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    • 2. 发明授权
    • Method of manufacturing a capacitance sensor
    • 制造电容式传感器的方法
    • US5507080A
    • 1996-04-16
    • US353315
    • 1994-12-05
    • Shigenori HayashiTakeshi KamadaHideo ToriiTakashi Hirao
    • Shigenori HayashiTakeshi KamadaHideo ToriiTakashi Hirao
    • G01D5/241G01L9/00G01P15/125H01G5/16
    • G01L9/0072G01D5/2417G01P15/125Y10T29/43
    • A small and highly sensitive capacitance type pressure sensor is obtained by filling an alkali halide material such as KBr into a through-hole, forming a conductive thin film on the surface, and dissolving and removing the alkali halide material. An insulating plate disposed with a through-hole in the thickness direction is filled with a molten alkali halide material such as KBr. After forming a conductive thin film on the surface of the alkali halide material filled into the through-hole and the vicinity thereof, the alkali halide material is dissolved by water and removed. In this way, a diaphragm is made of the through-hole and the conductive thin film. A curve of the diaphragm caused by a pressure difference between the both faces of the conductive thin film is detected as a capacitance change between the conductive thin film and the electrode layer.
    • 通过将诸如KBr的碱金属卤化物材料填充到通孔中,在表面上形成导电薄膜,并溶解和除去碱金属卤化物材料,获得小而高灵敏度的电容式压力传感器。 在厚度方向上设置有通孔的绝缘板填充有诸如KBr的熔融卤化碱材料。 在填充到通孔及其附近的碱金属卤化物材料的表面上形成导电薄膜之后,碱金属卤化物材料被水溶解并除去。 以这种方式,隔膜由通孔和导电薄膜制成。 由导电薄膜的两面之间的压力差引起的隔膜的曲线被检测为导电薄膜和电极层之间的电容变化。
    • 3. 发明授权
    • Thin film sensor element and method of manufacturing the same
    • 薄膜传感器元件及其制造方法
    • US5612536A
    • 1997-03-18
    • US374989
    • 1995-01-19
    • Hideo ToriiTakeshi KamadaShigenori HayashiRyoichi TakayamaTakashi HiraoMasumi Hattori
    • Hideo ToriiTakeshi KamadaShigenori HayashiRyoichi TakayamaTakashi HiraoMasumi Hattori
    • G01P15/08G01P15/09H01L41/29G01J5/10
    • G01P15/0922G01P15/0802H01L41/0478H01L41/0815H01L41/313Y10T29/42Y10T29/4981
    • A thin film sensor element includes a sensor holding substrate having an opening part and a multilayer film adhered thereon at least consisting of an electrode film A, an electrode film B having (100) plane orientation, and a piezoelectic dielectric oxide film present between the electrode film A and the electrode film B. As a result, a thin film sensor element which is small, light, highly accurate, and inexpensive can be attained which can be used for an acceleration sensor element and a pyroelectric infrared sensor element. On the surface of a flat plate KBr substrate, a rock-salt crystal structure oxide of a conductive NiO is formed by a plasma MOCVD method whose vertical direction is crystal-oriented to direction against the substrate surface. By means of a sputtering method, a PZT film is formed by an epitaxial growth on that surface, and a Ni-Cr electrode film is formed thereon. Next, the multilayer film structure is reversed and adhered to a sensor substrate having an opening part with an adhesive. After a connection electrode is connected, the whole structure is washed with water, thereby removing the KBr substrate.
    • 薄膜传感器元件包括:具有开口部的传感器保持基板和附着在其上的多层膜,至少由电极膜A,具有(100)面取向的电极膜B和存在于电极之间的压电电介质氧化膜 膜A和电极膜B.结果,可以获得可用于加速度传感器元件和热电型红外线传感器元件的小,轻,高精度和便宜的薄膜传感器元件。 在平板KBr基板的表面上,通过等离子体MOCVD方法形成导电NiO的岩盐晶体结构氧化物,其垂直方向相对于衬底表面<100>晶体取向。 通过溅射法,在该表面上通过外延生长形成PZT膜,在其上形成Ni-Cr电极膜。 接下来,将多层膜结构反转并粘接到具有开口部的粘合剂的传感器基板。 连接电极连接后,整个结构用水清洗,从而除去KBr基板。
    • 4. 发明授权
    • Capacitance sensor
    • 电容传感器
    • US5719740A
    • 1998-02-17
    • US595240
    • 1996-02-01
    • Shigenori HayashiTakeshi KamadaHideo ToriiTakashi Hirao
    • Shigenori HayashiTakeshi KamadaHideo ToriiTakashi Hirao
    • G01D5/241G01L9/00G01P15/125H01G7/00G01L9/12
    • G01L9/0072G01D5/2417G01P15/125Y10T29/43
    • A small and highly sensitive capacitance type pressure sensor is obtained by filling an alkali halide material such as KBr into a through-hole, forming a conductive thin film on the surface, and dissolving and removing the alkali halide material. An insulating plate disposed with a through-hole in the thickness direction is filled with a molten alkali halide material such as KBr. After forming a conductive thin film on the surface of the alkali halide material filled into the through-hole and the vicinity thereof, the alkali halide material is dissolved by water and removed. In this way, a diaphragm is made of the through-hole and the conductive thin film. A curve of the diaphragm caused by a pressure difference between the both faces of the conductive thin film is detected as a capacitance change between the conductive thin film and the electrode layer.
    • 通过将诸如KBr的碱金属卤化物材料填充到通孔中,在表面上形成导电薄膜,并溶解和除去碱金属卤化物材料,获得小而高灵敏度的电容式压力传感器。 在厚度方向上设置有通孔的绝缘板填充有诸如KBr的熔融卤化碱材料。 在填充到通孔及其附近的碱金属卤化物材料的表面上形成导电薄膜之后,碱金属卤化物材料被水溶解并除去。 以这种方式,隔膜由通孔和导电薄膜制成。 由导电薄膜的两面之间的压力差引起的隔膜的曲线被检测为导电薄膜和电极层之间的电容变化。
    • 7. 发明授权
    • Method and apparatus of forming thin films
    • 形成薄膜的方法和装置
    • US5755888A
    • 1998-05-26
    • US518267
    • 1995-08-23
    • Hideo ToriiEiji FujiiShigenori HayashiRyoichi Takayama
    • Hideo ToriiEiji FujiiShigenori HayashiRyoichi Takayama
    • C23C14/00C23C14/56C23C16/44C23C16/54C30B25/14H01L21/203H01L21/205H01L21/285C23C16/00
    • C23C14/568C23C16/4412C23C16/54C30B25/14
    • An apparatus of forming thin films, which is small and requires a short thin-film formation time, is provided which comprises at least one physical vapor deposition device and at least one chemical vapor deposition device, wherein said physical vapor deposition device and said chemical vapor deposition device are provided with an exhaust pipe respectively for connection with a common exhaust means and an exhaust switching means. A method of forming thin films using this apparatus is also provided. According to the configuration in which the exhaust switching means is connected via exhaust pipes to the physical vapor deposition device, to the chemical vapor deposition device, and to the exhaust means, this apparatus can be accomplished in a small size which has at least two chambers and one exhaust means. In this way, thin films can be formed in a short thin-film formation time with a small apparatus, since vapor of a starting material which is led in at the time of chemical vapor deposition does not enter the physical vapor deposition device.
    • 提供一种形成薄膜并需要短的薄膜形成时间的装置,其包括至少一个物理气相沉积装置和至少一个化学气相沉积装置,其中所述物理气相沉积装置和所述化学气相 沉积装置设置有分别用于与公共排气装置和排气开关装置连接的排气管。 还提供了使用该装置形成薄膜的方法。 根据其中排气切换装置经由排气管连接到物理气相沉积装置,化学气相沉积装置和排气装置的结构,该装置可以实现为具有至少两个室的小尺寸 和一个排气装置。 这样,由于在化学气相沉积时引入的原料的蒸气不会进入物理气相沉积装置,因此可以用小的装置在短的薄膜形成时间内形成薄膜。