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1. 发明授权

US07115896B2 Semiconductor structures for gallium nitride-based devices 有权
标题翻译：用于氮化镓基器件的半导体结构
公开(公告)号：US07115896B2
公开(公告)日：2006-10-03
申请号：US10721488
申请日：2003-11-25
申请人： Shiping Guo , David Gotthold , Milan Pophristic , Boris Peres , Ivan Eliashevich , Bryan S. Shelton , Alex D. Ceruzzi , Michael Murphy , Richard A. Stall
发明人： Shiping Guo , David Gotthold , Milan Pophristic , Boris Peres , Ivan Eliashevich , Bryan S. Shelton , Alex D. Ceruzzi , Michael Murphy , Richard A. Stall
IPC分类号： H01L29/06
CPC分类号： H01L29/155 , C30B29/68 , H01L21/02381 , H01L21/02458 , H01L21/02491 , H01L21/02507 , H01L21/0254 , H01L29/2003 , H01L33/007
摘要： A nitride semiconductor is grown on a silicon substrate by depositing a few mono-layers of aluminum to protect the silicon substrate from ammonia used during the growth process, and then forming a nucleation layer from aluminum nitride and a buffer structure including multiple superlattices of AlRGa(1-R)N semiconductors having different compositions and an intermediate layer of GaN or other Ga-rich nitride semiconductor. The resulting structure has superior crystal quality. The silicon substrate used in epitaxial growth is removed before completion of the device so as to provide superior electrical properties in devices such as high-electron mobility transistors.
摘要翻译：在硅衬底上生长氮化物半导体，通过沉积几个单层铝，以保护硅衬底免受生长过程中使用的氨的影响，然后从氮化铝形成成核层，并形成包含多个超晶格Al 具有不同组成的半导体和GaN或其它富镓氮化物半导体的中间层的半导体。所得结构具有优异的晶体质量。在器件完成之前除去用于外延生长的硅衬底，以便在诸如高电子迁移率晶体管的器件中提供优异的电性能。

2. 发明授权

US07084475B2 Lateral conduction Schottky diode with plural mesas 有权
标题翻译：具有多个台面的横向导通肖特基二极管
公开(公告)号：US07084475B2
公开(公告)日：2006-08-01
申请号：US10780363
申请日：2004-02-17
申请人： Bryan S. Shelton , Linlin Liu , Alex D. Ceruzzi , Michael Murphy , Milan Pophristic , Boris Peres , Richard A. Stall , Xiang Gao , Ivan Eliashevich
发明人： Bryan S. Shelton , Linlin Liu , Alex D. Ceruzzi , Michael Murphy , Milan Pophristic , Boris Peres , Richard A. Stall , Xiang Gao , Ivan Eliashevich
IPC分类号： H01L29/47
CPC分类号： H01L24/81 , H01L29/0692 , H01L29/2003 , H01L29/872 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01023 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/12032 , H01L2924/00
摘要： A lateral conduction Schottky diode includes multiple mesa regions upon which Schottky contacts are formed and which are at least separated by ohmic contacts to reduce the current path length and reduce current crowding in the Schottky contact, thereby reducing the forward resistance of a device. The multiple mesas may be isolated from one another and have sizes and shapes optimized for reducing the forward resistance. Alternatively, some of the mesas may be finger-shaped and intersect with a central mesa or a bridge mesa, and some or all of the ohmic contacts are interdigitated with the finger-shaped mesas. The dimensions of the finger-shaped mesas and the perimeter of the intersecting structure may be optimized to reduce the forward resistance. The Schottky diodes may be mounted to a submount in a flip chip arrangement that further reduces the forward voltage as well as improves power dissertation and reduces heat generation.
摘要翻译：横向导通肖特基二极管包括形成肖特基接触的多个台面区域，其至少由欧姆接触分开，以减小电流路径长度并减少肖特基接触中的电流拥挤，从而降低器件的正向电阻。多个台面可以彼此隔离并且具有优化的尺寸和形状以减少前向阻力。或者，一些台面可以是手指形状并与中央台面或桥台面相交，并且部分或全部欧姆接触件与指状台面相互交错。指状台面的尺寸和相交结构的周长可以被优化以减小正向阻力。肖特基二极管可以以倒装芯片布置的方式安装到基座上，这进一步降低了正向电压，并且改善了功率论文并减少了发热。

3. 发明申请

US20060154455A1 Gallium nitride-based devices and manufacturing process 审中-公开
标题翻译：基于氮化镓的器件及制造工艺
公开(公告)号：US20060154455A1
公开(公告)日：2006-07-13
申请号：US11371738
申请日：2006-03-09
申请人： Shiping Guo , David Gotthold , Milan Pophristic , Boris Peres , Ivan Eliashevich , Bryan Shelton , Alex Ceruzzi , Michael Murphy , Richard Stall
发明人： Shiping Guo , David Gotthold , Milan Pophristic , Boris Peres , Ivan Eliashevich , Bryan Shelton , Alex Ceruzzi , Michael Murphy , Richard Stall
IPC分类号： H01L21/20 , H01L21/36 , H01L31/20
CPC分类号： H01L29/155 , C30B29/68 , H01L21/02381 , H01L21/02458 , H01L21/02491 , H01L21/02507 , H01L21/0254 , H01L29/2003 , H01L33/007
摘要： A nitride semiconductor is grown on a silicon substrate by depositing a few mono-layers of aluminum to protect the silicon substrate from ammonia used during the growth process, and then forming a nucleation layer from aluminum nitride and a buffer structure including multiple superlattices of AlRGa(1-R)N semiconductors having different compositions and an intermediate layer of GaN or other Ga-rich nitride semiconductor. The resulting structure has superior crystal quality. The silicon substrate used in epitaxial growth is removed before completion of the device so as to provide superior electrical properties in devices such as high-electron mobility transistors.
摘要翻译：在硅衬底上生长氮化物半导体，通过沉积几个单层铝，以保护硅衬底免受生长过程中使用的氨的影响，然后从氮化铝形成成核层，并形成包含多个超晶格Al 具有不同组成的半导体和GaN或其它富镓氮化物半导体的中间层的半导体。所得结构具有优异的晶体质量。在器件完成之前除去用于外延生长的硅衬底，以便在诸如高电子迁移率晶体管的器件中提供优异的电性能。

4. 发明申请

US20050179104A1 Lateral conduction schottky diode with plural mesas 有权
标题翻译：具有多个台面的横向导通肖特基二极管
公开(公告)号：US20050179104A1
公开(公告)日：2005-08-18
申请号：US10780363
申请日：2004-02-17
申请人： Bryan Shelton , Linlin Liu , Alex Ceruzzi , Michael Murphy , Milan Pophristic , Boris Peres , Richard Stall , Xiang Gao , Ivan Eliashevich
发明人： Bryan Shelton , Linlin Liu , Alex Ceruzzi , Michael Murphy , Milan Pophristic , Boris Peres , Richard Stall , Xiang Gao , Ivan Eliashevich
IPC分类号： H01L21/60 , H01L29/06 , H01L29/20 , H01L29/47 , H01L29/872 , H01L21/00 , H01L31/0328
CPC分类号： H01L24/81 , H01L29/0692 , H01L29/2003 , H01L29/872 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01023 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/12032 , H01L2924/00
摘要： A lateral conduction Schottky diode includes multiple mesa regions upon which Schottky contacts are formed and which are at least separated by ohmic contacts to reduce the current path length and reduce current crowding in the Schottky contact, thereby reducing the forward resistance of a device. The multiple mesas may be isolated from one another and have sizes and shapes optimized for reducing the forward resistance. Alternatively, some of the mesas may be finger-shaped and intersect with a central mesa or a bridge mesa, and some or all of the ohmic contacts are interdigitated with the finger-shaped mesas. The dimensions of the finger-shaped mesas and the perimeter of the intersecting structure may be optimized to reduce the forward resistance. The Schottky diodes may be mounted to a submount in a flip chip arrangement that further reduces the forward voltage as well as improves power dissertation and reduces heat generation.
摘要翻译：横向导通肖特基二极管包括形成肖特基接触的多个台面区域，其至少由欧姆接触分开，以减小电流路径长度并减少肖特基接触中的电流拥挤，从而降低器件的正向电阻。多个台面可以彼此隔离并且具有优化的尺寸和形状以减少前向阻力。或者，一些台面可以是手指形状并与中央台面或桥台面相交，并且部分或全部欧姆接触件与指状台面相互交错。指状台面的尺寸和相交结构的周长可以被优化以减小正向阻力。肖特基二极管可以以倒装芯片布置的方式安装到基座上，这进一步降低了正向电压，并且改善了功率论文并减少了发热。

5. 发明授权

US07842547B2 Laser lift-off of sapphire from a nitride flip-chip 有权
标题翻译：激光剥离蓝宝石从氮化物倒装芯片
公开(公告)号：US07842547B2
公开(公告)日：2010-11-30
申请号：US10584434
申请日：2004-12-21
申请人： Bryan S. Shelton , Sebastien Libon , Ivan Eliashevich
发明人： Bryan S. Shelton , Sebastien Libon , Ivan Eliashevich
IPC分类号： H01L21/00 , H01L21/44
CPC分类号： H01L33/0079 , H01L33/62 , H01L2224/48091 , H01L2924/10253 , H01L2924/12041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： In a method for fabricating a flip-chip light emitting diode device, epitaxial layers are deposited on a sapphire growth substrate to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial wafer. The epitaxial wafer is diced to generate a device die. The device die is flip chip bonded to a mount. The flip chip bonding includes securing the device die to the mount by bonding at least one electrode of the device die to at least one bonding pad of the mount. Subsequent to the flip chip bonding, the growth substrate of the device die is removed via the application of laser light.
摘要翻译：在制造倒装芯片发光二极管器件的方法中，将外延层沉积在蓝宝石生长衬底上以产生外延晶片。在外延晶片上制造多个发光二极管器件。切割外延晶片以产生器件裸片。器件芯片被倒装芯片结合到安装座。倒装芯片接合包括通过将器件管芯的至少一个电极接合到安装件的至少一个接合焊盘来将器件裸片固定到安装座。在倒装芯片接合之后，通过施加激光来去除器件裸片的生长衬底。

6. 发明授权

US07064356B2 Flip chip light emitting diode with micromesas and a conductive mesh 失效
标题翻译：倒装芯片发光二极管，具有微电极和导电网
公开(公告)号：US07064356B2
公开(公告)日：2006-06-20
申请号：US10826980
申请日：2004-04-16
申请人： Emil P. Stefanov , Hari S. Venugopalan , Bryan S. Shelton , Ivan Eliashevich
发明人： Emil P. Stefanov , Hari S. Venugopalan , Bryan S. Shelton , Ivan Eliashevich
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , H01L33/08 , H01L33/20
摘要： A flip chip light emitting diode (12) includes a light-transmissive substrate (10) with a base semiconducting layer (40) disposed thereupon. A conductive mesh (18) is disposed on the base semiconducting layer (40) and is in electrically conductive contact therewith. Light-emitting micromesas (30) are disposed in openings (20) of the conductive mesh (18). Each light emitting micromesa (30) has a topmost layer (46) of a second conductivity type that is opposite the first conductivity type. A first conductivity type electrode (14) is disposed on the base semiconducting layer (40) and is in electrical communication with the electrically conductive mesh (18). An insulating layer (60) is disposed over the electrically conductive mesh (18). A second conductivity type electrode layer (24) is disposed over the insulating layer (60) and the light-emitting micromesas (30). the insulating layer (60) insulates the second conductivity type electrode layer (24) from the electrically conductive mesh (18).
摘要翻译：倒装芯片发光二极管（12）包括具有设置在其上的基极半导体层（40）的透光衬底（10）。导电网（18）设置在基底半导体层（40）上并与其导电接触。发光微镜（30）设置在导电网（18）的开口（20）中。每个发光微镜（30）具有与第一导电类型相反的第二导电类型的最上层（46）。第一导电型电极（14）设置在基底半导体层（40）上并与导电网（18）电连通。绝缘层（60）设置在导电网（18）之上。第二导电型电极层（24）设置在绝缘层（60）和发光微孔（30）之上。绝缘层（60）将第二导电型电极层（24）与导电网（18）绝缘。

7. 发明授权

US07285801B2 LED with series-connected monolithically integrated mesas 有权
标题翻译： LED串联单片集成台面
公开(公告)号：US07285801B2
公开(公告)日：2007-10-23
申请号：US10817603
申请日：2004-04-02
申请人： Ivan Eliashevich , Chris Bohler , Bryan S. Shelton , Hari S. Venugopalan , Xiang Gao
发明人： Ivan Eliashevich , Chris Bohler , Bryan S. Shelton , Hari S. Venugopalan , Xiang Gao
IPC分类号： H01L33/00
CPC分类号： H01L27/153 , H01L33/20 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light emitting semiconductor device die (10, 110, 210, 310) includes an electrically insulating substrate (12, 112). First and second spatially separated electrodes (60, 62, 260, 262, 360, 362) are disposed on the electrically insulating substrate. The first and second electrodes define an electrical current flow direction directed from the first electrode to the second electrode. A plurality of light emitting diode mesas (30, 130, 130′, 230, 330) are disposed on the substrate between the first and second spatially separated electrodes. Electrical series interconnections (50, 150, 250, 350) are disposed on the substrate between neighboring light emitting diode mesas. Each series interconnection carries electrical current flow between the neighboring mesas in the electrical current flow direction.
摘要翻译：发光半导体器件管芯（10,110,210,310）包括电绝缘衬底（12,112）。第一和第二空间分离的电极（60,62,260,262,360,362）设置在电绝缘基板上。第一和第二电极限定从第一电极指向第二电极的电流流动方向。多个发光二极管台面（30,130,130'，230,330）设置在第一和第二空间分离的电极之间的衬底上。在相邻的发光二极管台面之间的基板上设置电气串联互连（50,150,250,350）。每个串联互连在电流流动方向上在相邻台面之间承载电流。

8. 发明授权

US06849524B2 Semiconductor wafer protection and cleaning for device separation using laser ablation 有权
标题翻译：半导体晶片保护和清洁用于使用激光烧蚀的器件分离
公开(公告)号：US06849524B2
公开(公告)日：2005-02-01
申请号：US10137904
申请日：2002-05-02
申请人： Bryan S. Shelton , Mark Gottfried , Stephen Schwed , Ivan Eliashevich
发明人： Bryan S. Shelton , Mark Gottfried , Stephen Schwed , Ivan Eliashevich
IPC分类号： B23K26/073 , B23K26/40 , H01L21/301 , H01L21/302 , H01L21/304 , H01L21/46 , H01L21/78 , H01L33/00
CPC分类号： B23K26/0738 , B23K26/066 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/3043 , H01L21/6836 , H01L21/78 , H01L33/0095 , H01L2221/68327 , H01L2221/6834 , H01L2924/0002 , Y10S438/94 , H01L2924/00
摘要： A method of protecting and cleaning a semiconductor wafer using laser ablation includes the following steps: applies a protective coating on the side to be cut of a wafer with sapphire substrate, mounts the other side of the sapphire wafer on an adhesive tape, mounts the sapphire wafer on a cutting table, cuts the sapphire wafer with a laser, breaks the sapphire wafer into die, and cleans the sapphire wafer with a cleaning solution that removes slag resulting from the cutting, debris resulting from the breaking, and the protective coating, but the adhesive tape, the cleaning solution, and the protective coating are selected such that the cleaning solution does not damage the adhesive tape.
摘要翻译：使用激光烧蚀保护和清洁半导体晶片的方法包括以下步骤：在具有蓝宝石衬底的晶片切割侧上施加保护涂层，将蓝宝石晶片的另一侧安装在胶带上，安装蓝宝石在切割台上的晶片，用激光切割蓝宝石晶片，将蓝宝石晶片切割成模具，并用清洁溶液清洁蓝宝石晶片，该清洁溶液除去切割产生的渣，断裂产生的碎屑和保护涂层，但是选择粘合带，清洁溶液和保护涂层，使得清洁溶液不会损坏胶带。

9. 发明授权

US07179670B2 Flip-chip light emitting diode device without sub-mount 有权
标题翻译：倒装芯片发光二极管器件无需安装
公开(公告)号：US07179670B2
公开(公告)日：2007-02-20
申请号：US10794935
申请日：2004-03-05
申请人： Bryan S. Shelton , Sebastien Libon , Hari S. Venugopalan , Ivan Eliashevich , Stanton E. Weaver, Jr. , Chen-Lun Hsing Chen , Thomas F. Soules , Steven LeBoeuf , Stephen Arthur
发明人： Bryan S. Shelton , Sebastien Libon , Hari S. Venugopalan , Ivan Eliashevich , Stanton E. Weaver, Jr. , Chen-Lun Hsing Chen , Thomas F. Soules , Steven LeBoeuf , Stephen Arthur
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L24/81 , H01L33/38 , H01L2224/0345 , H01L2224/03462 , H01L2224/0401 , H01L2224/04026 , H01L2224/05005 , H01L2224/05023 , H01L2224/05027 , H01L2224/0508 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155 , H01L2224/05564 , H01L2224/05568 , H01L2224/05611 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/3003 , H01L2224/73103 , H01L2224/73203 , H01L2224/83193 , H01L2224/83203 , H01L2224/83205 , H01L2224/8321 , H01L2224/8323 , H01L2224/83815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).
摘要翻译：发光二极管（10）具有背面和前侧，具有至少一个n型电极（14）和设置在其上的至少一个p型电极（12），其限定最小电极间隔（d < ）。接合焊盘层（50）包括至少一个n型接合焊盘（64）和至少一个限定最小接合焊盘间隔（p>焊盘）的p型接合焊盘（62）大于最小电极分离（d _{电极）。插入在发光二极管（10）的前侧和接合焊盘层（50）之间的至少一个扇形层（30）包括穿过电介质层的通孔（34,54）的多个导电路径以在所述至少一个n型电极（14）和所述至少一个n型焊盘（64）之间以及所述至少一个p型电极（12）和所述至少一个p型电极（12）之间提供电连通一个p型接合焊盘（62）。}

10. 发明授权

US07087463B2 Laser separation of encapsulated submount 失效
标题翻译：激光分离封装的底座
公开(公告)号：US07087463B2
公开(公告)日：2006-08-08
申请号：US10911052
申请日：2004-08-04
申请人： Michael Sackrison , Xiang Gao , Bryan S. Shelton , Ivan Eliashevich
发明人： Michael Sackrison , Xiang Gao , Bryan S. Shelton , Ivan Eliashevich
IPC分类号： H01L21/44 , H01L21/46 , H01L21/00
CPC分类号： H01L33/0095 , H01L21/78 , H01L2924/0002 , H01L2924/00
摘要： In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).
摘要翻译：在发光封装制造工艺中，多个发光芯片（10）安装在子安装晶片（14）上。附着的发光芯片（10）被封装。使用激光将断裂引发沟槽（30,32）激光切割到附接的发光芯片（10）之间的子安装晶片（14）中。子安装晶片（14）沿断裂引发沟槽（30,32）断裂。

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