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    • 2. 发明授权
    • Methods of forming robust metal contacts on compound semiconductors
    • 在化合物半导体上形成坚固的金属接触的方法
    • US06420252B1
    • 2002-07-16
    • US09568065
    • 2000-05-10
    • Stephen SchwedLouis A. KosziEdward W. DouglasMichael G. Brown
    • Stephen SchwedLouis A. KosziEdward W. DouglasMichael G. Brown
    • H01L2144
    • H01L21/76852H01L21/0272H01L21/31144H01L21/76841H01L21/76897
    • A method of forming a self-aligned contact on a semiconductor includes forming a layer of a dielectric material over a semiconductor, providing a photoresist layer over the dielectric layer and then exposing the photoresist layer with a desired pattern and developing an opening in the photoresist layer. The dielectric material exposed through the photoresist layer opening is then removed to form a contact opening extending through the dielectric material to the semiconductor. The photoresist layer is then eroded so as to enlarge the size of the opening in the photoresist layer, whereby the dielectric material adjacent the contact opening is exposed through the enlarged opening of the photoresist layer. A barrier metal is then deposited in the enlarged opening of the photoresist layer and in the contact opening of the dielectric material, whereby the barrier metal overlies the exposed portion of the dielectric material. A conductive metal is then deposited atop the barrier metal. The barrier metal isolates the contact metal from the semiconductor, thereby preventing interaction or intermixing of the contact metal and the semiconductor.
    • 在半导体上形成自对准接触的方法包括在半导体上形成介电材料层,在介电层上提供光致抗蚀剂层,然后以期望的图案曝光光致抗蚀剂层,并在光刻胶层中显影出一个开口 。 然后去除通过光致抗蚀剂层开口暴露的电介质材料以形成延伸穿过介电材料到半导体的接触开口。 然后蚀刻光致抗蚀剂层以扩大光致抗蚀剂层中的开口的尺寸,由此邻近接触开口的电介质材料通过光致抗蚀剂层的扩大的开口暴露。 然后在光致抗蚀剂层的扩大开口中和介电材料的接触开口中沉积阻挡金属,由此阻挡金属覆盖在电介质材料的暴露部分上。 然后在阻挡金属顶上沉积导电金属。 阻挡金属将接触金属与半导体隔离,从而防止接触金属和半导体的相互作用或混合。
    • 3. 发明授权
    • PIN diode structure with zinc diffusion region
    • PIN二极管结构与锌扩散区
    • US08022495B2
    • 2011-09-20
    • US12420213
    • 2009-04-08
    • Xiang GaoAlex CeruzziLinlin LiuStephen Schwed
    • Xiang GaoAlex CeruzziLinlin LiuStephen Schwed
    • H01L31/06
    • H01L31/105
    • A PIN photodiode having a substrate, a first type electrode layer disposed on the substrate, a first layer of intrinsic material disposed over a portion of the first-type electrode layer, and a first type window layer disposed over the intrinsic layer. An island shaped region of intrinsic material is disposed over the window layer and a dielectric layer is disposed over the island region and at least the peripheral portion of said island shaped region whereby an opening is formed in the island shaped region. A dopant is diffused through the opening so as to form a PN junction that extends into the first layer of intrinsic material.
    • PIN光电二极管,其具有基板,设置在基板上的第一类型电极层,设置在第一类型电极层的一部分上的第一本征材料层,以及设置在本征层上的第一类型窗口层。 本征材料的岛状区域设置在窗口层上方,并且电介质层设置在岛状区域和至少所述岛状区域的周边部分上,从而在岛状区域中形成开口。 掺杂剂通过开口扩散,以便形成延伸到本征材料的第一层中的PN结。