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1. 发明申请

US20170326866A1 De-bonding and Cleaning Process and System 审中-公开
公开(公告)号：US20170326866A1
公开(公告)日：2017-11-16
申请号：US15608709
申请日：2017-05-30
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Ying-Ching Shih , Jing-Cheng Lin , Szu-Wei Lu
IPC分类号： B32B43/00 , B32B38/10 , H01L23/00 , B32B38/16
CPC分类号： B32B43/006 , B32B38/10 , B32B38/162 , B32B38/1858 , B32B2310/0825 , B32B2310/0831 , B32B2310/0843 , B32B2457/14 , H01L21/02076 , H01L21/02079 , H01L21/02096 , H01L21/02098 , H01L21/67046 , H01L21/67051 , H01L21/6836 , H01L21/68785 , H01L24/96 , H01L2221/68327 , H01L2221/68381 , H01L2224/95001 , Y10S901/40 , Y10S901/43 , Y10T156/1111 , Y10T156/1158 , Y10T156/1917 , Y10T156/1928
摘要： Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

2. 发明申请

US20160257105A1 Decal Removal Assembly 审中-公开
标题翻译：贴花去除装配
公开(公告)号：US20160257105A1
公开(公告)日：2016-09-08
申请号：US14640248
申请日：2015-03-06
申请人： Craig Thompson , Pamela Thompson
发明人： Craig Thompson , Pamela Thompson
IPC分类号： B32B38/10 , B32B43/00
CPC分类号： B32B38/10 , B32B2310/049 , B32B2519/00 , B44C7/027 , Y10S156/929 , Y10S156/94 , Y10T156/1126 , Y10T156/1153 , Y10T156/1911 , Y10T156/1928
摘要： A decal removal assembly includes a plate that is structured to have a steam space extending therein. The plate may be positioned proximate a surface such that the steam space surrounds a decal adhered to the surface. A handle is attached to the plate and the handle is in fluid communication with the steam space. A nozzle is attached to the handle and the nozzle has a distal end with respect to the handle. The nozzle is in fluid communication with the steam space and the distal end may be fluidly coupled to a steam source. Steam from the steam source is directed into the steam space thereby facilitating removal of the decal from the surface. A plurality of couplers is provided and each of the couplers is attached to the plate. Each of the couplers engages the surface such that the plate is retained on the surface and each of the couplers is positioned proximate one of four corners of the plate.
摘要翻译：贴花去除组件包括被构造成具有在其中延伸的蒸汽空间的板。板可以靠近表面定位，使得蒸汽空间围绕附着在表面上的贴花。手柄连接到板上，手柄与蒸汽空间流体连通。喷嘴连接到手柄，并且喷嘴相对于手柄具有远端。喷嘴与蒸汽空间流体连通，并且远端可以流体地联接到蒸汽源。来自蒸汽源的蒸汽被引导到蒸汽空间中，从而有助于从表面去除贴花。提供多个耦合器并且每个耦合器附接到板。每个耦合器接合表面，使得板被保持在表面上，并且每个耦合器位于板的四个角中的一个附近。

3. 发明授权

US09427949B2 Peeling apparatus and stack manufacturing apparatus 有权
标题翻译：剥皮装置和堆垛制造装置
公开(公告)号：US09427949B2
公开(公告)日：2016-08-30
申请号：US14553227
申请日：2014-11-25
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi Takeshima
IPC分类号： B32B38/10 , B32B43/00 , B32B37/12 , B32B37/00 , H01L51/56 , B32B37/26 , H01L51/00
CPC分类号： B32B43/006 , B32B37/0053 , B32B37/025 , B32B37/12 , B32B37/1207 , B32B38/10 , B32B2037/1253 , B32B2037/268 , B32B2457/20 , B32B2457/208 , H01L27/322 , H01L27/323 , H01L27/3262 , H01L51/0013 , H01L51/003 , H01L51/524 , H01L51/5253 , H01L51/5284 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/5315 , H01L2251/5338 , Y10T156/1111 , Y10T156/1174 , Y10T156/1928 , Y10T156/195
摘要： The yield of a peeling process is improved. A peeling apparatus includes a structure body with a convex surface and a stage with a supporting surface which faces the convex surface. The structure body can hold a first member of a process member between the convex surface and the supporting surface. The stage can hold a second member of the process member. The radius of curvature of the convex surface is less than the radius of curvature of the supporting surface. The linear velocity of the convex surface is greater than or equal to the speed of a rotation center of the structure body passing the stage. The first member is wound along the convex surface to be separated from the second member.
摘要翻译：剥离过程的产率提高。剥离装置包括具有凸面的结构体和具有与凸面对置的支撑面的台。结构体可以在凸表面和支撑表面之间保持处理构件的第一构件。舞台可以容纳进程成员的第二个成员。凸面的曲率半径小于支撑面的曲率半径。凸面的线速度大于或等于通过平台的结构体的旋转中心的速度。第一构件沿凸形表面缠绕以与第二构件分离。

4. 发明申请

US20150258766A1 HANDLING OF EPOXY RESINS 有权
标题翻译：环氧树脂的处理
公开(公告)号：US20150258766A1
公开(公告)日：2015-09-17
申请号：US14433365
申请日：2012-10-03
申请人： COEXPAIR
发明人： Marc Gillard , Andre Bertin
IPC分类号： B32B43/00
CPC分类号： B32B43/006 , B29B17/02 , B29B2017/0217 , B29B2017/0255 , B29K2063/00 , B32B38/10 , B32B2363/00 , Y02W30/622 , Y10T156/1126 , Y10T156/1153 , Y10T156/1168 , Y10T156/1174 , Y10T156/1195 , Y10T156/1911 , Y10T156/1928 , Y10T156/1933 , Y10T156/195 , Y10T156/1978 , Y10T156/1994
摘要： Described herein is an apparatus and a method for removing an epoxy resin from a backing sheet at a temperature at or below the glass transition temperature of the epoxy resin. The apparatus (200) comprises a housing (210) in which is mounted a dispensing roll (220) comprising epoxy resin (230) on a backing sheet (240), a wind-up roll (250) comprising the backing sheet (240), a release element (260) over which the backing sheet (240) is directed, and a collection tray (270) for collecting pieces of resin (230a) removed from the backing sheet (240). The dispensing and wind-up rolls (220, 250) are mounted on respective drive shafts (225, 255) which are driven by a drive mechanism (285) controlled by a controller (280). A temperature controller (290) is also provided for controlling the temperature within the housing (210) so that it remains below or at the glass transition temperature of the epoxy resin. Angle (αa) is chosen to optimise the peel-back angle of the backing sheet (240) after is passes over the release element (260) in relation to the relative spacing between the dispensing and wind-up rolls (220, 250) and the release element (260).
摘要翻译：本文描述的是在环氧树脂的玻璃化转变温度以下的温度下从背衬片上除去环氧树脂的装置和方法。装置（200）包括壳体（210），其中在背衬片（240）上安装包括环氧树脂（230）的分配辊（220），包括背衬片（240）的卷绕辊（250），背衬片（240）被引导到其上的释放元件（260）和用于收集从背衬片（240）移除的树脂（230a）的收集盘（270）。分配卷绕辊（220,250）安装在由控制器（280）控制的驱动机构（285）驱动的相应驱动轴（225,255）上。还提供温度控制器（290），用于控制壳体（210）内的温度，使其保持在环氧树脂的玻璃化转变温度以下或玻璃化转变温度。选择角度（αa）以在背衬片材（240）相对于分配辊和卷绕辊（220,250）之间的相对间隔相对于剥离辊（220,250）和释放元件（260）。

5. 发明申请

US20150251404A1 METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER SUBSTRATE 审中-公开
标题翻译：将产品底板从载体基板上分离的方法
公开(公告)号：US20150251404A1
公开(公告)日：2015-09-10
申请号：US14715691
申请日：2015-05-19
申请人： EV Group GmbH
发明人： Friedrich Paul Lindner , Jurgen Burggraf
IPC分类号： B32B38/10 , B32B37/00
CPC分类号： B32B38/10 , B32B37/025 , B32B43/006 , B32B2038/0052 , B32B2307/546 , B32B2310/0418 , H01L21/67092 , H01L21/67132 , H01L21/6715 , H01L21/67346 , H01L21/68721 , H01L21/68771 , H01L2221/68386 , Y10T156/1111 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1922 , Y10T156/1928 , Y10T156/1978 , Y10T156/1983
摘要： Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.
摘要翻译：用于通过胶片框架通过粘合层将产品基板从连接到产品基板的载体基板上剥离的装置，连接到膜框架的柔性膜，并且具有用于将产品基板保持在接触中的粘合剂层膜的表面部分，薄膜在包围接触表面部分的薄膜的连接部分中连接到薄膜框架，以及由薄膜框架和薄膜形成的特别是可变体积的溶剂容器，用于保持用于分离粘合层的溶剂以及产物基质和粘合层可以容纳在溶剂储存器中，以及通过用于将溶剂输送到溶剂储存器中的输送装置和用于将载体基材从载体基材上剥离的剥离装置。

6. 发明申请

US20150174782A1 POLARIZING SHEET REMOVING TOOL AND REMOVING METHOD 有权
标题翻译：偏光片去除工具和拆卸方法
公开(公告)号：US20150174782A1
公开(公告)日：2015-06-25
申请号：US14637410
申请日：2015-03-04
申请人： Shenzhen China Star Optoelectronics Technology Co., LTD.
发明人： Yizhuang ZHUANG , Jungmao TSAI , Shiueshih LIAO , Songxian WEN , Mingfeng DENG
IPC分类号： B26D7/08 , B26B27/00 , B26D3/28
CPC分类号： B26D3/28 , B26B27/00 , B26D7/08 , B32B38/10 , B32B43/006 , G02F1/1303 , G02F1/1309 , G02F1/133528 , G02F2202/28 , Y10S156/934 , Y10S156/937 , Y10T83/0443 , Y10T156/1111 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1189 , Y10T156/1928 , Y10T156/1933 , Y10T156/1961 , Y10T156/1967 , Y10T156/1972
摘要： A polarizing sheet removing tool includes a handle and a blade mounted on the handle. The handle includes a main body, a piston device mounted on the main body, and a guide tube mounted on the main body. The main body forms therein a channel for containing an adhesive dissolving liquid. The piston device is mounted inside the channel. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid contained in the channel to the blade. In removing a polarizing sheet, the adhesive dissolving liquid can be guided by the guide tube the blade for subsequently flowing toward and dissolving bonding adhesive.
摘要翻译：偏振片去除工具包括手柄和安装在手柄上的刀片。手柄包括主体，安装在主体上的活塞装置和安装在主体上的导管。主体在其中形成用于容纳粘合剂溶解液体的通道。活塞装置安装在通道内。引导管具有与通道连通的端部和位于叶片上的相对端，以将包含在通道中的粘合剂溶解液引导到叶片。在去除偏光片时，粘合剂溶解液体可以由引导管引导，随后流动并粘合粘合剂。

7. 发明申请

US20150059986A1 DEVICE FOR FORMING SEPARATION STARTING POINT, STACK MANUFACTURING APPARATUS, AND METHOD FOR FORMING SEPARATION STARTING POINT 有权
标题翻译：用于形成分离开始点的装置，堆叠制造装置和形成分离开始点的方法
公开(公告)号：US20150059986A1
公开(公告)日：2015-03-05
申请号：US14468801
申请日：2014-08-26
申请人： Semiconductor Energy Laboratory Co., Ltd.
发明人： Ryu KOMATSU , Kohei YOKOYAMA , Masakatsu OHNO , Satoru IDOJIRI , Hisao IKEDA , Yasuhiro JINBO , Hiroki ADACHI , Yoshiharu HIRAKATA , Shingo EGUCHI , Daiki NAKAMURA
IPC分类号： B26D3/28 , B32B38/00 , B32B38/10 , B26D1/14
CPC分类号： B26D3/282 , B26D3/08 , B26F1/3826 , C03B33/027 , C03B33/037 , C03B33/07 , G02F1/1303 , Y02P40/57 , Y10T83/0281 , Y10T156/1051 , Y10T156/1082 , Y10T156/1126 , Y10T156/1137 , Y10T156/1168 , Y10T156/1195 , Y10T156/12 , Y10T156/1348 , Y10T156/1788 , Y10T156/1793 , Y10T156/1928 , Y10T156/1933 , Y10T156/1939 , Y10T156/1961 , Y10T156/1967 , Y10T156/1994
摘要： A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.
摘要翻译：提供一种用于形成分离起始点的装置，其允许分离加工部件的表面层以形成剩余部分。提供了一种包括支撑体的堆叠的制造装置和其表面层被分离的处理的构件的剩余部分。用于形成分离起点的装置包括支撑加工构件的台，面向台的切割器，支撑切割器的头部，支撑头部的臂部，以及使切割器相对移动的移动机构到舞台。

8. 发明授权

US08245751B2 Substrate bonding apparatus 失效
标题翻译：基板接合装置
公开(公告)号：US08245751B2
公开(公告)日：2012-08-21
申请号：US12260529
申请日：2008-10-29
申请人： Jae Seok Hwang
发明人： Jae Seok Hwang
IPC分类号： B32B37/10
CPC分类号： B32B37/1018 , B32B37/0046 , B32B2457/20 , G02F1/1303 , G02F1/1339 , Y10T156/1126 , Y10T156/15 , Y10T156/17 , Y10T156/1928
摘要： A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.
摘要翻译：提供了一种基板接合装置和方法。基板接合装置可以包括具有与固定在其一侧的基板相对的接收表面的板，位于板的接收表面和基板之间的多个夹紧构件，以及将基板与基板分离的基板分离装置夹紧构件。基板分离装置包括用于推动基板以将基板与夹紧构件分离的推动器以及安装在基板的接收表面上的基板，该基板具有安装在其中的推动器的安装空间。推动器通过位于安装空间一端的入口和出口突出出基板，以对基板加压。

9. 发明授权

US07909959B2 Method for releasing adhered article 有权
标题翻译：剥离附着物的方法
公开(公告)号：US07909959B2
公开(公告)日：2011-03-22
申请号：US10553177
申请日：2004-04-14
申请人： Toshio Tada , Yohei Nishimura , Katsunori Toyoshima , Juichi Fukatani , Tadahiko Yoshioka
发明人： Toshio Tada , Yohei Nishimura , Katsunori Toyoshima , Juichi Fukatani , Tadahiko Yoshioka
IPC分类号： B32B38/10
CPC分类号： H01L21/6835 , B32B17/1099 , B32B43/006 , C08J11/04 , C09J5/00 , C09J2205/302 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2224/81052 , H01L2224/81801 , H01L2924/01019 , H01L2924/09701 , H01L2924/3025 , Y02P20/143 , Y02W30/70 , Y10T156/11 , Y10T156/1126 , Y10T156/1137 , Y10T156/1153 , Y10T156/1928
摘要： It is an object of the invention to provide a separation method of an adherend capable of easily and reliably separating an adherend stuck using an adhesive, a method for recovering an electronic part from an electronic part laminate, and a separation method of laminate glass.The invention provides a separation method of an adherend, which is a method of separating an adherend stuck by using an adhesive, and comprises the steps of: air-tightly sealing the adherend together with a fluid being a gas at a normal temperature and normal pressure in a pressure resistant container, making the inside of the pressure resistant container in a high pressure state, and releasing the pressure of the inside of the pressure resistant container.
摘要翻译：本发明的目的是提供一种能够容易且可靠地分离使用粘合剂粘贴的被粘物的被粘物的分离方法，电子部件层叠体的电子部件的回收方法以及层叠玻璃的分离方法。本发明提供了一种被粘物的分离方法，该方法是通过使用粘合剂分离粘附的被粘物的方法，包括以下步骤：将被粘物与常温常压气体一起气密地密封在耐压容器中，使耐压容器的内部处于高压状态，并且释放耐压容器的内部的压力。

10. 发明授权

US07892946B2 Device and method for cutting an assembly 有权
标题翻译：用于切割装配体的装置和方法
公开(公告)号：US07892946B2
公开(公告)日：2011-02-22
申请号：US11681349
申请日：2007-03-02
申请人： Olivier Rayssac , Fabrice Letertre
发明人： Olivier Rayssac , Fabrice Letertre
IPC分类号： H01L21/46
CPC分类号： B28D5/0011 , B28D5/0023 , B28D5/0052 , B28D5/0064 , H01L21/2007 , H01L21/76254 , Y10T83/364 , Y10T156/1126 , Y10T156/1184 , Y10T156/1928 , Y10T156/1967 , Y10T156/1972
摘要： A method is presented for cutting an assembly that includes two layers of material having a first surface and a second surface. The method includes providing a weakened interface between the two layers that defines an interface ring about the periphery of the assembly, providing a high-pressure zone at the interface ring, and providing at least one controllable low-pressure zone in the vicinity of at least one of the first surface and the second surface. The technique also includes supplying the high-pressure zone with a controllable high-pressure force, and attacking the interface ring with at least one mechanical force in combination with the high-pressure force to cut the assembly.
摘要翻译：提出了一种用于切割包括具有第一表面和第二表面的两层材料的组件的方法。该方法包括在两个层之间提供弱化的界面，其限定围绕组件的周边的界面环，在界面环处提供高压区，并且在至少附近提供至少一个可控制的低压区第一表面和第二表面之一。该技术还包括向高压区域供应可控的高压力，并且以至少一个机械力与高压力结合来对接口环进行攻击以切割组件。

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