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1. 发明申请

US20090236934A1 SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME 有权
标题翻译：表面声波装置及其制造方法
公开(公告)号：US20090236934A1
公开(公告)日：2009-09-24
申请号：US12410131
申请日：2009-03-24
申请人： Shunichi AIKAWA , Masayuki Kitajima , Keiji Tsuda
发明人： Shunichi AIKAWA , Masayuki Kitajima , Keiji Tsuda
IPC分类号： H01L41/04 , H01L41/26
CPC分类号： H03H3/02 , H03H9/02929 , H03H9/02937 , H03H9/02992 , Y10T29/42
摘要： A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) formed on the piezoelectric substrate, an interconnection electrode that is provided on the piezoelectric substrate and is connected to the IDT, the IDT being made of a metal identical to that of the IDT, an inorganic insulation layer that is provided on the piezoelectric substrate so that at least the interconnection electrode is exposed, an insulative resin layer that is located on an interface between the inorganic insulation layer and a portion of the interconnection electrode exposed from the inorganic insulation layer and is formed so as to cover a side surface of the interconnection electrode, and a metal layer that is provided on the interconnection electrode and the insulative resin layer.
摘要翻译：表面声波装置包括压电基板，形成在压电基板上的叉指式换能器（IDT），配置在压电基板上并与IDT连接的互连电极，IDT由与IDT相同的金属制成 IDT是设置在压电基板上至少使互连电极露出的无机绝缘层，位于无机绝缘层与互连电极的从无机物露出的部分的界面上的绝缘性树脂层形成为覆盖互连电极的侧面的金属层和设置在配线电极和绝缘性树脂层上的金属层。

2. 发明申请

US20080125662A1 Acoustic wave device and method of manufacturing the same 失效
标题翻译：声波装置及其制造方法
公开(公告)号：US20080125662A1
公开(公告)日：2008-05-29
申请号：US11987173
申请日：2007-11-28
申请人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
发明人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
IPC分类号： A61B8/12 , H04R31/00
CPC分类号： H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908
摘要： A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.
摘要翻译：一种制造声波器件的方法包括在其上具有声波元件的衬底上形成第一密封部分，使得声波元件的声波振荡的功能区域用作第一非覆盖部分，用于个体化作为第二非覆盖部分的切割区域，在所述第一密封部分上形成第二密封部分以覆盖所述第一非覆盖部分和所述第二未覆盖部分，并且切断所述基板，并且所述第二密封部分密封部分，使得第二未覆盖部分被分割。

3. 发明授权

US07841064B2 Method of manufacturing an acoustic wave device 失效
标题翻译：制造声波装置的方法
公开(公告)号：US07841064B2
公开(公告)日：2010-11-30
申请号：US11987173
申请日：2007-11-28
申请人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
发明人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
IPC分类号： H04R31/00
CPC分类号： H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908
摘要： A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.
摘要翻译：一种制造声波器件的方法包括在其上具有声波元件的衬底上形成第一密封部分，使得声波元件的声波振荡的功能区域用作第一非覆盖部分，用于个体化作为第二非覆盖部分的切割区域，在所述第一密封部分上形成第二密封部分以覆盖所述第一非覆盖部分和所述第二未覆盖部分，并且切断所述基板，并且所述第二密封部分密封部分，使得第二未覆盖部分被分割。

4. 发明授权

US07911116B2 Surface acoustic wave device and method of fabricating the same 有权
标题翻译：表面声波装置及其制造方法
公开(公告)号：US07911116B2
公开(公告)日：2011-03-22
申请号：US12410131
申请日：2009-03-24
申请人： Shunichi Aikawa , Masayuki Kitajima , Keiji Tsuda
发明人： Shunichi Aikawa , Masayuki Kitajima , Keiji Tsuda
IPC分类号： H03H9/25 , H01L41/22
CPC分类号： H03H3/02 , H03H9/02929 , H03H9/02937 , H03H9/02992 , Y10T29/42
摘要： A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) formed on the piezoelectric substrate, an interconnection electrode that is provided on the piezoelectric substrate and is connected to the IDT, the IDT being made of a metal identical to that of the IDT, an inorganic insulation layer that is provided on the piezoelectric substrate so that at least the interconnection electrode is exposed, an insulative resin layer that is located on an interface between the inorganic insulation layer and a portion of the interconnection electrode exposed from the inorganic insulation layer and is formed so as to cover a side surface of the interconnection electrode, and a metal layer that is provided on the interconnection electrode and the insulative resin layer.
摘要翻译：表面声波装置包括压电基板，形成在压电基板上的叉指式换能器（IDT），配置在压电基板上并与IDT连接的互连电极，IDT由与IDT相同的金属制成 IDT是设置在压电基板上至少使互连电极露出的无机绝缘层，位于无机绝缘层与互连电极的从无机物露出的部分的界面上的绝缘性树脂层形成为覆盖互连电极的侧面的金属层和设置在配线电极和绝缘性树脂层上的金属层。

5. 发明申请

US20090175470A1 ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：声波装置及其制造方法
公开(公告)号：US20090175470A1
公开(公告)日：2009-07-09
申请号：US12349265
申请日：2009-01-06
申请人： Shunichi Aikawa , Masayuki Kitajima , Keiji Tsuda
发明人： Shunichi Aikawa , Masayuki Kitajima , Keiji Tsuda
IPC分类号： H04R25/00 , H04R31/00
CPC分类号： H04R31/00 , H01L2224/11 , H04R17/00 , H04R2499/11 , Y10T29/49005
摘要： An acoustic wave device includes a substrate; an acoustic wave element provided on the substrate; a terminal that is provided on the substrate and is electrically coupled to the acoustic wave element; a first insulating layer that is provided on the substrate and has a first opening at a region thereof overlapped with at least a part of the terminal; a second insulating layer that has an second opening at a region thereof overlapped with at least a part of the first opening and is provided on the first insulating layer and the acoustic wave element so that a cavity is formed above the acoustic wave element; a third insulating layer that has a third opening including the region where the first opening and the second opening are overlapped with each other, and is provided on the second insulating layer; a metal post that is electrically coupled to the terminal and is provided in the first opening, the second opening and the third opening; and a solder ball provided on the metal post.
摘要翻译：声波装置包括：基板; 设置在基板上的声波元件; 设置在所述基板上并且电耦合到所述声波元件的端子; 第一绝缘层，其设置在所述基板上，并且在其与所述端子的至少一部分重叠的区域具有第一开口; 第二绝缘层，其在与第一开口的至少一部分重叠的区域处具有第二开口，并且设置在第一绝缘层和声波元件上，使得在声波元件上形成空腔; 第三绝缘层，其具有包括第一开口和第二开口彼此重叠的区域的第三开口，并且设置在第二绝缘层上; 电连接到端子并设置在第一开口，第二开口和第三开口中的金属柱; 以及设置在金属柱上的焊球。

6. 发明授权

US08604347B2 Board reinforcing structure, board assembly, and electronic device 有权
标题翻译：板加强结构，电路板组装和电子设备
公开(公告)号：US08604347B2
公开(公告)日：2013-12-10
申请号：US13075895
申请日：2011-03-30
申请人： Hiroshi Kobayashi , Satoshi Emoto , Masayuki Kitajima , Toru Okada
发明人： Hiroshi Kobayashi , Satoshi Emoto , Masayuki Kitajima , Toru Okada
IPC分类号： H05K1/03 , H05K7/00 , H01L23/58
CPC分类号： H05K3/3436 , H01L23/562 , H01L2224/16225 , H01L2924/19105 , H05K1/0271 , H05K2201/10674 , H05K2201/10734 , H05K2201/2009 , Y02P70/613
摘要： Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.
摘要翻译：公开了一种用于加强其中电子部件安装在第一表面上的电路板的电路板加强结构，该电子部件具有布置在第一表面上的矩形区域中的电极。板加强结构包括加强构件，该加强构件在设置在与电路板的第一表面相对的一侧上的第二表面上接合到与矩形区域的四个角的角部相对应的位置。在板加强结构中，在加强构件中，在与矩形区域的四个角的一个角部相对应的位置处形成相应的一个切口，并且加强构件的至少两个顶点指向外部形成为与其中一个凹口成形其轮廓。

7. 发明授权

US06541898B2 Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method 失效
公开(公告)号：US06541898B2
公开(公告)日：2003-04-01
申请号：US09822636
申请日：2001-03-30
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

8. 发明授权

US08314339B2 Circuit board with kneaded conductive paste 失效
标题翻译：电路板用捏合的导电膏
公开(公告)号：US08314339B2
公开(公告)日：2012-11-20
申请号：US12495860
申请日：2009-07-01
申请人： Masayuki Kitajima , Takeshi Ishitsuka , Satoshi Emoto
发明人： Masayuki Kitajima , Takeshi Ishitsuka , Satoshi Emoto
IPC分类号： H05K1/03 , H05K1/09
CPC分类号： H05K3/249 , H05K1/118 , H05K2201/0272 , H05K2201/035 , H05K2201/0769 , H05K2203/1105
摘要： A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.
摘要翻译：印刷布线板包括形成布线图案的第一导电浆料和包含捏合的第一导电材料的第二导电浆料和其颗粒比第一导电材料细颗粒的第二导电材料。

9. 发明授权

US06744183B2 Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method 失效
标题翻译：压电元件与电极的接合方法以及使用该接合方法的压电微型致动器
公开(公告)号：US06744183B2
公开(公告)日：2004-06-01
申请号：US10347708
申请日：2003-01-21
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
摘要翻译：一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。

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