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1. 发明授权

US08242527B2 Light emitting device and method of manufacturing the same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08242527B2
公开(公告)日：2012-08-14
申请号：US12728377
申请日：2010-03-22
申请人： Si-Chen Lee , Yu-Wei Jiang , Yi-Ting Wu , Ming-Wei Tsai , Pei-En Chang
发明人： Si-Chen Lee , Yu-Wei Jiang , Yi-Ting Wu , Ming-Wei Tsai , Pei-En Chang
IPC分类号： H01L33/00
CPC分类号： H05B33/10 , H05B33/22
摘要： A light emitting device for generating infrared light includes a substrate, a first metal layer, a dielectric layer and a second metal layer. The substrate has a first surface. The first metal layer is formed on the first surface of the substrate. The dielectric layer is formed on the first metal layer. A thickness of the dielectric layer is greater than a particular value. The second metal layer is formed on the dielectric layer. When the light emitting device is heated, the dielectric layer has a waveguide mode such that the infrared light generated by the light emitting device can be transmitted in the dielectric layer. A wavelength of the infrared light generated in the waveguide mode relates to the thickness of the dielectric layer.
摘要翻译：用于产生红外光的发光装置包括基板，第一金属层，电介质层和第二金属层。衬底具有第一表面。第一金属层形成在基板的第一表面上。介电层形成在第一金属层上。电介质层的厚度大于特定值。第二金属层形成在电介质层上。当发光器件被加热时，电介质层具有波导模式，使得由发光器件产生的红外光可以在电介质层中传输。在波导模式中产生的红外光的波长与介电层的厚度有关。

2. 发明申请

US20100213492A1 Light Emitting Device and Method of Manufacturing the Same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20100213492A1
公开(公告)日：2010-08-26
申请号：US12728377
申请日：2010-03-22
申请人： Si-Chen Lee , Yu-Wei Jiang , Yi-Ting Wu , Ming-Wei Tsai , Pei-En Chang
发明人： Si-Chen Lee , Yu-Wei Jiang , Yi-Ting Wu , Ming-Wei Tsai , Pei-En Chang
IPC分类号： H01L33/48 , H01L33/00
CPC分类号： H05B33/10 , H05B33/22
摘要： A light emitting device for generating infrared light includes a substrate, a first metal layer, a dielectric layer and a second metal layer. The substrate has a first surface. The first metal layer is formed on the first surface of the substrate. The dielectric layer is formed on the first metal layer. A thickness of the dielectric layer is greater than a particular value. The second metal layer is formed on the dielectric layer. When the light emitting device is heated, the dielectric layer has a waveguide mode such that the infrared light generated by the light emitting device can be transmitted in the dielectric layer. A wavelength of the infrared light generated in the waveguide mode relates to the thickness of the dielectric layer.
摘要翻译：用于产生红外光的发光装置包括基板，第一金属层，电介质层和第二金属层。衬底具有第一表面。第一金属层形成在基板的第一表面上。介电层形成在第一金属层上。电介质层的厚度大于特定值。第二金属层形成在电介质层上。当发光器件被加热时，电介质层具有波导模式，使得由发光器件产生的红外光可以在电介质层中传输。在波导模式中产生的红外光的波长与介电层的厚度有关。

3. 发明申请

US20110285006A1 Semiconductor Package and Method for Making the Same 有权
标题翻译：半导体封装及其制作方法
公开(公告)号：US20110285006A1
公开(公告)日：2011-11-24
申请号：US12783104
申请日：2010-05-19
申请人： Chao-Fu Weng , Yi-Ting Wu
发明人： Chao-Fu Weng , Yi-Ting Wu
IPC分类号： H01L23/538 , H01L21/78 , H01L21/50
CPC分类号： H01L23/48 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L2224/24227 , H01L2225/06517 , H01L2225/06531 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/014 , H01L2924/15153 , H01L2924/15165
摘要： The present invention relates to a semiconductor package and method for making the same. The semiconductor package includes a silicon substrate unit, a bridge chip and at least one active chip. The silicon substrate unit has a cavity and a plurality of vias. The bridge chip is attached to the cavity and has a plurality of non-contact pads. The active chip is disposed above the bridge chip and has a plurality of non-contact pads and a plurality of conducting elements. The conducting elements of the active chip contact the vias of the silicon substrate unit, the non-contact pads of the active chip face but are not in physical contact with the non-contact pads of the bridge chip, so as to provide proximity communication between the active chip and the bridge chip.
摘要翻译：半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。半导体封装包括硅衬底单元，桥芯片和至少一个有源芯片。硅衬底单元具有空腔和多个通孔。桥芯片附接到腔体并具有多个非接触垫片。有源芯片设置在桥芯片上方并且具有多个非接触焊盘和多个导电元件。有源芯片的导电元件接触硅衬底单元的通孔，有源芯片面的非接触焊盘，但不与桥芯片的非接触焊盘物理接触，以便提供有源芯片和桥芯片。

4. 发明申请

US20090291133A1 METHODS AND COMPOSTIONS FOR ENHANCING TRANSDERMAL DRUG DELIVERY 有权
标题翻译：用于增强转导药物递送的方法和组合
公开(公告)号：US20090291133A1
公开(公告)日：2009-11-26
申请号：US12466011
申请日：2009-05-14
申请人： Yu-Jing WANG , Yu-Chao Wang , Yi-Ting Wu , Lin-Ai Tai , Leu-Wei Lo , Chung-Shi Yang
发明人： Yu-Jing WANG , Yu-Chao Wang , Yi-Ting Wu , Lin-Ai Tai , Leu-Wei Lo , Chung-Shi Yang
IPC分类号： A61K9/127
CPC分类号： A61K9/0014 , A61K9/127 , A61K9/5153 , A61K47/6911 , A61K47/6937 , A61K49/0043 , A61K49/0084 , A61K49/0093 , B82Y5/00
摘要： Methods and compositions for enhancing transdermal delivery of a bioactive agent. The method contains the step of applying to a skin tissue an effective amount of a composition comprising: (a) a drug vehicle; (b) a bioactive agent encapsulated within the drug vehicle; (c) a plurality of proteolytic enzyme molecules conjugated onto the surface of the drug vehicle; and (d) a pharmaceutically acceptable carrier, for a period of time effective to deliver the bioactive agent across the skin tissue at a desired dosage.
摘要翻译：用于增强生物活性剂透皮递送的方法和组合物。该方法包括向皮肤组织施用有效量的组合物的步骤，其包含：（a）药物载体; （b）包封在药物载体内的生物活性剂; （c）缀合在药物载体表面上的多个蛋白水解酶分子; 和（d）药学上可接受的载体，在一段时间内有效地以期望的剂量递送生物活性剂穿过皮肤组织。

5. 发明授权

US06586303B2 Method for fabricating a mask ROM 有权
标题翻译：掩模ROM的制造方法
公开(公告)号：US06586303B2
公开(公告)日：2003-07-01
申请号：US09683246
申请日：2001-12-05
申请人： Yi-Ting Wu
发明人： Yi-Ting Wu
IPC分类号： H01L218247
CPC分类号： H01L27/11253 , H01L21/743 , H01L27/112
摘要： A patterned photoresist layer is coated onto a semiconductor substrate. Then a doped region is formed in the semiconductor substrate not covered by the patterned photoresist layer. In addition, a semiconductor process is performed to trim the patterned photoresist layer, and a lightly doped drain (LDD) region is formed in the region of the semiconductor substrate next to the doped region. The doped region and the LDD region constitute the buried bit lines of the mask ROM. Finally, the photoresist layer is stripped.
摘要翻译：将图案化的光致抗蚀剂层涂覆到半导体衬底上。然后，在未被图案化光致抗蚀剂层覆盖的半导体衬底中形成掺杂区域。此外，执行半导体工艺以修整图案化的光致抗蚀剂层，并且在半导体衬底的与掺杂区域相邻的区域中形成轻掺杂漏极（LDD）区域。掺杂区域和LDD区域构成掩模ROM的掩埋位线。最后，剥离光致抗蚀剂层。

6. 发明授权

US08333962B2 Controlled release multidrug formulations for spinal cord injury 有权
标题翻译：用于脊髓损伤的控释多药制剂
公开(公告)号：US08333962B2
公开(公告)日：2012-12-18
申请号：US12548434
申请日：2009-08-27
申请人： Yu-Chao Wang , Yi-Ting Wu , Chung-Shi Yang
发明人： Yu-Chao Wang , Yi-Ting Wu , Chung-Shi Yang
IPC分类号： A61K38/18 , A61K38/43 , A61K9/52 , A61K9/58 , A61K31/721 , A61K31/722 , A61K47/30 , C07K14/475 , C07K14/50
CPC分类号： A61K38/185 , A61K9/0085 , A61K9/5153 , A61K31/7076 , A61K38/1825 , A61K38/2278 , A61K38/45 , A61K38/51 , A61K45/06 , A61K2300/00
摘要： A controlled release multidrug formulation for improving locomotor recovery after spinal cord injury comprising: (a) a first composition comprising a first bioactive agent, encapsulated within a first polymeric particle; (b) a second composition comprising a second bioactive agent, encapsulated within a second polymeric particle, wherein the second polymeric particle is encapsulated within the first polymeric particle; and (c) a third composition comprising a third bioactive agent, encapsulated within either the first or the second polymeric particle, wherein the second composition is released subsequently to the release of the first composition, and wherein the first bioactive agent is a neurotrophic factor, the second bioactive agent is a collagen synthesis inhibitor, and the third bioactive agent is selected from the group consisting of cyclic AMP (cAMP), an adenylate cyclase activator and a Rho inhibitor.
摘要翻译：一种用于改善脊髓损伤后运动恢复的控释多药物制剂，包括：（a）第一组合物，其包含封装在第一聚合物颗粒内的第一生物活性剂; （b）第二组合物，其包含封装在第二聚合物颗粒内的第二生物活性剂，其中所述第二聚合物颗粒包封在所述第一聚合物颗粒内; 和（c）第三组合物，其包含封装在第一或第二聚合物颗粒内的第三生物活性剂，其中第二组合物随后释放出第一组合物，其中第一生物活性剂是神经营养因子，第二生物活性剂是胶原合成抑制剂，第三生物活性剂选自环AMP（cAMP），腺苷酸环化酶活化剂和Rho抑制剂。

7. 发明授权

US08288854B2 Semiconductor package and method for making the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US08288854B2
公开(公告)日：2012-10-16
申请号：US12783104
申请日：2010-05-19
申请人： Chao-Fu Weng , Yi-Ting Wu
发明人： Chao-Fu Weng , Yi-Ting Wu
IPC分类号： H01L23/538 , H01L21/78 , H01L21/50
CPC分类号： H01L23/48 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L2224/24227 , H01L2225/06517 , H01L2225/06531 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/014 , H01L2924/15153 , H01L2924/15165
摘要： The present invention relates to a semiconductor package and method for making the same. The semiconductor package includes a silicon substrate unit, a bridge chip and at least one active chip. The silicon substrate unit has a cavity and a plurality of vias. The bridge chip is attached to the cavity and has a plurality of non-contact pads. The active chip is disposed above the bridge chip and has a plurality of non-contact pads and a plurality of conducting elements. The conducting elements of the active chip contact the vias of the silicon substrate unit, the non-contact pads of the active chip face but are not in physical contact with the non-contact pads of the bridge chip, so as to provide proximity communication between the active chip and the bridge chip.
摘要翻译：半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。半导体封装包括硅衬底单元，桥芯片和至少一个有源芯片。硅衬底单元具有空腔和多个通孔。桥芯片附接到腔体并具有多个非接触垫片。有源芯片设置在桥芯片上方并且具有多个非接触焊盘和多个导电元件。有源芯片的导电元件接触硅衬底单元的通孔，有源芯片面的非接触焊盘，但不与桥芯片的非接触焊盘物理接触，以便提供有源芯片和桥芯片。

8. 发明授权

US08062663B2 Methods and compostions for enhancing transdermal drug delivery 有权
标题翻译：用于增强透皮药物递送的方法和组合物
公开(公告)号：US08062663B2
公开(公告)日：2011-11-22
申请号：US12466011
申请日：2009-05-14
申请人： Yu-Jing Wang , Yu-Chao Wang , Yi-Ting Wu , Lin-Ai Tai , Leu-Wei Lo , Chung-Shi Yang
发明人： Yu-Jing Wang , Yu-Chao Wang , Yi-Ting Wu , Lin-Ai Tai , Leu-Wei Lo , Chung-Shi Yang
IPC分类号： A61K38/43 , A61K9/127 , A61K9/52 , A61K9/54 , A61K9/60 , A61K9/64
CPC分类号： A61K9/0014 , A61K9/127 , A61K9/5153 , A61K47/6911 , A61K47/6937 , A61K49/0043 , A61K49/0084 , A61K49/0093 , B82Y5/00
摘要： Methods and compositions for enhancing transdermal delivery of a bioactive agent. The method contains the step of applying to a skin tissue an effective amount of a composition comprising: (a) a drug vehicle; (b) a bioactive agent encapsulated within the drug vehicle; (c) a plurality of proteolytic enzyme molecules conjugated onto the surface of the drug vehicle; and (d) a pharmaceutically acceptable carrier, for a period of time effective to deliver the bioactive agent across the skin tissue at a desired dosage.
摘要翻译：用于增强生物活性剂透皮递送的方法和组合物。该方法包括向皮肤组织施用有效量的组合物的步骤，其包含：（a）药物载体; （b）包封在药物载体内的生物活性剂; （c）缀合在药物载体表面上的多个蛋白水解酶分子; 和（d）药学上可接受的载体，在一段时间内有效地以期望的剂量递送生物活性剂穿过皮肤组织。

9. 发明申请

US20110052711A1 CONTROLLED RELEASE MULTIDRUG FORMULATIONS FOR SPINAL CORD INJURY 有权
标题翻译：用于脊髓损伤的控制释放多药物制剂
公开(公告)号：US20110052711A1
公开(公告)日：2011-03-03
申请号：US12548434
申请日：2009-08-27
申请人： Yu-Chao Wang , Yi-Ting Wu , Chung-Shi Yang
发明人： Yu-Chao Wang , Yi-Ting Wu , Chung-Shi Yang
IPC分类号： A61K38/16 , A61K9/14 , A61P1/00 , A61P19/00
CPC分类号： A61K38/185 , A61K9/0085 , A61K9/5153 , A61K31/7076 , A61K38/1825 , A61K38/2278 , A61K38/45 , A61K38/51 , A61K45/06 , A61K2300/00
摘要： A controlled release multidrug formulation for improving locomotor recovery after spinal cord injury comprising: (a) a first composition comprising a first bioactive agent, encapsulated within a first polymeric particle; (b) a second composition comprising a second bioactive agent, encapsulated within a second polymeric particle, wherein the second polymeric particle is encapsulated within the first polymeric particle; and (c) a third composition comprising a third bioactive agent, encapsulated within either the first or the second polymeric particle, wherein the second composition is released subsequently to the release of the first composition, and wherein the first bioactive agent is a neurotrophic factor, the second bioactive agent is a collagen synthesis inhibitor, and the third bioactive agent is selected from the group consisting of cyclic AMP (cAMP), an adenylate cyclase activator and a Rho inhibitor.
摘要翻译：一种用于改善脊髓损伤后运动恢复的控释多药物制剂，包括：（a）第一组合物，其包含封装在第一聚合物颗粒内的第一生物活性剂; （b）第二组合物，其包含封装在第二聚合物颗粒内的第二生物活性剂，其中所述第二聚合物颗粒包封在所述第一聚合物颗粒内; 和（c）第三组合物，其包含封装在第一或第二聚合物颗粒内的第三生物活性剂，其中第二组合物随后释放出第一组合物，其中第一生物活性剂是神经营养因子，第二生物活性剂是胶原合成抑制剂，第三生物活性剂选自环AMP（cAMP），腺苷酸环化酶活化剂和Rho抑制剂。

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