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    • 1. 发明授权
    • Method for manufacturing organic semiconductor element, and organic semiconductor element
    • 制造有机半导体元件和有机半导体元件的方法
    • US08999749B2
    • 2015-04-07
    • US14110643
    • 2012-04-11
    • Shin-ya FujimotoKen Tomino
    • Shin-ya FujimotoKen Tomino
    • H01L51/40H01L51/00H01L51/10H01L51/05
    • H01L51/0001H01L51/0017H01L51/0024H01L51/0512H01L51/0529H01L51/0541H01L51/0545H01L51/0566H01L51/107
    • A method for manufacturing an organic semiconductor element capable of obtaining an organic semiconductor element in which an organic semiconductor layer is patterned without lowering the mobility of the organic semiconductor layer through a simple and easy process, which includes: an organic semiconductor layer formation step; a first dielectric layer formation step of forming a first dielectric layer on the organic semiconductor layer to be positioned at least on a channel region between the source electrode and the drain electrode; and a second dielectric layer formation step, wherein the second dielectric layer has a contact portion contacting the organic semiconductor layer around the first dielectric layer, and a mixed layer in which the organic semiconductor layer and the second dielectric layer are mixed with each other is formed to constitute an interface between the organic semiconductor layer and the second dielectric layer in the contact portion.
    • 一种制造有机半导体元件的方法,该有机半导体元件能够通过简单易用的工艺来降低有机半导体层的迁移率而图案化有机半导体层,而有机半导体元件包括:有机半导体层形成步骤; 第一电介质层形成步骤,在所述有机半导体层上形成至少位于所述源电极和所述漏电极之间的沟道区上的第一电介质层; 以及第二电介质层形成工序,其中,所述第二电介质层具有与所述第一电介质层周围的有机半导体层接触的接触部以及所述有机半导体层和所述第二电介质层彼此混合的混合层 以构成接触部分中的有机半导体层和第二电介质层之间的界面。
    • 2. 发明申请
    • METHOD FOR MANUFACTURING ORGANIC SEMICONDUCTOR ELEMENT, AND ORGANIC SEMICONDUCTOR ELEMENT
    • 制造有机半导体元件和有机半导体元件的方法
    • US20140027752A1
    • 2014-01-30
    • US14110643
    • 2012-04-11
    • Shin-ya FujimotoKen Tomino
    • Shin-ya FujimotoKen Tomino
    • H01L51/00H01L51/05
    • H01L51/0001H01L51/0017H01L51/0024H01L51/0512H01L51/0529H01L51/0541H01L51/0545H01L51/0566H01L51/107
    • A method for manufacturing an organic semiconductor element capable of obtaining an organic semiconductor element in which an organic semiconductor layer is patterned without lowering the mobility of the organic semiconductor layer through a simple and easy process, which includes: an organic semiconductor layer formation step; a first dielectric layer formation step of forming a first dielectric layer on the organic semiconductor layer to be positioned at least on a channel region between the source electrode and the drain electrode; and a second dielectric layer formation step, wherein the second dielectric layer has a contact portion contacting the organic semiconductor layer around the first dielectric layer, and a mixed layer in which the organic semiconductor layer and the second dielectric layer are mixed with each other is formed to constitute an interface between the organic semiconductor layer and the second dielectric layer in the contact portion.
    • 一种制造有机半导体元件的方法,该有机半导体元件能够通过简单易用的工艺来降低有机半导体层的迁移率而图案化有机半导体层,而有机半导体元件包括:有机半导体层形成步骤; 第一电介质层形成步骤,在所述有机半导体层上形成至少位于所述源电极和所述漏电极之间的沟道区上的第一电介质层; 以及第二电介质层形成工序,其中,所述第二电介质层具有与所述第一电介质层周围的有机半导体层接触的接触部以及所述有机半导体层和所述第二电介质层彼此混合的混合层 以构成接触部分中的有机半导体层和第二电介质层之间的界面。
    • 3. 发明授权
    • Method for manufacturing organic semiconductor element
    • 制造有机半导体元件的方法
    • US09018622B2
    • 2015-04-28
    • US14110648
    • 2012-04-11
    • Ken TominoShin-ya FujimotoHiroki Maeda
    • Ken TominoShin-ya FujimotoHiroki Maeda
    • H01L51/05H01L51/00
    • H01L51/0512H01L51/0012H01L51/0017H01L51/0026H01L51/0076H01L51/0541H01L51/0545H01L51/0558
    • A method for manufacturing an organic semiconductor element, capable of obtaining an organic semiconductor element in which an organic semiconductor layer is easily patterned without being lowered in mobility, which includes: a source electrode and drain electrode formation step; an organic semiconductor layer formation step of forming an organic semiconductor layer having the liquid crystal organic semiconductor material on the alignment layer to cover the source electrode and the drain electrode; a dielectric layer formation step of forming a dielectric layer on the organic semiconductor layer to be positioned at least on a channel region between the source electrode and the drain electrode; and an annealing step of annealing the organic semiconductor layer, on which the dielectric layer is formed, at a liquid crystal phase temperature of the liquid crystal organic semiconductor material.
    • 一种制造有机半导体元件的方法,其能够获得有机半导体元件,其中有机半导体层容易图案化而不降低迁移率,其包括:源电极和漏电极形成步骤; 有机半导体层形成步骤,在取向层上形成具有液晶有机半导体材料的有机半导体层,以覆盖源电极和漏电极; 电介质层形成工序,在所述有机半导体层上形成至少位于所述源电极和所述漏电极之间的沟道区域上的电介质层; 以及退火步骤,在液晶有机半导体材料的液晶相温度下退火形成介电层的有机半导体层。
    • 4. 发明申请
    • METHOD FOR MANUFACTURING ORGANIC SEMICONDUCTOR ELEMENT
    • 制造有机半导体元件的方法
    • US20140042421A1
    • 2014-02-13
    • US14110648
    • 2012-04-11
    • Ken TominoShin-ya FujimotoHiroki Maeda
    • Ken TominoShin-ya FujimotoHiroki Maeda
    • H01L51/05
    • H01L51/0512H01L51/0012H01L51/0017H01L51/0026H01L51/0076H01L51/0541H01L51/0545H01L51/0558
    • A method for manufacturing an organic semiconductor element, capable of obtaining an organic semiconductor element in which an organic semiconductor layer is easily patterned without being lowered in mobility, which includes: a source electrode and drain electrode formation step; an organic semiconductor layer formation step of forming an organic semiconductor layer having the liquid crystal organic semiconductor material on the alignment layer to cover the source electrode and the drain electrode; a dielectric layer formation step of forming a dielectric layer on the organic semiconductor layer to be positioned at least on a channel region between the source electrode and the drain electrode; and an annealing step of annealing the organic semiconductor layer, on which the dielectric layer is formed, at a liquid crystal phase temperature of the liquid crystal organic semiconductor material.
    • 一种制造有机半导体元件的方法,其能够获得有机半导体元件,其中有机半导体层容易图案化而不降低迁移率,其包括:源电极和漏电极形成步骤; 有机半导体层形成步骤,在取向层上形成具有液晶有机半导体材料的有机半导体层,以覆盖源电极和漏电极; 电介质层形成工序,在所述有机半导体层上形成至少位于所述源电极和所述漏电极之间的沟道区域上的电介质层; 以及退火步骤,在液晶有机半导体材料的液晶相温度下退火形成介电层的有机半导体层。
    • 5. 发明授权
    • Manufacturing method of organic semiconductor device
    • 有机半导体器件的制造方法
    • US08202759B2
    • 2012-06-19
    • US12863538
    • 2009-01-21
    • Ken TominoMasanao MatsuokaTomomi SuzukiHiroki Maeda
    • Ken TominoMasanao MatsuokaTomomi SuzukiHiroki Maeda
    • H01L51/40
    • H01L51/0013H01L51/003H01L51/0076H01L51/0545H01L51/0558
    • The present invention provides a manufacturing method of an organic semiconductor device comprising a step of transferring an organic semiconductor layer to a gate insulation layer by a thermal transfer at a liquid crystal phase transition temperature of a liquid crystalline organic semiconductor material, and the step uses: an organic semiconductor layer-transferring substrate comprising a parting substrate having parting properties, and the organic semiconductor layer formed on the parting substrate and containing the liquid crystalline organic semiconductor material; and a substrate for forming an organic semiconductor device comprising a substrate, a gate electrode formed on the substrate, and the gate insulation layer formed to cover the gate electrode and having alignment properties which are capable of aligning the liquid crystalline organic semiconductor material on a surface of the gate insulation layer.
    • 本发明提供了一种有机半导体器件的制造方法,其包括通过在液晶有机半导体材料的液晶相变温度下的热转印将有机半导体层转印到栅极绝缘层的步骤,并且该步骤用途: 包括具有分离性质的分离基板的有机半导体层转移基板和形成在分型基板上并含有液晶有机半导体材料的有机半导体层; 以及用于形成有机半导体器件的衬底,包括衬底,形成在衬底上的栅极电极和形成为覆盖栅电极并具有能够使液晶有机半导体材料在表面上对准的取向性能的栅极绝缘层 的栅极绝缘层。
    • 9. 发明授权
    • Organic semiconductor material, organic semiconductor structure, and organic semiconductor device
    • 有机半导体材料,有机半导体结构和有机半导体器件
    • US07470561B2
    • 2008-12-30
    • US11092341
    • 2005-03-29
    • Hiroki MaedaKen TominoShigeru SugawaraJunichi Hanna
    • Hiroki MaedaKen TominoShigeru SugawaraJunichi Hanna
    • H01L51/00H01L35/24H01L29/786C09K19/58C09K19/38
    • H01L51/428H01L51/0039H01L51/0052H01L51/0054H01L51/0055H01L51/0062H01L51/0065H01L51/0067H01L51/0068H01L51/0071H01L51/0076H01L51/0545Y02E10/549Y02P70/521Y10T428/10Y10T428/1005Y10T428/1036Y10T428/1055
    • The main object of the invention is to provide an organic semiconductor material whose material designing is easy, and is capable to secure satisfying purity, so that it can be easily used industrially. And further, also to provide an organic semiconductor structure and an organic semiconductor device using the organic semiconductor material.To achieve the object, the present invention provides an organic semiconductor material having a structural formula of the following chemical formula 1: -((A)-(B))n-  1 wherein A is a mesogen exhibiting liquid crystallinity; has a skeletal structure comprising a π-electron ring selected from a group consisting of L-unit of 6π-electron system ring, M-unit of 8π-electron system ring, N-unit of 10π-electron system ring, O-unit of 12π-electron system ring, P-unit of 14π-electron system ring, Q-unit of 16π-electron system ring, R-unit of 18π-electron system ring, S-unit of 20 π-electron system ring, T-unit of 22π-electron system ring, U-unit of 24π-electron system ring and V-unit of 26π-electron system ring (whereupon L, M, N, O, P, Q, R, S, T, U and V each represent an integer of 0 to 12, and L+M+N+O+P+Q+R+S+T+U+V is 1 to 12); B has a chain structure with high flexibility; and n is about 3 to about 3000.
    • 本发明的主要目的在于提供一种容易进行设计的有机半导体材料,能够确保纯度,从而能够容易地在工业上使用。 此外,还提供使用有机半导体材料的有机半导体结构和有机半导体器件。 为了达到上述目的,本发明提供具有以下化学式1的结构式的有机半导体材料:<?in-line-formula description =“In-line Formulas”end =“lead”→> - ((A ) - (B))n- 1 <?在线公式描述=“在线公式”end =“tail”?>其中A是显示液晶的介晶; 具有包含选自由6pi电子系环的L单元,8pi电子系环的M单元,10pi电子系环的N单元,O单元的π-电子环组成的骨架结构 12pi电子系环,14pi电子系环的P单元,16pi电子系环的Q单元,18pi电子系环的R单元,20个π电子系环的S单元,T单元 的22pi电子系统环,24pi电子系统环的U单元和26pi电子系统环的V单元(其中L,M,N,O,P,Q,R,S,T,U和V各自 表示0〜12的整数,L + M + N + O + P + Q + R + S + T + U + V为1〜12)。 B具有高度灵活性的链结构; 并且n为约3至约3000。
    • 10. 发明授权
    • Organic semiconductor material and organic semiconductor element
    • 有机半导体材料和有机半导体元件
    • US07365359B2
    • 2008-04-29
    • US10698002
    • 2003-10-30
    • Shinobu SakuradaKen TominoHiroki MaedaMasanori AkadaJun-ichi Hanna
    • Shinobu SakuradaKen TominoHiroki MaedaMasanori AkadaJun-ichi Hanna
    • H01L51/00
    • H01L51/0071H01L51/0025H01L51/0076
    • An organic semiconductor material having high charge mobility characteristics and an organic semiconductor element is provided. The organic semiconductor material has rodlike low-molecular liquid crystallinity, including a skeleton structure comprising L 6 π electron aromatic rings, M 10 π electron aromatic rings, and N 14π electron aromatic rings, wherein L, M, and N are each an integer of 0 (zero) to 4 and L+M+N=1 to 4; and a terminal structure attached to both ends of the skeleton structure. The terminal structure can develop liquid crystallinity. The phase angle θ of impedance of the organic semiconductor material is −80°≦θ≦−90° as determined in the measurement of impedance in a frequency f range of 100 Hz≦f≦1 MHz in such a state that the organic semiconductor material in an isotropic phase state is held between a pair of opposed substrates with an interelectrode spacing of 9 μm.
    • 提供具有高电荷迁移率特性的有机半导体材料和有机半导体元件。 有机半导体材料具有棒状低分子液晶性,包括包括L 6π电子芳环,M 10π电子芳环和N 14pi电子芳环的骨架结构,其中L,M和N各自为 0(零)至4,L + M + N = 1至4; 以及附接到骨架结构的两端的端子结构。 端子结构可以形成液晶。 在100Hz <= f <= 1MHz的频率f范围内的阻抗测量中确定的有机半导体材料的阻抗的相位角θ为-80°θ= -90°, 各向同性相状态的有机半导体材料保持在一对相对基板之间,电极间隔为9μm。