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1. 发明授权

US6127211A Method of manufacturing transistor 有权
标题翻译：制造晶体管的方法
公开(公告)号：US6127211A
公开(公告)日：2000-10-03
申请号：US162450
申请日：1998-09-29
申请人： Takashi Hirao , Akihisa Yoshida , Toru Fukumoto , Kazuyasu Adachi
发明人： Takashi Hirao , Akihisa Yoshida , Toru Fukumoto , Kazuyasu Adachi
IPC分类号： H01L21/18 , H01L21/336 , H01L21/84 , H01L29/786
CPC分类号： H01L29/78621
摘要： In a method of manufacturing a semiconductor device having an LDD structure, source gases for generating plural types of impurity ions exhibiting different molecular weights and different projected ranges in a target during impurity implantation are supplied to a plasma space, ionized, accelerated with a voltage, and implanted in a semiconductor region on the target substrate. In the case of manufacturing a top-gate transistor, a gate electrode on the semiconductor region has a sufficient thickness to serve as a mask. In the case of manufacturing a bottom-gate transistor, a mask and a resistor are used. An implantation angle is set to an optimum value as desired. Thereafter, the impurity is activated as desired. Thus, the semiconductor device having the LDD structure is manufactured by a single step of impurity implantation.
摘要翻译：在制造具有LDD结构的半导体器件的方法中，在杂质注入期间在靶中产生表现出不同分子量和不同投影范围的多种杂质离子的源气体被提供给等离子体空间，电离电压加速，并注入目标衬底上的半导体区域。在制造顶栅晶体管的情况下，半导体区域上的栅电极具有足够的厚度用作掩模。在制造底栅晶体管的情况下，使用掩模和电阻器。根据需要将植入角度设定为最佳值。此后，根据需要激活杂质。因此，具有LDD结构的半导体器件通过杂质注入的一个步骤来制造。

2. 发明授权

US5766342A Method for forming silicon film and silicon film forming apparatus 失效
标题翻译：用于形成硅膜和硅膜形成装置的方法
公开(公告)号：US5766342A
公开(公告)日：1998-06-16
申请号：US544016
申请日：1995-10-17
申请人： Munehiro Shibuya , Masatoshi Kitagawa , Yuji Mukai , Takashi Hirao , Akihisa Yoshida
发明人： Munehiro Shibuya , Masatoshi Kitagawa , Yuji Mukai , Takashi Hirao , Akihisa Yoshida
IPC分类号： C23C16/24 , C23C16/448 , C30B23/06
CPC分类号： C23C16/4486 , C23C16/24 , Y10T117/1024
摘要： The method for forming a silicon film of this invention includes the steps of introducing a compound containing silicon and chlorine and being in a liquid form under normal pressure and at an ordinary temperature into a reaction chamber, and spraying the compound in the liquid form in a fine particle state to a surface of a substrate supported in the reaction chamber, and decomposing the compound in the fine particle state by energy applied from outside of the reaction chamber, and depositing a silicon film on the substrate supported in the reaction chamber.
摘要翻译：本发明的形成硅膜的方法包括以下步骤：在常压和常温下将含有硅和氯的化合物以液体形式引入反应室中，并将液体形式的化合物喷雾在微粒状态到支撑在反应室中的基板的表面，并且通过从反应室外部施加的能量分解微细状态的化合物，并在支撑在反应室中的基板上沉积硅膜。

3. 发明授权

US6123774A Apparatus and method of manufacturing semiconductor element 失效
标题翻译：半导体元件制造装置及其制造方法
公开(公告)号：US6123774A
公开(公告)日：2000-09-26
申请号：US867487
申请日：1997-06-02
申请人： Takashi Hirao , Akihisa Yoshida , Masatoshi Kitagawa
发明人： Takashi Hirao , Akihisa Yoshida , Masatoshi Kitagawa
IPC分类号： H01L21/00 , H01L21/205 , H01L21/223 , H01L21/265 , H01L21/28 , H01L21/336 , H01J37/00
CPC分类号： H01L21/2236 , H01L21/67213 , H01L29/66765
摘要： A large area semiconductor element can be manufactured with high productivity, which has low electric resistance at the boundary face of a metal and a semiconductor and has excellent characteristics and reliability. A manufacturing apparatus comprises an ion irradiation means for simultaneously irradiating hydrogen ions and ions containing an element serving as a dopant of a semiconductor to a semiconductor film or a substrate in an atmosphere under reduced pressure, and a film forming means which forms a thin film or a heat treatment means which conducts a heat treatment without exposing a sample to an air. When a sample having an a-Si:H thin film is brought into a sample preparation chamber by opening a gate valve, the chamber is exhausted to have the inside pressure of 10.sup.2 to 10.sup.-3 Pa. Then, the sample is forwarded to an ion irradiation chamber from the sample preparation chamber via an intermediate chamber of which the pressure is maintained in the range of 10.sup.-3 to 10.sup.-7 Pa, and ions such as phosphous are irradiated. After the ion irradiation, a gate valve is opened to transfer the sample to the intermediate chamber, and then a gate valve is opened to forward the sample to a deposition chamber. Subsequently, Ar gas is let in to the deposition chamber and a metal film of Al/Ti is deposited by a sputtering method. After the deposition, the sample is forwarded to a sample carry-out chamber via the intermediate chamber.
摘要翻译：可以以高生产率制造大面积半导体元件，其在金属和半导体的边界面处具有低电阻并且具有优异的特性和可靠性。一种制造装置包括：离子照射装置，用于在减压下的气氛中同时向半导体膜或基板中含有含有半导体的掺杂剂的氢离子和离子的离子和离子;以及成膜装置，其形成薄膜或进行热处理而不将样品暴露于空气的热处理装置。当通过打开闸阀将具有a-Si：H薄膜的样品送入样品制备室时，将室排出至内部压力为102至10 -3 Pa，然后将样品送至离子照射室从样品制备室经过其中压力保持在10 -3至10 -7 Pa的范围的中间室，并且照射诸如磷的离子。在离子照射之后，打开闸阀以将样品转移到中间室，然后打开闸阀以将样品转移到沉积室。随后，将Ar气体进入沉积室，通过溅射法沉积Al / Ti的金属膜。沉积后，样品通过中间室送到样品进样室。

4. 发明授权

US5976919A Apparatus and method of manufacturing semiconductor element 失效
公开(公告)号：US5976919A
公开(公告)日：1999-11-02
申请号：US905052
申请日：1997-08-01
申请人： Takashi Hirao , Akihisa Yoshida , Masatoshi Kitagawa
发明人： Takashi Hirao , Akihisa Yoshida , Masatoshi Kitagawa
IPC分类号： H01L21/00 , H01L21/223 , H01L21/336 , H01L21/265 , H01L21/786
CPC分类号： H01L21/67213 , H01L21/2236 , H01L29/66765
摘要： A large area semiconductor element can be manufactured with high productivity, which has low electric resistance at the boundary face of a metal and a semiconductor and has excellent characteristics and reliability. A manufacturing apparatus comprises an ion irradiation means for simultaneously irradiating hydrogen ions and ions containing an element serving as a dopant of a semiconductor to a semiconductor film or a substrate in an atmosphere under reduced pressure, and a film forming means which forms a thin film or a heat treatment means which conducts a heat treatment without exposing a sample to an air. When a sample having an a-Si:H thin film is brought into a sample preparation chamber by opening a gate valve, the chamber is exhausted to have the inside pressure of 10.sup.2 to 10.sup.-3 Pa. Then, the sample is forwarded to an ion irradiation chamber from the sample preparation chamber via an intermediate chamber of which the pressure is maintained in the range of 10.sup.-3 to 10.sup.-7 Pa, and ions such as phosphous are irradiated. After the ion irradiation, a gate valve is opened to transfer the sample to the intermediate chamber, and then a gate valve is opened to forward the sample to a deposition chamber. Subsequently, Ar gas is let in to the deposition chamber and a metal film of Al/Ti is deposited by a sputtering method. After the deposition, the sample is forwarded to a sample carry-out chamber via the intermediate chamber.

5. 发明授权

US5141885A Method of fabrication of thin film transistors 失效
标题翻译：薄膜晶体管的制造方法
公开(公告)号：US5141885A
公开(公告)日：1992-08-25
申请号：US709495
申请日：1991-06-03
申请人： Akihisa Yoshida , Masatoshi Kitagawa , Takashi Hirao
发明人： Akihisa Yoshida , Masatoshi Kitagawa , Takashi Hirao
IPC分类号： H01L29/78 , H01L21/223 , H01L21/336 , H01L29/786
CPC分类号： H01L29/66765 , H01L21/2236 , H01L29/78669
摘要： A method of fabricating a thin film transistor on an insulating substrate such as quartz or glass without defect in the channel region in semiconductor thin layer, or at the boundary between the semiconductor thin layer and gate insulation layer, but with high mobility and high integration. For that purpose, ions produced by the discharge-decomposition of a hydride gas including dopant are accelerated and implanted into the semiconductor thin layer, wherein the protecting insulation layer for protection of the channel region is of a thickness larger than the projected range of the hydrogen ion.
摘要翻译：在半导体薄层的沟道区域或半导体薄层与栅极绝缘层之间的边界处，但具有高移动性和高集成度的绝缘基板（例如石英或玻璃等）的绝缘基板上制造薄膜晶体管的方法。为此，通过包括掺杂剂的氢化物气体的放电分解产生的离子被加速并注入到半导体薄层中，其中用于保护沟道区的保护绝缘层的厚度大于氢的投影范围离子。

6. 发明授权

US5814194A Substrate surface treatment method 失效
标题翻译：基材表面处理方法
公开(公告)号：US5814194A
公开(公告)日：1998-09-29
申请号：US542008
申请日：1995-10-12
申请人： Masahiro Deguchi , Akihisa Yoshida , Makoto Kitabatake , Takashi Hirao
发明人： Masahiro Deguchi , Akihisa Yoshida , Makoto Kitabatake , Takashi Hirao
IPC分类号： C30B33/00 , C30B33/12
CPC分类号： C30B33/00 , C30B29/04 , H01J2237/0812 , Y10T428/24355 , Y10T428/24479 , Y10T428/30
摘要： Cluster particles including a plurality of molecules or atoms are prepared by a gas cluster method, are accelerated, and are then irradiated onto a diamond in a low pressure atmosphere, so that the unevenness surfaces of the diamond are smoothed with no damages in the diamond. The cluster particles are prepared by the steps of forming, ionizing, mass-separating, and accelerating cluster particles. The cluster particles with a certain energy are irradiated onto the surface of the diamond. Irradiated cluster particles collide with the surface of the diamond, and then break apart into each molecule or atom while changing momentum (direction and speed) or energy. Thus, the surface of the diamond is efficiently smoothed and etched.
摘要翻译：包含多个分子或原子的簇粒子通过气体簇法制备，被加速，然后在低压气氛中照射到金刚石上，使得金刚石的不平坦表面在金刚石中没有损坏的情况下被平滑化。通过形成，离子化，质量分离和加速簇粒子的步骤制备簇粒子。具有一定能量的簇粒子被照射到金刚石的表面上。辐照的簇粒子与金刚石的表面碰撞，然后在改变动量（方向和速度）或能量的同时分解成每个分子或原子。因此，金刚石的表面被有效地平滑和蚀刻。

7. 发明授权

US4859908A Plasma processing apparatus for large area ion irradiation 失效
标题翻译：用于大面积离子照射的等离子体处理装置
公开(公告)号：US4859908A
公开(公告)日：1989-08-22
申请号：US100148
申请日：1987-09-23
申请人： Akihisa Yoshida , Kentaro Setsune , Takashi Hirao
发明人： Akihisa Yoshida , Kentaro Setsune , Takashi Hirao
IPC分类号： C30B31/22 , H01J37/32 , H01J27/02
CPC分类号： H01J37/32091 , C30B31/22 , H01J37/32357 , H01J37/3266
摘要： A plasma processing apparatus performs various plasma processings of a substrate having a large area in a semiconductor element manufacturing process, by using highly excited plasma generated at a low pressure under the application of RF power and a magnetic field. In this plasma processing apparatus, a gas is introduced into a vacuum chamber to be used as an ion source, RF power is applied to two electrodes having respective surfaces opposite to each other through the gas to thereby generate the plasma in the vacuum chamber, and a magnetic field is applied to the plasma from a magnetic field source arranged at a predetermined position. The intensity of the applied magnetic field is set to be 1.5 times or more the magnetic field intensity which causes electron cyclotron resonance to occur at the frequency f of the applied RF power. Particularly, when the frequency f of the RF power is 13.56 MHz, the magnetic field intensity is selected to be in the range from 25 gausses to 35 gausses.
摘要翻译：等离子体处理装置通过使用在RF功率和磁场的应用下在低压下产生的高激发等离子体，在半导体元件制造工艺中执行具有大面积的衬底的各种等离子体处理。在该等离子体处理装置中，将气体引入到真空室中以用作离子源，通过气体将两相电极的两个电极施加RF功率，从而在真空室中产生等离子体，从布置在预定位置的磁场源向等离子体施加磁场。所施加的磁场的强度被设定为在所施加的RF功率的频率f处发生电子回旋共振的磁场强度的1.5倍或更多。特别地，当RF功率的频率f为13.56MHz时，磁场强度被选择在从25高斯到35高斯的范围内。

8. 发明授权

US06207282B1 Substrate surface treatment method 失效
标题翻译：基材表面处理方法
公开(公告)号：US06207282B1
公开(公告)日：2001-03-27
申请号：US08996762
申请日：1997-12-22
申请人： Masahiro Deguchi , Akihisa Yoshida , Makoto Kitabatake , Takashi Hirao
发明人： Masahiro Deguchi , Akihisa Yoshida , Makoto Kitabatake , Takashi Hirao
IPC分类号： B32B900
CPC分类号： C30B33/00 , C30B29/04 , H01J2237/0812 , Y10T428/24355 , Y10T428/24479 , Y10T428/30
摘要： Cluster particles including a plurality of molecules or atoms are prepared by a gas cluster method, are accelerated, and are then irradiated onto a diamond in a low pressure atmosphere, so that the unevenness surfaces of the diamond are smoothed with no damages in the diamond. The cluster particles are prepared by the steps of forming, ionizing, mass-separating, and accelerating cluster particles. The cluster particles with a certain energy are irradiated onto the surface of the diamond. Irradiated cluster particles collide with the surface of the diamond, and then break apart into each molecule or atom while changing momentum (direction and speed) or energy. Thus, the surface of the diamond is efficiently smoothed and etched.
摘要翻译：包含多个分子或原子的簇粒子通过气体簇法制备，被加速，然后在低压气氛中照射到金刚石上，使得金刚石的不平坦表面在金刚石中没有损坏的情况下被平滑化。通过形成，离子化，质量分离和加速簇粒子的步骤制备簇粒子。具有一定能量的簇粒子被照射到金刚石的表面上。辐照的簇粒子与金刚石的表面碰撞，然后在改变动量（方向和速度）或能量的同时分解成每个分子或原子。因此，金刚石的表面被有效地平滑和蚀刻。

9. 发明申请

US20130246716A1 MEMORY SYSTEM AND DATA WRITING METHOD 有权
标题翻译：记忆系统和数据写入方法
公开(公告)号：US20130246716A1
公开(公告)日：2013-09-19
申请号：US13616466
申请日：2012-09-14
申请人： Ryoichi KATO , Mitsunori Tadokoro , Takashi Hirao
发明人： Ryoichi KATO , Mitsunori Tadokoro , Takashi Hirao
IPC分类号： G06F3/06
CPC分类号： G06F3/064 , G06F3/0616 , G06F3/0679 , G06F12/0246 , G06F2212/7203 , G06F2212/7205
摘要： According to one embodiment, when a controller writes update data in a second memory to a first memory which is nonvolatile and a difference between a size of a page and a size of the update data is equal to or greater than a size of a cluster, the controller configured to generate write data by adding, to the update data, data which has the size of the cluster, store an update content of management information corresponding to the update data and an update content storage position indicating a storage position of the update content of the management information in the first memory, and write the generated write data to a block in writing of the first memory.
摘要翻译：根据一个实施例，当控制器将第二存储器中的更新数据写入非易失性的第一存储器，并且页面的大小与更新数据的大小之间的差等于或大于集群的大小时，所述控制器被配置为通过向所述更新数据添加具有所述集群的大小的数据来存储与所述更新数据相对应的管理信息的更新内容和指示所述更新内容的存储位置的更新内容存储位置来生成写入数据的第一存储器中的管理信息，并将生成的写入数据写入到第一存储器的写入块中。

10. 发明授权

US08125206B2 Semiconductor device and power supply using the same 有权
标题翻译：半导体器件和电源使用相同
公开(公告)号：US08125206B2
公开(公告)日：2012-02-28
申请号：US12143305
申请日：2008-06-20
申请人： Noboru Akiyama , Takayuki Hashimoto , Takashi Hirao , Koji Tateno
发明人： Noboru Akiyama , Takayuki Hashimoto , Takashi Hirao , Koji Tateno
IPC分类号： G05F1/40
CPC分类号： H02M3/1588 , Y02B70/1466
摘要： A power-supply control IC is included in a switching power supply which drives to turn on and off a semiconductor switching device connected to a DC power supply in series to supply a predetermined constant voltage to an external load, and is a semiconductor device including a semiconductor circuit which controls on and off of the semiconductor switching device. When a current flowing through the load is abruptly increased to cause an error voltage to exceed a predetermined first threshold voltage after the end of a PWM on-pulse generated in synchronization with a switching cycle, a second PWM on-pulse is generated within the same switching cycle. Furthermore, in a plurality of switching cycles after the switching cycle in which the second PWM on-pulse is generated, the first threshold voltage for comparison with the error voltage is switched to a second threshold voltage higher than the first threshold voltage.
摘要翻译：电源控制IC包括在开关电源中，该开关电源驱动以串联连接到直流电源的半导体开关装置，以向外部负载提供预定的恒定电压，并且是包括控制半导体开关器件的导通和截止的半导体电路。当流过负载的电流突然增加以在与开关周期同步产生的PWM导通脉冲结束之后导致误差电压超过预定的第一阈值电压时，在同一时间内产生第二PWM导通脉冲开关周期。此外，在产生第二PWM导通脉冲的开关周期之后的多个开关周期中，与误差电压进行比较的第一阈值电压被切换到高于第一阈值电压的第二阈值电压。

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