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    • 1. 发明授权
    • Gallium nitride-based compound semiconductor device
    • 氮化镓系化合物半导体器件
    • US07700940B2
    • 2010-04-20
    • US10521544
    • 2003-07-01
    • Shiro SakaiTomoya Sugahara
    • Shiro SakaiTomoya Sugahara
    • H01L33/00
    • H01L33/32B82Y20/00H01L33/06
    • An LED emitting light of wavelength mainly 375 nm or below. The LED includes a GaN layer (16), an n-clad layer (20), an AlInGaN buffer layer (22), a light emitting layer (24), a p-clad layer (26), a p-electrode (30), and an n-electrode (32) arranged on a substrate (10). The light emitting layer (24) has a multi-layer quantum well structure (MQW) in which an InGaN well layer and an AlInGaN barrier layer are superimposed. The quantum well structure increases the effective band gap of the InGaN well layer and reduces the light emitting wavelength. Moreover, by using the AlInGaN buffer layer (22) as the underlying layer of the light emitting layer (24), it is possible to effectively inject electrons into the light emitting layer (24), thereby increasing the light emitting efficiency.
    • 发射波长主要为375nm或以下的LED的LED。 LED包括GaN层(16),n覆盖层(20),AlInGaN缓冲层(22),发光层(24),p覆盖层(26),p电极(30) )和布置在基板(10)上的n电极(32)。 发光层(24)具有叠层InGaN阱层和AlInGaN阻挡层的多层量子阱结构(MQW)。 量子阱结构增加了InGaN阱层的有效带隙并降低了发光波长。 此外,通过使用AlInGaN缓冲层(22)作为发光层(24)的下层,可以有效地将电子注入到发光层(24)中,从而提高发光效率。
    • 2. 发明授权
    • Gallium nitride compound semiconductor device and manufacturing method
    • 氮化镓化合物半导体器件及其制造方法
    • US07372066B2
    • 2008-05-13
    • US10516703
    • 2003-06-04
    • Hisao SatoTomoya SugaharaShinji KitazawaYoshihiko MuramotoShiro Sakai
    • Hisao SatoTomoya SugaharaShinji KitazawaYoshihiko MuramotoShiro Sakai
    • H01L29/06
    • H01L33/32B82Y20/00H01L33/04H01L33/06
    • A light-emitting element using GaN. On a substrate (10), formed are an SiN buffer layer (12), a GaN buffer layer (14), an undoped GaN layer (16), an Si-doped n-GaN layer (18), an SLS layer (20), an undoped GaN layer (22), an MQW light-emitting layer (24), an SLS layer (26), and a p-GaN layer (28), forming a p electrode (30) and an n electrode (32). The MQW light-emitting layer (24) has a structure in which InGaN well layers and AlGaN barrier layers are alternated. The Al content ratios of the SLS layers (20, and 26) are more than 5% and less than 24%. The In content ratio of the well layer in the MQW light-emitting layer (24) is more than 3% and less than 20%. The Al content ratio of the barrier layer is more than 1% and less than 30%. By adjusting the content ratio and film thickness of each layer to a desired value, the light luminous efficiency for wavelength of less than 400 nm is improved.
    • 使用GaN的发光元件。 在形成的衬底(10)上形成SiN缓冲层(12),GaN缓冲层(14),未掺杂的GaN层(16),Si掺杂的n-GaN层(18),SLS层(20 ),形成p型电极(30)和n电极(32)的未掺杂GaN层(22),MQW发光层(24),SLS层(26)和p-GaN层(28) 。 MQW发光层(24)具有其中InGaN阱层和AlGaN势垒层交替的结构。 SLS层(20和26)的Al含量比大于5%且小于24%。 MQW发光层(24)中的阱层的In含量比大于3%且小于20%。 阻挡层的Al含量比大于1%且小于30%。 通过将各层的含有率和膜厚度调整为所需值,波长小于400nm的光发光效率提高。
    • 3. 发明申请
    • Gallium nitride compound semiconductor device and manufacturing method
    • 氮化镓化合物半导体器件及其制造方法
    • US20060175600A1
    • 2006-08-10
    • US10516703
    • 2003-06-04
    • Hisao SatoTomoya SugaharaShinji KitazawaYoshihiko MuramotoShiro Sakai
    • Hisao SatoTomoya SugaharaShinji KitazawaYoshihiko MuramotoShiro Sakai
    • H01L31/109H01L21/00
    • H01L33/32B82Y20/00H01L33/04H01L33/06
    • A light-emitting element using GaN. On a substrate (10), formed are an SiN buffer layer (12), a GaN buffer layer (14), an undoped GaN layer (16), an Si-doped n-GaN layer (18), an SLS layer (20), an undoped GaN layer (22), an MQW light-emitting layer (24), an SLS layer (26), and a p-GaN layer (28), forming a p electrode (30) and an n electrode (32). The MQW light-emitting layer (24) has a structure in which InGaN well layers and AlGaN barrier layers are alternated. The Al content ratios of the SLS layers (20, and 26) are more than 5% and less than 24%. The In content ratio of the well layer in the MQW light-emitting layer (24) is more than 3% and less than 20%. The Al content ratio of the barrier layer is more than 1% and less than 30%. By adjusting the content ratio and film thickness of each layer to a desired value, the light luminous efficiency for wavelength of less than 400 nm is improved.
    • 使用GaN的发光元件。 在形成的衬底(10)上形成SiN缓冲层(12),GaN缓冲层(14),未掺杂的GaN层(16),Si掺杂的n-GaN层(18),SLS层(20 ),形成p型电极(30)和n电极(32)的未掺杂GaN层(22),MQW发光层(24),SLS层(26)和p-GaN层(28) 。 MQW发光层(24)具有其中InGaN阱层和AlGaN势垒层交替的结构。 SLS层(20和26)的Al含量比大于5%且小于24%。 MQW发光层(24)中的阱层的In含量比大于3%且小于20%。 阻挡层的Al含量比大于1%且小于30%。 通过将各层的含有率和膜厚度调整为所需值,波长小于400nm的光发光效率提高。
    • 4. 发明申请
    • Gallium nitride-based compound semiconductor device
    • 氮化镓系化合物半导体器件
    • US20050236642A1
    • 2005-10-27
    • US10521544
    • 2003-07-01
    • Shiro SakaiTomoya Sugahara
    • Shiro SakaiTomoya Sugahara
    • H01L33/06H01L33/12H01L33/32H01L33/00
    • H01L33/32B82Y20/00H01L33/06
    • An LED emitting light of wavelength mainly 375 nm or below. The LED includes a GaN layer (16), an n-clad layer (20), an AlInGaN buffer layer (22), a light emitting layer (24), a p-clad layer (26), a p-electrode (30), and an n-electrode (32) arranged on a substrate (10). The light emitting layer (24) has a multi-layer quantum well structure (MQW) in which an InGaN well layer and an AlInGaN barrier layer are superimposed. The quantum well structure increases the effective band gap of the InGaN well layer and reduces the light emitting wavelength. Moreover, by using the AlInGaN buffer layer (22) as the underlying layer of the light emitting layer (24), it is possible to effectively inject electrons into the light emitting layer (24), thereby increasing the light emitting efficiency.
    • 发射波长主要为375nm或以下的LED的LED。 LED包括GaN层(16),n覆盖层(20),AlInGaN缓冲层(22),发光层(24),p覆盖层(26),p电极(30) )和布置在基板(10)上的n电极(32)。 发光层(24)具有叠层InGaN阱层和AlInGaN阻挡层的多层量子阱结构(MQW)。 量子阱结构增加了InGaN阱层的有效带隙并降低了发光波长。 此外,通过使用AlInGaN缓冲层(22)作为发光层(24)的下层,可以有效地将电子注入到发光层(24)中,从而提高发光效率。