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    • 1. 发明申请
    • Vertical GaN-based light emitting diode
    • 垂直GaN基发光二极管
    • US20070108467A1
    • 2007-05-17
    • US11599266
    • 2006-11-15
    • Tae JangSu LeePil KangTae Kim
    • Tae JangSu LeePil KangTae Kim
    • H01L33/00
    • H01L33/405H01L33/22
    • A vertical GaN-based LED is provided. The vertical GaN-based LED includes an n-type bonding pad, an n-type reflective electrode formed under the n-type bonding pad, an n-type transparent electrode formed under the n-type reflective electrode, an n-type GaN layer formed under the n-type transparent electrode, an active layer formed under the n-type GaN layer, a p-type GaN layer formed under the active layer, a p-electrode formed under the p-type GaN layer and having an uneven profile at a surface which does not come in contact with the p-type GaN layer, a p-type reflective electrode formed along the uneven surface of the p-type electrode, and a support layer formed under the p-type reflective electrode.
    • 提供垂直的GaN基LED。 垂直GaN基LED包括n型接合焊盘,形成在n型接合焊盘下面的n型反射电极,形成在n型反射电极下方的n型透明电极,n型GaN层 形成在n型透明电极下面,形成在n型GaN层下面的有源层,在有源层下面形成的p型GaN层,在p型GaN层下面形成的具有不平坦轮廓的p电极 在不与p型GaN层接触的表面上形成有沿p型电极的不平坦表面形成的p型反射电极和在p型反射电极下形成的支撑层。
    • 2. 发明申请
    • Vertical gallium-nitride based light emitting diode
    • 垂直氮化镓基发光二极管
    • US20070114545A1
    • 2007-05-24
    • US11602311
    • 2006-11-21
    • Tae JangSu Lee
    • Tae JangSu Lee
    • H01L33/00
    • H01L33/145H01L33/32H01L33/46
    • A vertical GaN-based LED includes: an n-type bonding pad; an n-electrode formed under the n-type bonding pad; an n-type transparent electrode formed under the n-electrode; an n-type GaN layer formed under the n-type transparent electrode; an active layer formed under the n-type GaN layer; a p-type GaN layer formed under the active layer; a current blocking layer formed under a predetermined portion of the p-type GaN layer corresponding to a region where the n-electrode is formed, the current blocking layer being formed of distributed Bragg reflector (DBR); a p-electrode formed under the resulting structure where the current blocking layer is formed; and a support layer formed under the p-electrode.
    • 垂直GaN基LED包括:n型接合焊盘; 形成在n型焊盘下面的n电极; 形成在n电极下面的n型透明电极; 形成在n型透明电极下方的n型GaN层; 形成在n型GaN层下面的有源层; 形成在有源层下面的p型GaN层; 电流阻挡层,其形成在对应于形成有n电极的区域的p型GaN层的预定部分之下,电流阻挡层由分布式布拉格反射器(DBR)形成; 在形成电流阻挡层的所得结构下形成的p型电极; 以及形成在p电极下方的支撑层。