的维护空间（7）。两个抛光单元（400A，400B）中的斜面抛光装置（450A，450B）面向维护空间（7），以便从维护空间（7）进入。

3. 发明授权

US09287158B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US09287158B2
公开(公告)日：2016-03-15
申请号：US11630512
申请日：2006-04-18
申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , H01L21/302 , H01L21/461 , H01L21/687 , B24B9/06 , B24B49/04 , H01L21/67
CPC分类号： H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要： A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译：基板处理装置包括：第一抛光单元，用于抛光基板周边部分;第一清洗单元，用于清洁基板;二次清洁和干燥单元，用于干燥在主清洗单元中清洁的基板;以及测量单元，测量衬底的周边部分。测量单元包括用于在第一和第二抛光单元中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构。

4. 发明授权

US08029333B2 Device for polishing peripheral edge of semiconductor wafer 有权
标题翻译：用于抛光半导体晶片周边边缘的装置
公开(公告)号：US08029333B2
公开(公告)日：2011-10-04
申请号：US11911808
申请日：2007-10-17
申请人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
发明人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
IPC分类号： B24B49/00
CPC分类号： B24B9/065 , B24B21/16
摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.
摘要翻译：用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

5. 发明申请

US20090093192A1 DEVICE FOR AND METHOD OF POLISHING PERIPHERAL EDGE OF SEMICONDUCTOR WAFER 有权
标题翻译：用于抛光半导体波形外围边缘的装置和方法
公开(公告)号：US20090093192A1
公开(公告)日：2009-04-09
申请号：US11911808
申请日：2006-04-18
申请人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
发明人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
IPC分类号： B24B9/00 , B24B49/12
CPC分类号： B24B9/065 , B24B21/16
摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.
摘要翻译：用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

6. 发明授权

US08506362B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08506362B2
公开(公告)日：2013-08-13
申请号：US12667891
申请日：2008-07-08
申请人： Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
发明人： Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
IPC分类号： B24B7/26
CPC分类号： B24B21/002 , B24B9/065 , H01L21/02021
摘要： A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.
摘要翻译：抛光装置包括：基板保持器，其构造成保持和旋转基板;压垫，其构造成将具有抛光表面的抛光带压靠在由基板保持器保持的基板的斜面部分上;以及馈送机构，其构造成使抛光胶带沿其纵向行进。压垫包括具有用于通过研磨带挤压基板的斜面部分的按压表面的硬质部件和用于通过带状抛光工具将硬质部件压靠在基板的斜面部分上的至少一个弹性部件。

7. 发明授权

US07976361B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US07976361B2
公开(公告)日：2011-07-12
申请号：US12213186
申请日：2008-06-16
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
IPC分类号： B24B1/00
CPC分类号： B24B21/002 , B24B9/065 , H01L21/68707 , H01L21/68792
摘要： A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.
摘要翻译：抛光装置适用于抛光半导体晶片等基板的周边。抛光装置包括：保持部，其构造成保持工件;以及抛光头，其被配置为使研磨带与工件接触。抛光装置还包括供给卷轴，其构造成将抛光带供给到抛光头，构造成重绕与工件接触的研磨带的倒带卷轴和摆动机构，其构造成使抛光头与第一抛光头进行摆动运动，其枢轴在预定点。

8. 发明申请

US20090325465A1 POLISHING APPARATUS, POLISHING METHOD, AND PROCESSING APPARATUS 有权
标题翻译：抛光装置，抛光方法和加工装置
公开(公告)号：US20090325465A1
公开(公告)日：2009-12-31
申请号：US12310364
申请日：2007-10-02
申请人： Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
发明人： Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
IPC分类号： B24B49/12 , B24B21/18 , B24B9/08
CPC分类号： B24B21/20 , B24B21/004 , B24B21/04
摘要： The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).
摘要翻译：本发明提供一种抛光装置和抛光方法，其能够计算研磨带供给卷轴和抛光带回收卷轴上的研磨带的辊的外径，并且能够计算研磨带的剩余量和消耗量的研磨带的外径。该抛光装置包括：抛光带供给卷轴（46），研磨头（44），研磨带引出机构G1和被配置为回收研磨带的研磨带供给和恢复机构（45） 43）从研磨带供给卷轴（46）经由研磨头（44）。抛光带供给和恢复机构（45）包括电动机Mb，该电动机Mb适于向抛光带供给卷轴（46）施加扭矩，以便在穿过抛光头（3）的抛光带（43）上施加预定的张力 44）和适于检测研磨带供给卷轴（46）的旋转角度的旋转角度检测器REa。

9. 发明授权

US08047896B2 Polishing apparatus, polishing method, and processing apparatus 有权
标题翻译：抛光装置，抛光方法和处理装置
公开(公告)号：US08047896B2
公开(公告)日：2011-11-01
申请号：US12310364
申请日：2007-10-02
申请人： Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
发明人： Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
IPC分类号： B24B49/00 , B24B21/20
CPC分类号： B24B21/20 , B24B21/004 , B24B21/04
摘要： The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).
摘要翻译：本发明提供一种抛光装置和抛光方法，其能够计算研磨带供给卷轴和抛光带回收卷轴上的研磨带的辊的外径，并且能够计算研磨带的剩余量和消耗量的研磨带的外径。该抛光装置包括：抛光带供给卷轴（46），研磨头（44），研磨带引出机构G1和被配置为回收研磨带的研磨带供给和恢复机构（45） 43）从研磨带供给卷轴（46）经由研磨头（44）。抛光带供给和恢复机构（45）包括电动机Mb，该电动机Mb适于向抛光带供给卷轴（46）施加转矩，以便在穿过抛光头（3）的抛光带（43）上施加预定的张力 44）和适于检测研磨带供给卷轴（46）的旋转角度的旋转角度检测器REa。

10. 发明申请

US20090004952A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20090004952A1
公开(公告)日：2009-01-01
申请号：US12213186
申请日：2008-06-16
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
IPC分类号： B24B21/02 , B24B21/22
CPC分类号： B24B21/002 , B24B9/065 , H01L21/68707 , H01L21/68792
摘要： A polishing apparatus according to the present invention is suitable for use in polishing a periphery of a substrate such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold the workpiece, a polishing head configured to bring the polishing tape into contact with the workpiece, a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot lying on a predetermined point.
摘要翻译：根据本发明的抛光装置适用于抛光半导体晶片等基板的周边。抛光装置包括：保持部，其构造成保持工件;抛光头，被配置为使抛光带与工件接触;供给卷轴，其构造成将抛光带供给到抛光头;构造成倒带抛光的回卷卷轴已经接触到工件的胶带和摆动机构，其构造成使得抛光头在其枢轴位于预定点上时进行摆动运动。

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