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    • 4. 发明授权
    • Thin film sensor element and method of manufacturing the same
    • 薄膜传感器元件及其制造方法
    • US5612536A
    • 1997-03-18
    • US374989
    • 1995-01-19
    • Hideo ToriiTakeshi KamadaShigenori HayashiRyoichi TakayamaTakashi HiraoMasumi Hattori
    • Hideo ToriiTakeshi KamadaShigenori HayashiRyoichi TakayamaTakashi HiraoMasumi Hattori
    • G01P15/08G01P15/09H01L41/29G01J5/10
    • G01P15/0922G01P15/0802H01L41/0478H01L41/0815H01L41/313Y10T29/42Y10T29/4981
    • A thin film sensor element includes a sensor holding substrate having an opening part and a multilayer film adhered thereon at least consisting of an electrode film A, an electrode film B having (100) plane orientation, and a piezoelectic dielectric oxide film present between the electrode film A and the electrode film B. As a result, a thin film sensor element which is small, light, highly accurate, and inexpensive can be attained which can be used for an acceleration sensor element and a pyroelectric infrared sensor element. On the surface of a flat plate KBr substrate, a rock-salt crystal structure oxide of a conductive NiO is formed by a plasma MOCVD method whose vertical direction is crystal-oriented to direction against the substrate surface. By means of a sputtering method, a PZT film is formed by an epitaxial growth on that surface, and a Ni-Cr electrode film is formed thereon. Next, the multilayer film structure is reversed and adhered to a sensor substrate having an opening part with an adhesive. After a connection electrode is connected, the whole structure is washed with water, thereby removing the KBr substrate.
    • 薄膜传感器元件包括:具有开口部的传感器保持基板和附着在其上的多层膜,至少由电极膜A,具有(100)面取向的电极膜B和存在于电极之间的压电电介质氧化膜 膜A和电极膜B.结果,可以获得可用于加速度传感器元件和热电型红外线传感器元件的小,轻,高精度和便宜的薄膜传感器元件。 在平板KBr基板的表面上,通过等离子体MOCVD方法形成导电NiO的岩盐晶体结构氧化物,其垂直方向相对于衬底表面<100>晶体取向。 通过溅射法,在该表面上通过外延生长形成PZT膜,在其上形成Ni-Cr电极膜。 接下来,将多层膜结构反转并粘接到具有开口部的粘合剂的传感器基板。 连接电极连接后,整个结构用水清洗,从而除去KBr基板。
    • 6. 发明授权
    • Low vapor-pressure material feeding apparatus
    • 低气压材料送料装置
    • US5431733A
    • 1995-07-11
    • US83300
    • 1993-06-29
    • Munehiro ShibuyaMasatoshi KitagawaTakeshi KamadaTakashi Hirao
    • Munehiro ShibuyaMasatoshi KitagawaTakeshi KamadaTakashi Hirao
    • C23C16/44C23C16/448C23C16/455C23C16/52C23C16/00
    • C23C16/4482
    • A low vapor-pressure material feeding apparatus comprises a bubbler (4, 5), accommodating a low vapor-pressure material (6) therein, for bubbling the low vapor-pressure material (6) with an inert gas fed from an inert gas container (3). A bifurcated gas feeding passage (51, 8) is provided between the gas container (3) and a vacuum chamber (50). One branch passage directly introduces an inert gas into the vacuum chamber (50), and the other branch passage introduces an inert gas into the bubbler (4, 5). A gas mixture of a vaporized low vapor-pressure material (6) and the inert gas, is supplied from the bubbler (4, 5) to a vacuum chamber (50). A gas flow meter (7) detects a flow amount of the gas mixture. On a basis of a gas flow amount detected by the gas flow meter (7), an inert gas controller (10) adjusts a feeding amount of inert gas so that a total amount of an inert gas introduced directly into said vacuum chamber (50) and an inert gas introduced into the bubbler (4, 5) is kept at a constant value.
    • 低蒸气压材料输送装置包括一个容纳低蒸气压材料(6)的起泡器(4,5),用于使惰性气体从惰性气体容器 (3)。 在气体容器(3)和真空室(50)之间设置有分支气体供给通路(51,8)。 一个分支通道直接将惰性气体引入真空室(50),另一个分支通道将惰性气体引入起泡器(4,5)中。 蒸发的低蒸气压材料(6)和惰性气体的气体混合物从起泡器(4,5)供应到真空室(50)。 气体流量计(7)检测气体混合物的流量。 基于由气体流量计(7)检测到的气体流量,惰性气体控制器(10)调节惰性气体的供给量,使得直接引入所述真空室(50)的惰性气体的总量, 引入起泡器(4,5)中的惰性气体保持恒定值。
    • 8. 发明授权
    • Method of manufacturing a capacitance sensor
    • 制造电容式传感器的方法
    • US5507080A
    • 1996-04-16
    • US353315
    • 1994-12-05
    • Shigenori HayashiTakeshi KamadaHideo ToriiTakashi Hirao
    • Shigenori HayashiTakeshi KamadaHideo ToriiTakashi Hirao
    • G01D5/241G01L9/00G01P15/125H01G5/16
    • G01L9/0072G01D5/2417G01P15/125Y10T29/43
    • A small and highly sensitive capacitance type pressure sensor is obtained by filling an alkali halide material such as KBr into a through-hole, forming a conductive thin film on the surface, and dissolving and removing the alkali halide material. An insulating plate disposed with a through-hole in the thickness direction is filled with a molten alkali halide material such as KBr. After forming a conductive thin film on the surface of the alkali halide material filled into the through-hole and the vicinity thereof, the alkali halide material is dissolved by water and removed. In this way, a diaphragm is made of the through-hole and the conductive thin film. A curve of the diaphragm caused by a pressure difference between the both faces of the conductive thin film is detected as a capacitance change between the conductive thin film and the electrode layer.
    • 通过将诸如KBr的碱金属卤化物材料填充到通孔中,在表面上形成导电薄膜,并溶解和除去碱金属卤化物材料,获得小而高灵敏度的电容式压力传感器。 在厚度方向上设置有通孔的绝缘板填充有诸如KBr的熔融卤化碱材料。 在填充到通孔及其附近的碱金属卤化物材料的表面上形成导电薄膜之后,碱金属卤化物材料被水溶解并除去。 以这种方式,隔膜由通孔和导电薄膜制成。 由导电薄膜的两面之间的压力差引起的隔膜的曲线被检测为导电薄膜和电极层之间的电容变化。
    • 9. 发明授权
    • Capacitance sensor
    • 电容传感器
    • US5719740A
    • 1998-02-17
    • US595240
    • 1996-02-01
    • Shigenori HayashiTakeshi KamadaHideo ToriiTakashi Hirao
    • Shigenori HayashiTakeshi KamadaHideo ToriiTakashi Hirao
    • G01D5/241G01L9/00G01P15/125H01G7/00G01L9/12
    • G01L9/0072G01D5/2417G01P15/125Y10T29/43
    • A small and highly sensitive capacitance type pressure sensor is obtained by filling an alkali halide material such as KBr into a through-hole, forming a conductive thin film on the surface, and dissolving and removing the alkali halide material. An insulating plate disposed with a through-hole in the thickness direction is filled with a molten alkali halide material such as KBr. After forming a conductive thin film on the surface of the alkali halide material filled into the through-hole and the vicinity thereof, the alkali halide material is dissolved by water and removed. In this way, a diaphragm is made of the through-hole and the conductive thin film. A curve of the diaphragm caused by a pressure difference between the both faces of the conductive thin film is detected as a capacitance change between the conductive thin film and the electrode layer.
    • 通过将诸如KBr的碱金属卤化物材料填充到通孔中,在表面上形成导电薄膜,并溶解和除去碱金属卤化物材料,获得小而高灵敏度的电容式压力传感器。 在厚度方向上设置有通孔的绝缘板填充有诸如KBr的熔融卤化碱材料。 在填充到通孔及其附近的碱金属卤化物材料的表面上形成导电薄膜之后,碱金属卤化物材料被水溶解并除去。 以这种方式,隔膜由通孔和导电薄膜制成。 由导电薄膜的两面之间的压力差引起的隔膜的曲线被检测为导电薄膜和电极层之间的电容变化。
    • 10. 发明授权
    • Method for producing an amorphous silicon semiconductor device using a
multichamber PECVD apparatus
    • 使用多室PECVD装置制造非晶硅半导体器件的方法
    • US4800174A
    • 1989-01-24
    • US50699
    • 1987-05-18
    • Shinichiro IshiharaMasatoshi KitagawaTakashi Hirao
    • Shinichiro IshiharaMasatoshi KitagawaTakashi Hirao
    • H01L21/205C23C16/24C23C16/54H01L31/04
    • C23C16/54C23C16/24Y10S148/025Y10S148/045Y10S148/072Y10S438/908
    • A method of producing an amorphous silicon semiconductor device makes use of a capacitance-coupled high-frequency glow-discharge semiconductor production apparatus which is equipped with a plurality of glow-discharge chambers each having a high-frequency electrode and a substrate holder opposing each other and means for supplying material gases to the glow-discharge chambers. A reaction of a material gas is effected in a first glow-discharge chamber, so as to form a semiconductor layer having a first conductivity type on a substrate introduced into the first glow-discharge chamber, and, after moving the substrate into a second glow-discharge chamber, a reaction of a material gas different from the material gas used in the first glow-discharge chamber is effected, thereby forming a semiconductor layer having a second conductivity type on the semiconductor layer of the first conductivity type. The substrate with the semiconductor layer of the first conductivity formed thereon is moved from the first glow-discharge chamber to the second glow-discharge chamber after a predetermined gas atmosphere is formed in the first glow-discharge chamber. The distance between the electrode and the substrate holder is made smaller in one of the first and second glow-discharge chambers which is designed for forming the thicker one of the semiconductor layers of the first and second conductivity types than in the other of the first and second glow-discharge chambers. The temperature of the substrate is set higher in one of the first and second glow-discharge chambers which is designed for forming the thicker one of the semiconductor layers of the first and second conductivity types than in the other of the first and second glow-discharge chambers.
    • 一种非晶硅半导体器件的制造方法采用电容耦合高频辉光放电半导体制造装置,该装置配备有多个辉光放电室,每个辉光放电室具有彼此相对的高频电极和衬底保持器 以及用于将材料气体供应到辉光放电室的装置。 在第一辉光放电室中进行材料气体的反应,以便在引入第一辉光放电室的衬底上形成具有第一导电类型的半导体层,并且在将衬底移动到第二发光 进行与第一辉光放电室中使用的材料气体不同的原料气体的反应,由此在第一导电型半导体层上形成具有第二导电类型的半导体层。 在第一辉光放电室中形成规定的气体气氛之后,将形成有第一导电性的半导体层的基板从第一辉光放电室向第二辉光放电室移动。 在第一和第二辉光放电室之一中,电极和衬底保持器之间的距离较小,被设计用于形成第一和第二导电类型的较厚的一个半导体层,而不是第一和第二导电类型中的另一个, 第二个辉光放电室。 第一和第二辉光放电室之一的衬底的温度被设定为高于在第一和第二辉光放电中的另一个中形成第一和第二导电类型的较厚的一个半导体层的第一和第二辉光放电室 房间。