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    • 3. 发明申请
    • Gas Discharge Display Panel
    • 气体放电显示面板
    • US20080278074A1
    • 2008-11-13
    • US10594294
    • 2005-04-07
    • Shinichi YamamotoMikihiko NishitaniMasaharu TerauchiJun HashimotoMasatoshi Kitagawa
    • Shinichi YamamotoMikihiko NishitaniMasaharu TerauchiJun HashimotoMasatoshi Kitagawa
    • H01J17/49H01J9/02
    • H01J11/12H01J11/40
    • Provided is a gas discharge display panel that exhibits a favorable display performance by maintaining a wall charge retaining power, controlling discharge delay within a range adequate for optimal image display, and reducing the discharge starting voltage at comparatively low cost. Also provided is a PDP that exhibits more reliability with enhanced display quality by further improving the secondary electron emission factor γ compared to conventional cases and lowering the discharge starting voltage to widen the driving margin. Further provided is a manufacturing method of a gas discharge display panel, by which the manufacturing cost lowers by reduction of the exhaustion time in the sealing exhaustion process, and by which the driving circuit cost is reduced. In a gas discharge display panel of the present invention, a protective layer (15) has a first protective film (151) and a second protective film (152), the second protective film (152) is formed on at least part of a surface of the first protective film (151), and the first protective film (151) has a larger impurity content than the second protective film (152).
    • 提供一种气体放电显示面板,其通过保持壁电荷保持功率而显示良好的显示性能,将放电延迟控制在适于最佳图像显示的范围内,并且以相对低的成本降低放电启动电压。 还提供了一种PDP,其通过与常规情况相比进一步改善二次电子发射因子γ并降低放电起始电压以扩大驱动裕度,显示出具有增强的显示质量的更高的可靠性。 进一步提供一种气体放电显示面板的制造方法,通过减少密封耗尽处理中的耗尽时间,降低制造成本,降低驱动电路成本。 在本发明的气体放电显示面板中,保护层(15)具有第一保护膜(151)和第二保护膜(152),第二保护膜(152)形成在表面的至少一部分上 的第一保护膜(151),并且第一保护膜(151)的杂质含量比第二保护膜(152)大。
    • 5. 发明申请
    • Phosphor and method of treating phosphor
    • 磷光体及其处理方法
    • US20050277570A1
    • 2005-12-15
    • US10528589
    • 2003-10-07
    • Takehiro ZukawaMasatoshi KitagawaMasaharu TerauchiJunko Asayama
    • Takehiro ZukawaMasatoshi KitagawaMasaharu TerauchiJunko Asayama
    • C09K11/08C09K11/77H01J1/63H01J61/44C11D1/00
    • C09K11/7734H01J61/44H01J2211/42Y10T428/2991Y10T428/2993
    • The present invention aims at realizing a PDP and a mercury-free fluorescent lamp feasible to maintain excellent luminescent characteristics over long periods by suppressing time-lapse changes in luminescent characteristics of a phosphor that is excited by vacuum ultraviolet light to thereby emit light. To accomplish this object, the oxide phosphor of the invention comprises individual particles, each of which has a region at and near the surface thereof modified, and the elemental composition of the surface region is in a more oxidized state than that of the internal region of the particles. Alternatively, the surface region has more halogen or chalcogen in the elemental composition. In the phosphor treatment method of the invention, the surface region of individual phosphor particles is selectively modified by (i) forming a highly reactive gas atmosphere by exciting gas which contains reactive gas, and (ii) exposing the phosphor to the gas atmosphere.
    • 本发明旨在实现通过抑制由真空紫外光激发的荧光体的发光特性的延时变化从而发光的方法,实现长时间保持优异发光特性的PDP和无汞荧光灯。 为了实现这个目的,本发明的氧化物荧光体包括单个颗粒,每个颗粒在其表面处和附近的区域都被修饰,并且表面区域的元素组成比内部区域的 颗粒。 或者,表面区域在元素组合物中具有更多的卤素或硫族元素。 在本发明的荧光体处理方法中,通过(i)通过激发含有反应性气体的气体形成高反应性气体气氛,并且(ii)将荧光体暴露于气体气氛,来选择性地修饰单个荧光体颗粒的表面区域。
    • 8. 发明授权
    • Method of manufacturing an MIS-type semiconductor device
    • 制造MIS型半导体器件的方法
    • US5336361A
    • 1994-08-09
    • US970991
    • 1992-11-02
    • Akiyoshi TamuraMasatoshi Kitagawa
    • Akiyoshi TamuraMasatoshi Kitagawa
    • H01L29/78H01L21/28H01L21/316H01L21/318H01L21/338H01L29/812H01L21/02
    • H01L21/0217H01L21/02247H01L21/02252H01L21/02274H01L21/02315H01L21/02337H01L21/28264H01L21/31608H01L21/318H01L21/3185
    • Disclosed is a method of manufacturing an MIS-type semiconductor device having a greatly reduced interface state density. In this method, before the formation of a gate insulating film, the surface of a GaAs substrate is treated with a plasma generated from a gas containing hydrogen and nitrogen or from a gas containing hydrogen and argon, so as to reduce the interface state density. An ECR plasma is used as the plasma, so that the damage caused by the plasma to the GaAs substrate is alleviated. After the surface treatment process, an healing process is performed, which sufficiently removes the damage. During the surface treatment process using the plasma generated from the gas containing hydrogen and nitrogen, a GaN gate insulating film is formed on the surface of the GaAs substrate. The surface treatment process using the plasma generated from the gas containing hydrogen and argon is followed by the process of forming a gate insulating film on the GaAs substrate; the two processes are successively performed within the same apparatus without exposing the GaAs substrate to ambient air.
    • 公开了一种制造具有大大降低的界面态密度的MIS型半导体器件的方法。 在该方法中,在形成栅极绝缘膜之前,利用由含有氢和氮的气体或含有氢和氩的气体产生的等离子体处理GaAs衬底的表面,以便降低界面态密度。 使用ECR等离子体作为等离子体,使得等离子体对GaAs衬底的损伤得到缓解。 在表面处理过程之后,进行愈合过程,这充分消除了损伤。 在使用由含有氢和氮的气体产生的等离子体的表面处理工艺中,在GaAs衬底的表面上形成GaN栅极绝缘膜。 使用由含有氢气和氩气的气体产生的等离子体的表面处理工序之后,在GaAs衬底上形成栅极绝缘膜; 在相同的装置中连续进行两个处理,而不将GaAs衬底暴露在环境空气中。
    • 9. 发明授权
    • Method for producing an amorphous silicon semiconductor device using a
multichamber PECVD apparatus
    • 使用多室PECVD装置制造非晶硅半导体器件的方法
    • US4800174A
    • 1989-01-24
    • US50699
    • 1987-05-18
    • Shinichiro IshiharaMasatoshi KitagawaTakashi Hirao
    • Shinichiro IshiharaMasatoshi KitagawaTakashi Hirao
    • H01L21/205C23C16/24C23C16/54H01L31/04
    • C23C16/54C23C16/24Y10S148/025Y10S148/045Y10S148/072Y10S438/908
    • A method of producing an amorphous silicon semiconductor device makes use of a capacitance-coupled high-frequency glow-discharge semiconductor production apparatus which is equipped with a plurality of glow-discharge chambers each having a high-frequency electrode and a substrate holder opposing each other and means for supplying material gases to the glow-discharge chambers. A reaction of a material gas is effected in a first glow-discharge chamber, so as to form a semiconductor layer having a first conductivity type on a substrate introduced into the first glow-discharge chamber, and, after moving the substrate into a second glow-discharge chamber, a reaction of a material gas different from the material gas used in the first glow-discharge chamber is effected, thereby forming a semiconductor layer having a second conductivity type on the semiconductor layer of the first conductivity type. The substrate with the semiconductor layer of the first conductivity formed thereon is moved from the first glow-discharge chamber to the second glow-discharge chamber after a predetermined gas atmosphere is formed in the first glow-discharge chamber. The distance between the electrode and the substrate holder is made smaller in one of the first and second glow-discharge chambers which is designed for forming the thicker one of the semiconductor layers of the first and second conductivity types than in the other of the first and second glow-discharge chambers. The temperature of the substrate is set higher in one of the first and second glow-discharge chambers which is designed for forming the thicker one of the semiconductor layers of the first and second conductivity types than in the other of the first and second glow-discharge chambers.
    • 一种非晶硅半导体器件的制造方法采用电容耦合高频辉光放电半导体制造装置,该装置配备有多个辉光放电室,每个辉光放电室具有彼此相对的高频电极和衬底保持器 以及用于将材料气体供应到辉光放电室的装置。 在第一辉光放电室中进行材料气体的反应,以便在引入第一辉光放电室的衬底上形成具有第一导电类型的半导体层,并且在将衬底移动到第二发光 进行与第一辉光放电室中使用的材料气体不同的原料气体的反应,由此在第一导电型半导体层上形成具有第二导电类型的半导体层。 在第一辉光放电室中形成规定的气体气氛之后,将形成有第一导电性的半导体层的基板从第一辉光放电室向第二辉光放电室移动。 在第一和第二辉光放电室之一中,电极和衬底保持器之间的距离较小,被设计用于形成第一和第二导电类型的较厚的一个半导体层,而不是第一和第二导电类型中的另一个, 第二个辉光放电室。 第一和第二辉光放电室之一的衬底的温度被设定为高于在第一和第二辉光放电中的另一个中形成第一和第二导电类型的较厚的一个半导体层的第一和第二辉光放电室 房间。