专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08771510B2 Seawater desalination system and energy exchange chamber 有权
标题翻译：海水淡化系统和能量交换室
公开(公告)号：US08771510B2
公开(公告)日：2014-07-08
申请号：US13320351
申请日：2010-05-17
申请人： Tamami Takahashi , Masao Shinoda , Masato Eguchi , Masanori Goto
发明人： Tamami Takahashi , Masao Shinoda , Masato Eguchi , Masanori Goto
IPC分类号： B01D61/06 , B01D61/02 , C02F1/44 , B01D61/08 , B01D61/10
CPC分类号： B01D61/06 , B01D61/025 , B01D61/08 , B01D61/10 , B01D63/02 , B01D2313/246 , C02F1/441 , C02F2201/004 , C02F2303/10 , Y02A20/131 , Y02W10/30
摘要： A seawater desalination system which can solve a problem of wear of a sliding member and can suppress mixing of concentrated seawater and seawater by making an energy exchange chamber no-piston configuration is provided. In a seawater desalination system for producing fresh water from seawater by passing the seawater pressurized by a pump through a reverse-osmosis membrane-separation apparatus (4) to separate the seawater into fresh water and concentrated seawater, an energy exchange chamber (20) for utilizing pressure energy of the concentrated seawater discharged from the reverse-osmosis membrane-separation apparatus (3) as energy for pressurizing part of the seawater is provided. The energy exchange chamber includes a concentrated seawater port (P1) for introducing and discharging the concentrated seawater, a seawater port (P2) for introducing and discharging the seawater, and a plurality of partitioned fluid passages (R) provided in the chamber to allow the concentrated seawater port (P1) and the seawater port (P2) to communicate with each other.
摘要翻译：能够解决滑动构件的磨损问题的海水淡化系统，能够通过制造能量交换室无活塞构造来抑制浓缩海水和海水的混合。在通过使由泵加压的海水通过反渗透膜分离装置（4）将海水分离成淡水和浓缩海水的用于从海水生产淡水的海水淡化系统中，用于利用从反渗透膜分离装置（3）排出的浓缩海水的压力能作为对海水的一部分加压的能量。能量交换室包括用于引入和排出浓缩海水的集中海水口（P1），用于引入和排出海水的海水口（P2）和设置在室中的多个分隔流体通道（R），以允许集中海水口（P1）和海水口（P2）相互通信。

2. 发明授权

US08506362B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08506362B2
公开(公告)日：2013-08-13
申请号：US12667891
申请日：2008-07-08
申请人： Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
发明人： Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
IPC分类号： B24B7/26
CPC分类号： B24B21/002 , B24B9/065 , H01L21/02021
摘要： A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.
摘要翻译：抛光装置包括：基板保持器，其构造成保持和旋转基板;压垫，其构造成将具有抛光表面的抛光带压靠在由基板保持器保持的基板的斜面部分上;以及馈送机构，其构造成使抛光胶带沿其纵向行进。压垫包括具有用于通过研磨带挤压基板的斜面部分的按压表面的硬质部件和用于通过带状抛光工具将硬质部件压靠在基板的斜面部分上的至少一个弹性部件。

3. 外观设计

USD649126S1 Vacuum contact pad 有权
标题翻译：真空接触垫
公开(公告)号：USD649126S1
公开(公告)日：2011-11-22
申请号：US29334787
申请日：2009-04-01
申请人： Tamami Takahashi
设计人： Tamami Takahashi

4. 发明授权

US07976361B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US07976361B2
公开(公告)日：2011-07-12
申请号：US12213186
申请日：2008-06-16
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
IPC分类号： B24B1/00
CPC分类号： B24B21/002 , B24B9/065 , H01L21/68707 , H01L21/68792
摘要： A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.
摘要翻译：抛光装置适用于抛光半导体晶片等基板的周边。抛光装置包括：保持部，其构造成保持工件;以及抛光头，其被配置为使研磨带与工件接触。抛光装置还包括供给卷轴，其构造成将抛光带供给到抛光头，构造成重绕与工件接触的研磨带的倒带卷轴和摆动机构，其构造成使抛光头与第一抛光头进行摆动运动，其枢轴在预定点。

5. 发明申请

US20100178851A1 POLISHING APPARATUS AND POLISHING METHOD 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20100178851A1
公开(公告)日：2010-07-15
申请号：US12685793
申请日：2010-01-12
申请人： Masayuki NAKANISHI , Kenya Ito , Tamami Takahashi , Kumiko Miyamoto , Kenji Kodera
发明人： Masayuki NAKANISHI , Kenya Ito , Tamami Takahashi , Kumiko Miyamoto , Kenji Kodera
IPC分类号： B24B9/06 , B24B1/00 , B24B21/00
CPC分类号： B24B9/065 , B24B21/004
摘要： A polishing apparatus for polishing a periphery of a substrate includes a substrate holder configured to rotate the substrate, a first polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a first polishing tool into contact with the periphery of the substrate when rotated by the substrate holder, and a second polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a second polishing tool into contact with the periphery of the substrate when rotated by the substrate holder. The polishing layer of the first polishing tool has hard first abrasive grains, and the polishing layer of the second polishing tool has second abrasive grains that are softer than the first abrasive grains.
摘要翻译：用于抛光基板周边的抛光装置包括：基板保持器，其被构造成旋转基板;第一抛光部，其被配置为通过使第一抛光工具的抛光层与基板的周边接触来抛光基板的周边; 当被基板保持器旋转时，以及第二抛光部分，被配置为当第二抛光工具的抛光层与基板保持器旋转时与基板的周边接触，从而抛光基板的周边。第一研磨工具的抛光层具有硬的第一磨料颗粒，并且第二抛光工具的抛光层具有比第一磨料颗粒更软的第二磨料颗粒。

6. 发明申请

US20090325465A1 POLISHING APPARATUS, POLISHING METHOD, AND PROCESSING APPARATUS 有权
标题翻译：抛光装置，抛光方法和加工装置
公开(公告)号：US20090325465A1
公开(公告)日：2009-12-31
申请号：US12310364
申请日：2007-10-02
申请人： Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
发明人： Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
IPC分类号： B24B49/12 , B24B21/18 , B24B9/08
CPC分类号： B24B21/20 , B24B21/004 , B24B21/04
摘要： The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).
摘要翻译：本发明提供一种抛光装置和抛光方法，其能够计算研磨带供给卷轴和抛光带回收卷轴上的研磨带的辊的外径，并且能够计算研磨带的剩余量和消耗量的研磨带的外径。该抛光装置包括：抛光带供给卷轴（46），研磨头（44），研磨带引出机构G1和被配置为回收研磨带的研磨带供给和恢复机构（45） 43）从研磨带供给卷轴（46）经由研磨头（44）。抛光带供给和恢复机构（45）包括电动机Mb，该电动机Mb适于向抛光带供给卷轴（46）施加扭矩，以便在穿过抛光头（3）的抛光带（43）上施加预定的张力 44）和适于检测研磨带供给卷轴（46）的旋转角度的旋转角度检测器REa。

7. 发明申请

US20080200100A1 Substrate Processing Apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US20080200100A1
公开(公告)日：2008-08-21
申请号：US11630512
申请日：2006-04-18
申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号： B24B9/06 , H01L21/304 , B24B49/12
CPC分类号： H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要： A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译：一种基板处理装置（1）包括：用于研磨基板周边部分的第一和第二研磨单元（70A，70B）;用于清洗基板（W）的主清洁单元（100），二次清洗以及用于干燥在主清洗单元（100）中清洁的基板（W）的干燥单元（110），以及用于测量基板（W）的周边部分的测量单元（30）。测量单元（30）包括用于在第一和第二研磨单元（70A和70B）中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构。

8. 发明授权

US06889730B2 Hydraulic drive system 失效
标题翻译：液压驱动系统
公开(公告)号：US06889730B2
公开(公告)日：2005-05-10
申请号：US10467803
申请日：2001-02-13
申请人： Masao Shinoda , Shimpei Miyakawa , Chishiro Yamashina , Tamami Takahashi , Yoshihiro Mochizuki , Shinzo Mammoto , Shiro Kumazawa , Ryuji Kodama
发明人： Masao Shinoda , Shimpei Miyakawa , Chishiro Yamashina , Tamami Takahashi , Yoshihiro Mochizuki , Shinzo Mammoto , Shiro Kumazawa , Ryuji Kodama
IPC分类号： F15B1/26 , F15B21/04 , F15B21/06 , B65B1/04
CPC分类号： F15B21/06 , A23L3/00 , F15B1/26 , F15B21/041
摘要： A hydraulic drive system that does not cause a decrease in efficiency of actuators, does not hinder an optimal action of devices such as flow adjustment valves, and does not cause any corrosion of water acting as an operating fluid. The system uses water as an operating fluid. The system includes a hydraulic generation apparatus 40 including, a main tank 41, a return path 52, an accessory tank 54, and a water disposal apparatus 56 disposed in a path 57. The operating fluid from structuring devices of the processing apparatuses 10, 20 and 30 flows through the return path 52. The operating fluid flows from the accessory tank 54 to the main tank 41 through the path 57 and the water disposal apparatus 56.
摘要翻译：不会导致执行器的效率降低的液压驱动系统不妨碍诸如流量调节阀的装置的最佳作用，并且不会对作为工作流体的水造成任何腐蚀。该系统使用水作为工作流体。该系统包括液压发生装置40，其包括设置在路径57中的主箱41，返回路径52，附件箱54和水处理装置56。来自处理装置10,20和30的构造装置的工作流体流过返回路径52。工作流体通过路径57和水处理装置56从辅助箱54流向主箱41。

9. 发明授权

US06659121B1 Solenoid and hydraulic control valve 失效
标题翻译：电磁阀和液压控制阀
公开(公告)号：US06659121B1
公开(公告)日：2003-12-09
申请号：US10069998
申请日：2002-03-01
申请人： Tamami Takahashi , Chishiro Yamashina
发明人： Tamami Takahashi , Chishiro Yamashina
IPC分类号： F15B13044
CPC分类号： F16K31/0689 , F16K31/0613 , Y10T137/4245 , Y10T137/8013 , Y10T137/86622
摘要： A solenoid has a cylindrical excitation coil and a plunger movable in the excitation coil and generates electromagnetic force to move the plunger when an electric current is supplied to the excitation coil. A cover for closing a side of a plunger compartment accommodating the plunger is provided with upper and lower through-holes communicatively extending through the cover from the outside of the solenoid to the plunger compartment. The uppermost part of the upper through-hole is above or level with the uppermost part of the plunger compartment. The lowermost part of the lower through-hole is below or level with the lowermost part of the plunger compartment.
摘要翻译：螺线管具有圆柱形激励线圈和可在励磁线圈中移动的柱塞，并且当向励磁线圈提供电流时产生电磁力以移动柱塞。用于封闭容纳柱塞的柱塞室的一侧的盖设置有从螺线管的外部到柱塞隔室通过盖连通地延伸的上通孔和下通孔。上通孔的最上部分位于柱塞隔室的最上部或上方。下部通孔的最下部分位于柱塞隔室的最下部或下方。

10. 发明授权

US5704827A Polishing apparatus including cloth cartridge connected to turntable 失效
标题翻译：抛光设备包括连接到转盘的布料盒
公开(公告)号：US5704827A
公开(公告)日：1998-01-06
申请号：US544534
申请日：1995-10-18
申请人： Toyomi Nishi , Manabu Tsujimura , Tamami Takahashi , Hiromi Yajima , Riichiro Aoki , Yukio Imoto , Shoichi Kodama , Kazuaki Himukai , Gisuke Kouno , Takanobu Nishimura
发明人： Toyomi Nishi , Manabu Tsujimura , Tamami Takahashi , Hiromi Yajima , Riichiro Aoki , Yukio Imoto , Shoichi Kodama , Kazuaki Himukai , Gisuke Kouno , Takanobu Nishimura
IPC分类号： B24B37/20 , B24B37/24 , H01L21/304 , B24B5/00
CPC分类号： B24B37/12
摘要： A polishing apparatus includes a detachable light weight cloth cartridge which shows little deformation under uneven loading during a polishing operation. Either mechanical or non-mechanical fixation of the cloth cartridge to a turntable is achieved. Mechanical fixation involves attaching the cloth cartridge to the turntable at peripheral and center sections of the cloth cartridge. Non-mechanical fixation involves attaching the cloth cartridge to the turntable by a vacuum arrangement. The assembly of the cloth cartridge and the turntable not only produces excellent flatness on polished semiconductor wafers by maintaining a level polishing surface, but also improves the production yield by preventing breakage of wafers during the polishing process.
摘要翻译：抛光装置包括可拆卸轻量布料筒，其在抛光操作期间在不均匀载荷下几乎不变形。实现了布料盒到转台的机械或非机械固定。机械固定包括将布料盒连接到布料盒周边和中心部分的转台上。非机械固定包括通过真空装置将布料盒附接到转台上。布料盒和转盘的组装不仅通过保持抛光表面而在抛光的半导体晶片上产生优异的平整度，而且还通过防止抛光过程中的晶片破损而提高了生产率。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式