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    • 2. 发明授权
    • Focused ion beam deposition using TMCTS
    • 使用TMCTS聚焦离子束沉积
    • US5639699A
    • 1997-06-17
    • US420153
    • 1995-04-11
    • Hiroko NakamuraHaruki KomanoKazuyoshi SugiharaKeiji HoriokaMitsuyo KariyaSoichi InoueIchiro MoriKatsuya OkumuraTadahiro TakigawaToru WatanabeMotosuke MiyoshiYuichiro YamazakiHaruo Okano
    • Hiroko NakamuraHaruki KomanoKazuyoshi SugiharaKeiji HoriokaMitsuyo KariyaSoichi InoueIchiro MoriKatsuya OkumuraTadahiro TakigawaToru WatanabeMotosuke MiyoshiYuichiro YamazakiHaruo Okano
    • B05D5/00C23C16/04G03F1/00G03F1/26G03F1/74H01L21/316
    • G03F1/74B05D5/005C23C16/047G03F1/26
    • According to this invention, there is provided a method of repairing a bump defect of a structure obtained by forming a predetermined pattern on a substrate, having the steps of forming a first thin film consisting of a material different from that of the substrate on the substrate around the bump defect or close to the bump defect, forming a second thin film on the bump defect and the first thin film to flatten an upper surface of the second thin film, performing simultaneous removal of the bump defect and the thin films on an upper portion of the projecting defect and around the bump defect using a charged particle beam, and performing removal of the thin films left in the step of performing simultaneous removal. According to this invention, there is provided to a method of repairing a divot defect of a structure obtained by forming a predetermined pattern on a substrate, having the steps of burying a material in the divot defect and forming a projecting portion projecting from a substrate surface, covering a region including the projecting portion with flattening films consisting of a material different from that of the substrate to flatten an upper surface of the region, performing simultaneous removal of the projecting portion and the flattening films around the projecting portion using a charged particle beam, and performing removal of the flattening films left in the step of performing simultaneous removal.
    • 根据本发明,提供了一种修复通过在基板上形成预定图案而获得的结构的凸点缺陷的方法,该方法具有以下步骤:在基板上形成由不同于基板的材料构成的第一薄膜 在凸起缺陷附近或接近凸块缺陷的情况下,在凸起缺陷上形成第二薄膜和使第一薄膜平坦化第二薄膜的上表面,同时去除凸起缺陷和上部的薄膜 使用带电粒子束的突出缺陷的一部分和凸起缺陷周围,并且执行在执行同时移除的步骤中留下的薄膜的去除。 根据本发明,提供了一种修复通过在基板上形成预定图案而获得的结构的凹陷缺陷的方法,该方法具有以下步骤:将材料埋在凹陷缺陷中并形成从基板表面突出的突出部分 使用由与基板不同的材料构成的平坦化膜覆盖包括突出部分的区域,以平坦化该区域的上表面,使用带电粒子束同时移除突出部分周围的突出部分和平坦化膜 并且执行在执行同时去除的步骤中留下的平坦化膜的去除。
    • 4. 发明授权
    • Plasma processing apparatus
    • 等离子体处理装置
    • US5413663A
    • 1995-05-09
    • US74539
    • 1993-06-11
    • Masahiro ShimizuTakayuki FukasawaYuichiro YamazakiMotosuke MiyoshiHaruo OkanoKatsuya Okumura
    • Masahiro ShimizuTakayuki FukasawaYuichiro YamazakiMotosuke MiyoshiHaruo OkanoKatsuya Okumura
    • H01J37/32H01L21/00
    • H01L21/67069H01J37/3233
    • A wafer plasma-etching apparatus includes electron generating, accelerating and processing chambers. Electron are drawn out of plasma generated in the electron generating chamber, accelerated in the accelerating chamber and introduced, as an electron beam, into the process chamber. A semiconductor wafer is positioned flat and parallel to an electron introducing direction in the process chamber. Process gas is introduced into the process chamber and excited into plasma by the electron beam. The wafer is etched by this plasma. Magnetic field is formed at the entrance of the process chamber such that the electron beam is divided to both sides of its extended center line in a horizontal plane and compressed flat in a vertical plane. The magnetic field is also formed such that the electron beam is carried in the horizontal direction at a position where the wafer is arranged in the process chamber. A sheet-like plasma region having a higher density of ions and a more uniform distribution thereof can be thus formed all over the surface of the wafer.
    • 晶片等离子体蚀刻装置包括电子发生,加速和处理室。 电子从在电子发生室中产生的等离子体中抽出,在加速室中被加速并且作为电子束引入到处理室中。 半导体晶片被定位成平行且平行于处理室中的电子引入方向。 工艺气体被引入处理室并通过电子束激发成等离子体。 通过该等离子体蚀刻晶片。 在处理室的入口处形成磁场,使得电子束在水平面被分割成其延伸的中心线的两侧,并在垂直平面中被压扁。 磁场也形成为使得电子束在晶片布置在处理室中的位置沿水平方向承载。 因此,可以在晶片的整个表面上形成具有较高的离子密度和更均匀分布的片状等离子体区域。
    • 5. 发明授权
    • Plasma generating apparatus and surface processing apparatus
    • 等离子体发生装置和表面处理装置
    • US5660744A
    • 1997-08-26
    • US492322
    • 1995-06-19
    • Makoto SekineKeiji HoriokaHaruo OkanoKatsuya OkumuraIsahiro HasegawaMasaki Narita
    • Makoto SekineKeiji HoriokaHaruo OkanoKatsuya OkumuraIsahiro HasegawaMasaki Narita
    • H01J37/32B23K10/00
    • H01J37/32623H01J37/3266
    • A surface processing apparatus comprises a container provided with a first electrode and a second electrode disposed opposite to the first electrode for supporting a substrate to be processed and filled with a gas at a reduced pressure, an electric field generator for generating an electric field between the first and second electrodes, and a magnetic field generator for generating a magnetic field in the vacuum container. The magnetic field generator comprises a plurality of magnet element groups arranged in a circle around the container so as to form a ring, each of the magnet element groups having an axis directed to a center of the circle and a synthetic magnetization direction and comprising one or a plurality of magnet elements having respective magnetization directions which are synthesized to be equal to the synthetic magnetization direction of the each of the magnetic element groups. One of the magnet element groups is so disposed that the synthetic magnetization direction thereof coincides with the axis thereof, and each of the magnet element groups other than the one magnet element group is so disposed that an angle of the synthetic magnetization direction thereof relative to the synthetic magnetization direction of the one magnet element group is substantially twice an angle of the axis thereof relative to the axis of the one magnet element group.
    • 表面处理装置包括:容器,其设置有第一电极和与第一电极相对设置的第二电极,用于支撑待处理的基板并在减压下填充气体;电场发生器,用于在第一电极之间产生电场; 第一和第二电极以及用于在真空容器中产生磁场的磁场发生器。 磁场发生器包括围绕容器布置成圆形的多个磁体元件组,以便形成环,每个磁体元件组具有指向圆心的合成磁化方向的轴线,并包括一个或多个 多个磁体元件,其各自的磁化方向被合成为等于每个磁性元件组的合成磁化方向。 一个磁体元件组被设置成合成磁化方向与其轴线重合,并且除了一个磁体元件组之外的每个磁体元件组被设置成使得其合成磁化方向相对于 一个磁体元件组的合成磁化方向基本上是相对于一个磁体元件组的轴线的轴的两倍。
    • 9. 发明授权
    • Exposure mask, exposure mask substrate, method for fabricating the same,
and method for forming pattern based on exposure mask
    • 曝光掩模,曝光掩模基板,其制造方法以及基于曝光掩模形成图案的方法
    • US5620815A
    • 1997-04-15
    • US471782
    • 1995-06-06
    • Shinichi ItoHaruo OkanoToru WatanabeKatsuya Okumura
    • Shinichi ItoHaruo OkanoToru WatanabeKatsuya Okumura
    • G03F1/00G03F1/26G03F1/32G03F9/00
    • G03F1/32G03F1/26
    • An exposure mask having an excellent alignment accuracy between patterns, which is prepared by first forming on a light transmissive substrate a light shielding film or a semi-transparent film pattern (first pattern) somewhat larger than a desired dimension, forming thereon a semi-transparent film or a light transmissive film pattern (second pattern) so as to include all patterns of the desired dimensions made up of a light shielding part, a semi-transparent part and a light transmissive part, and then removing a projected part of the first pattern with use of the second pattern as a mask.The semi-transparent film is formed of at least two layers each of which contains a common element, thus the semi-transparent film can be made with use of the same apparatus and when patterning, etching process can be carried out with use of the same etchant.Further, since in a mask including the semi-transparent pattern, at least that area of a non-pattern zone where light reaches a wafer through the transfer, acts to shield the exposure light, too narrowed pattern or insufficient focal depth can be prevented.
    • 通过首先在透光性基板上形成稍大于所需尺寸的遮光膜或半透明膜图案(第一图案)而制成的图案之间具有优异的取向精度的曝光掩模,在其上形成半透明 膜或透光膜图案(第二图案),以便包括由遮光部分,半透明部分和透光部分组成的所需尺寸的所有图案,然后去除第一图案的突出部分 使用第二种图案作为掩模。 半透明膜由至少两层形成,每层均含有共同的元素,因此可以使用相同的装置制造半透明膜,并且当图案化时,可以使用它们进行蚀刻工艺 蚀刻剂 此外,由于在包括半透明图案的掩模中,至少通过转印光到达晶片的非图案区域的面积起到屏蔽曝光光的作用,可以防止太窄的图案或不充分的焦深。