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    • 6. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08203380B2
    • 2012-06-19
    • US12483668
    • 2009-06-12
    • Takayuki HashimotoTakashi HiraoNoboru Akiyama
    • Takayuki HashimotoTakashi HiraoNoboru Akiyama
    • H01L25/00
    • H01L27/0629H01L2924/0002H02M7/003H01L2924/00
    • In a semiconductor device, a high-side driver is arranged in a region closer to a periphery of a semiconductor substrate than a high-side switch, and a low-side driver is arranged in a region closer to the periphery of the semiconductor substrate than the low-side switch. By this means, a path from a positive terminal of an input capacitor to a negative terminal of the input capacitor via the high-side switch and the low-side switch is short, a path from a positive terminal of a drive capacitor to a negative terminal of the drive capacitor via the low-side driver is short, and a path from a positive terminal of a boot strap capacitor to a negative terminal of the boot strap capacitor via the high-side driver is short, and therefore, the parasitic inductance can be reduced, and the conversion efficiency can be improved.
    • 在半导体装置中,高侧驱动器配置在比高侧开关更靠近半导体基板的周围的区域,低边驱动器配置在比半导体基板的周边更靠近的区域, 低端开关。 通过这种方式,经由高侧开关和低侧开关从输入电容器的正极端子到输入电容器的负极端子的路径很短,从驱动电容器的正极端子到负极的路径 通过低侧驱动器的驱动电容器的端子短,通过高侧驱动器从引导电容器的正极端子到引导电容器的负极端子的路径短,因此,寄生电感 可以降低转换效率。