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    • 4. 发明授权
    • Developing method and developing apparatus
    • 开发方法和开发设备
    • US06491452B2
    • 2002-12-10
    • US09832205
    • 2001-04-11
    • Nobuo KonishiTakayuki ToshimaTsutae Omori
    • Nobuo KonishiTakayuki ToshimaTsutae Omori
    • G03D500
    • G03F7/32G03F7/3014G03F7/3021
    • When a resist film formed on a substrate is exposed in a predetermined pattern and thereafter an exposed pattern is developed, a substance capable of decreasing fluidity of the developing solution is added to the developing solution, the developing solution to which the substance is added is caused to become low-fluid under a predetermined condition, the developing solution is applied onto the exposed resist film on the substrate, and thereafter a predetermined trigger is given to the developing solution to cause the developing solution to become high-fluid so as to allow developing to progress. Thereby, line width can be made uniform and defects do not tend to occur during coating of the developing solution.
    • 当形成在基板上的抗蚀剂膜以预定图案曝光,然后曝光图案显影时,将能够降低显影液流动性的物质加入显影液中,引起添加物质的显影液 在预定条件下变成低流体,将显影液施加到基板上暴露的抗蚀剂膜上,然后给显影液赋予预定的触发剂,使显影液变成高流体,以使显影 进步。 因此,可以使线宽度均匀,并且在显影溶液的涂布期间不会发生缺陷。
    • 6. 发明授权
    • Silylation treatment unit and method
    • 甲硅烷基化处理装置及方法
    • US06872670B2
    • 2005-03-29
    • US10752556
    • 2004-01-08
    • Takayuki ToshimaTsutae OmoriMasami Yamashita
    • Takayuki ToshimaTsutae OmoriMasami Yamashita
    • H01L21/205G03F7/20G03F7/26H01L21/00H01L21/31
    • H01L21/67109G03F7/265G03F7/70991
    • A silylation treatment unit includes a chamber, a heating mechanism provided in this chamber for heating a substrate, a supplying mechanism for supplying a vapor including a silylation reagent into the chamber. The unit also has a substrate holder for holding the substrate in the chamber, in which an interval between the heating mechanism and the substrate is adjustable to at least three levels or more. The substrate is received such that it is least influenced by a heat in the chamber by maximizing the interval from the heating mechanism. The interval is brought comparatively closer to the heating mechanism to wait until the temperature inside the chamber obtains a high planer uniformity. The interval is brought further closer to the heating mechanism after a high planer uniformity is obtained such that a silylation reaction occurs.
    • 甲硅烷基化处理单元包括室,设置在该室中用于加热基板的加热机构,用于将包含甲硅烷基化试剂的蒸气供应到室中的供给机构。 该单元还具有用于将基板保持在室中的基板保持器,其中加热机构和基板之间的间隔可调节至少三级或更多级。 接收基板,使得其通过使来自加热机构的间隔最大化而受到室内热量的影响最小。 使间隔相对更靠近加热机构,等待室内温度获得高的平面均匀性。 在获得高平面均匀性之后,间隔进一步靠近加热机构,使得发生甲硅烷基化反应。
    • 7. 发明授权
    • Film forming apparatus and film forming method
    • 成膜装置及成膜方法
    • US06706322B2
    • 2004-03-16
    • US10062506
    • 2002-02-05
    • Kiyohisa TateyamaTsutae Omori
    • Kiyohisa TateyamaTsutae Omori
    • B05D312
    • H01L21/6715B05C11/08Y10T74/19074Y10T74/19102
    • A drive pulley is disposed to a driving motor. A plurality of follower pulleys are disposed to a rotating shaft of a spin chuck that vacuum sucks a substrate. A belt is passed from one follower pulley to the drive pulley. Belts are passed from the other follower pulleys to the drive shafts of a plurality of air motors. Since the air motors assist the driving of the driving motor, a large substrate can be rotated at a predetermined rotating acceleration. Thus, a film forming apparatus and a film forming method that allow the quantity of process solution supplied to be reduced and a film of process solution to be equally formed on a substrate can be provided.
    • 驱动皮带轮设置在驱动马达上。 多个从动带轮设置在旋转卡盘的旋转轴上,真空吸附基板。 皮带从一个从动轮传递到驱动皮带轮。 皮带从其他从动滑轮传递到多个气动马达的驱动轴。 由于空气马达有助于驱动马达的驱动,因此可以以预定的旋转加速度旋转大的基板。 因此,可以提供允许提供的处理溶液量减少并且可以在基板上同样形成处理溶液膜的成膜装置和成膜方法。
    • 8. 发明授权
    • Substrate processing method
    • 基板加工方法
    • US06306455B1
    • 2001-10-23
    • US09141721
    • 1998-08-27
    • Hideyuki TakamoriMasafumi NomuraTsutae Omori
    • Hideyuki TakamoriMasafumi NomuraTsutae Omori
    • B05D312
    • H01L21/67248B05C11/08B05D1/005H01L21/6838
    • A method of processing a substrate for forming a coating film on a substrate comprising the steps of (a) mounting a substrate on a temperature controlling means which is capable of having a heat influence on the substrate, and controlling temperature of the substrate by the temperature controlling means, (b) controlling temperature of a coating solution to be supplied to the substrate, (c) controlling temperature of a contact member in contact with the substrate when the substrate is transported and held, (d) detecting temperature of an atmosphere of a process space for applying the coating solution to the substrate, (e) setting a desired temperature on the basis of temperature/film-thickness data previously obtained by forming the coating film on the substrate, (f) controlling a temperature controlling operation of at least step (c) on the basis of the desired temperature set in the step (e) and the temperature detected in the step (d), and (g) applying the coating solution to the substrate.
    • 一种处理在基板上形成涂膜的基板的方法,包括以下步骤:(a)将基板安装在能够对基板产生热影响的温度控制装置上,并将基板的温度控制在温度 控制装置,(b)控制供给到基板的涂布液的温度,(c)控制基板被输送和保持时与基板接触的接触部件的温度,(d)检测温度, 用于将涂布溶液涂布到基板上的处理空间,(e)基于通过在基板上形成涂膜而获得的温度/膜厚度数据设定所需温度,(f)控制在基板上的温度控制操作 基于步骤(e)中设定的所需温度和步骤(d)中检测到的温度,最小步骤(c),和(g)将涂布溶液施加到副 策划