专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07304658B2 Thermal printer and method for correcting the energizing time data for heating elements in the thermal printer 失效
标题翻译：热敏打印机和用于校正热敏打印机中加热元件的通电时间数据的方法
公开(公告)号：US07304658B2
公开(公告)日：2007-12-04
申请号：US11294606
申请日：2005-12-06
申请人： Tadahiro Naito , Yutaka Noda
发明人： Tadahiro Naito , Yutaka Noda
IPC分类号： B41J2/36
CPC分类号： B41J2/365
摘要： A thermal printer comprises: a ROM 11 for storing a heat history correction table; a RAM 12 for storing the density-related energizing time data for the first and second preceding lines printed immediately before the current line to be printed and the density-related energizing time data before a correction for the current line to be printed which includes a target dot T; and a control section for comparing the density-related energizing time data for the first and second preceding lines and the density-related energizing time data before a correction for both adjacent dots T1 and T2 of the target dot T with the density-related energizing time data before a correction for the target dot T to select reference data, and further for performing a corrective operation for the pre-correction energizing time data for the target dot T using thus selected reference data to calculate energizing time data for the target dot T to be printed, whereby it is possible to prevent the temperature of a thermal head from being reduced excessively.
摘要翻译：热敏打印机包括：用于存储热历史校正表的ROM11; 用于存储紧接在要打印的当前行之前打印的第一和第二行之前的密度相关通电时间数据的RAM 12和包括目标的当前打印行的校正之前的浓度相关通电时间数据点T 以及控制部分，用于比较与目标点T的相邻点T 1和T 2的校正之前的第一和第二行的密度相关的通电时间数据和密度相关的通电时间数据与密度相关在对目标点T进行校正之前激励时间数据以选择参考数据，并且还使用这样选择的参考数据对目标点T的预校正通电时间数据进行校正操作，以计算目标点的通电时间数据 T，从而可以防止热头的温度过度降低。

2. 发明申请

US20070273745A1 Image Generating Apparatus 失效
标题翻译：图像发生装置
公开(公告)号：US20070273745A1
公开(公告)日：2007-11-29
申请号：US11752679
申请日：2007-05-23
申请人： Yutaka Noda
发明人： Yutaka Noda
IPC分类号： B41J32/00
CPC分类号： B41J29/02 , B41J25/316 , B41J29/17 , B41J29/38
摘要： This image generating apparatus comprises an ink sheet cartridge storing an ink sheet. When sensing arrival of the rear end of the ink sheet, the image generating apparatus cleans the print head by rotating the print head between a printing position and a nonprinting position (separate position) thereby dropping foreign matter adhering to the print head onto the ink sheet.
摘要翻译：该图像生成装置包括存储墨纸的墨纸盒。当感测墨纸的后端的到达时，图像生成装置通过在打印位置和非打印位置（分离位置）之间旋转打印头来清洁打印头，从而将附着到打印头的异物掉落到墨纸上。

3. 发明申请

US20060204307A1 Image forming device and image forming method 失效
标题翻译：图像形成装置和图像形成方法
公开(公告)号：US20060204307A1
公开(公告)日：2006-09-14
申请号：US11362849
申请日：2006-02-28
申请人： Yutaka Noda
发明人： Yutaka Noda
IPC分类号： B41J35/28
CPC分类号： B41J35/36 , B41J35/16
摘要： A method of forming an image on a transfer sheet based on electronic data uses an image forming device and an ink ribbon cartridge. An ink ribbon of the ink ribbon cartridge has a plurality of ink films formed thereon with boundary lines being provided between the ink films. In the image forming method, the ink ribbon of the ink ribbon cartridge is conveyed when the power to the image forming device is turned on and the ink ribbon cartridge is installed in the image forming device and before the user inputs the image forming instruction. While the ink ribbon of the ink ribbon cartridge is conveyed, it is determined with a boundary line detecting unit whether at least one of the boundary lines formed on the ink ribbon has reached a predetermined position in the image forming device.
摘要翻译：基于电子数据在转印纸上形成图像的方法使用图像形成装置和色带盒。墨带盒的墨带具有形成在其上的多个油墨膜，边缘线设置在墨膜之间。在图像形成方法中，当图像形成装置的电源打开并且色带盒安装在图像形成装置中并且在用户输入图像形成指令之前，墨带盒的墨带被传送。当输送色带盒的色带时，用边界线检测单元确定形成在色带上的至少一条边界线是否已经到达图像形成装置中的预定位置。

4. 发明授权

US06893512B2 Solder alloy and soldered bond 有权
标题翻译：焊接合金和焊接焊接
公开(公告)号：US06893512B2
公开(公告)日：2005-05-17
申请号：US10356546
申请日：2003-02-03
申请人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
发明人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
IPC分类号： B23K35/02 , B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： B23K35/262 , B23K35/025 , B23K2101/36 , H05K3/3463
摘要： A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.
摘要翻译：具有与常规Pb-Sn焊料合金相当的可焊性的焊料合金，而不会对环境产生不利影响，并且使用焊料合金。由Zn：4.0〜10.0重量％，In：1.0〜15.0重量％，Al：0.0020〜0.0100重量％，Sn和不可避免的杂质构成的焊料合金。由上述焊料合金构成的电气或电子设备的焊接结合体。

5. 发明授权

US06432806B1 Method of forming bumps and template used for forming bumps 失效
标题翻译：形成凸块的方法和用于形成凸块的模板
公开(公告)号：US06432806B1
公开(公告)日：2002-08-13
申请号：US09417770
申请日：1999-10-14
申请人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka
发明人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka
IPC分类号： H01L2144
CPC分类号： B23K26/10 , B23K26/382 , B23K26/40 , B23K2103/16 , B23K2103/30 , B23K2103/42 , B23K2103/50 , C03C15/00 , C03C23/0025 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/15311 , H05K3/002 , H05K3/0029 , H05K3/0055 , H05K3/3478 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/0525 , H05K2203/082 , H05K2203/107 , Y10S438/963 , Y10T29/49144 , H01L2924/00 , H01L2224/05599
摘要： A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.
摘要翻译：公开了一种制造具有通过真空抽吸吸引和支撑导电球的通孔的模板的方法。通过蚀刻形成通孔，并且通过激光束使通孔的侧壁平滑通孔的侧壁。可以使用该方法形成模板和金属凸块。或者，模板可以形成为两层结构。

6. 发明授权

US06361626B1 Solder alloy and soldered bond 有权
标题翻译：焊接合金和焊接焊接
公开(公告)号：US06361626B1
公开(公告)日：2002-03-26
申请号：US09839371
申请日：2001-04-23
申请人： Masayuki Kitajima , Hitoshi Homma , Masakazu Takesue , Tadaaki Shono , Yutaka Noda
发明人： Masayuki Kitajima , Hitoshi Homma , Masakazu Takesue , Tadaaki Shono , Yutaka Noda
IPC分类号： C22C1300
CPC分类号： C22C13/00 , B23K35/262 , C22C13/02
摘要： A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.
摘要翻译：无铅焊料合金和使用其的焊接焊料，其中焊料合金没有有害的环境效应，但具有与常规Pb-Sn焊料合金相当的可焊性。本发明的焊料合金由Zn：3.0〜14.0重量％，Al：0.0020〜0.0080重量％，余量由Sn和不可避免的杂质构成，Zn：3.0〜14.0重量％，Bi：3.0-6.0 wt％，Al：0.0020-0.0100wt％，余量为Sn和不可避免的杂质。本发明的焊接键由本发明的焊料合金中的任一种组成。

7. 发明授权

US06320158B1 Method and apparatus of fabricating perforated plate 失效
标题翻译：制造多孔板的方法和装置
公开(公告)号：US06320158B1
公开(公告)日：2001-11-20
申请号：US09231485
申请日：1999-01-14
申请人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka , Fumihiko Tokura
发明人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka , Fumihiko Tokura
IPC分类号： B23K2638
CPC分类号： B23K26/382 , B23K26/10 , B23K26/40 , B23K2103/16 , B23K2103/30 , B23K2103/42 , B23K2103/50 , C03C15/00 , C03C23/0025 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/742 , H01L2224/75 , H01L2224/75745 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/014 , H01L2924/07802 , H05K3/0029 , H05K3/3478 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/082 , H01L2924/00 , H01L2224/05599
摘要： A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.
摘要翻译：在具有电极的芯片上形成凸块的方法。该方法包括使用具有对应于芯片的电极布置的通孔的模板。该模板通过真空抽吸保持在通孔处形成与模板的凸起的导电球。模板的通孔由激光器形成，通过将玻璃板支撑在具有空腔的支撑台上，并且在空腔的位置处用激光束照射该板。

8. 发明授权

US07456854B2 Thermal printer 失效
标题翻译：热敏打印机
公开(公告)号：US07456854B2
公开(公告)日：2008-11-25
申请号：US11327428
申请日：2006-01-09
申请人： Tadahiro Naito , Yutaka Noda
发明人： Tadahiro Naito , Yutaka Noda
IPC分类号： B41J2/38
CPC分类号： B41J2/355 , B41J2/365
摘要： A thermal printer includes a control part; a thermal head that is heated upon a heating instruction from the control part and stops heating upon a heating-ending instruction from the control part; a temperature detector that detects a temperature of the thermal head upon a temperature detection instruction from the control part; and a feed motor that is driven upon a conveyance instruction from the control part and stops the conveyance upon a conveyance-ending instruction from the control part. The control part issues, prior to printing, the heating instruction and the conveyance instruction such that the heating of the thermal head and the conveyance of the paper are performed in parallel. The control part issues the temperature detection instruction as an interrupt every predetermined period of time after the heating instruction is issued, and issues the heating-ending instruction when the temperature of the thermal head reaches a predetermined preheat-ending temperature.
摘要翻译：热敏打印机包括控制部分; 根据来自控制部的加热指示加热的热敏头，并根据来自控制部的加热结束指示停止加热; 温度检测器，其根据来自所述控制部的温度检测指示来检测所述热敏头的温度; 以及馈送电动机，其根据来自控制部分的传送指令而被驱动，并且根据来自控制部分的传送结束指令来停止传送。控制部分在打印之前发出加热指令和输送指令，使得并行地进行热敏头的加热和纸的输送。控制部分在发出加热指令之后的每个预定时间段发出温度检测指令作为中断，并且当热敏头的温度达到预定的预热温度时发出加热结束指令。

9. 发明申请

US20080101746A1 OPTICAL MODULE 有权
标题翻译：光学模块
公开(公告)号：US20080101746A1
公开(公告)日：2008-05-01
申请号：US11553743
申请日：2006-10-27
申请人： Toru Okada , Masanao Fujii , Yutaka Noda
发明人： Toru Okada , Masanao Fujii , Yutaka Noda
IPC分类号： G02B6/12
CPC分类号： G03B17/00 , H05K3/303 , H05K2201/0305 , H05K2201/09781 , H05K2201/10121 , H05K2201/10727 , H05K2203/0182 , Y02P70/613
摘要： An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.
摘要翻译：光学模块具有具有设置有端子焊盘和着陆焊盘的基板表面的基板，以及具有端子的光学元件封装，并且安装在基板表面上，其间形成有间隙。当光学元件封装安装在基板表面上时，光学元件封装和基板表面之间的间隙由着陆焊盘确定。端子焊盘和着陆焊盘在光学元件封装安装在基板表面上的状态下露出，并且端子焊盘通过焊料电连接到相应的端子。

10. 发明申请

US20080020561A1 BALL CAPTURING APPARATUS, SOLDER BALL DISPOSING APPARATUS, BALL CAPTURING METHOD, AND SOLDER BALL DISPOSING METHOD 有权
标题翻译：球拍装置，焊球处理装置，球拍方法和焊球处理方法
公开(公告)号：US20080020561A1
公开(公告)日：2008-01-24
申请号：US11864600
申请日：2007-09-28
申请人： Masanao FUJII , Toru OKADA , Yutaka NODA , Ryoji MATSUYAMA , Hidehiko KOBAYASHI , Hisao TANAKA
发明人： Masanao FUJII , Toru OKADA , Yutaka NODA , Ryoji MATSUYAMA , Hidehiko KOBAYASHI , Hisao TANAKA
IPC分类号： H01L21/44
CPC分类号： H01L21/4853 , B23K3/0623 , H01L2224/11334 , H05K3/3478 , H05K2203/0195 , H05K2203/041 , H05K2203/081 , H05K2203/082
摘要： The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding member 111 including a holding wall 111a air-tightly closing a space S that holds a plurality of balls B having the same size and in which a hole 1111 larger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup means 112 for blowing the balls B held in the holding member 111 upward; and capturing means 12 for capturing a ball B blown up by the blowup means 112 and reached the hole.
摘要翻译：本发明涉及一种从具有相同尺寸的多个球捕获一个球的球捕获装置和方法，以及一种焊球设置装置和将含有焊料的焊球放置在电路板上的预定位置的方法，从而可靠地从具有相同尺寸的多个球捕获一个球。该装置包括：保持构件111，其包括保持壁111，气密地封闭保持具有相同尺寸的多个球B的空间S，并且其中具有大于一个球的尺寸的孔1111并且小于一个球的尺寸两个球形成在保持壁的上部; 用于将保持在保持构件111中的球B向上吹的吹出装置112; 以及捕获装置12，用于捕获由喷射装置112吹起的球B并到达该孔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式