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1. 发明申请

US20050062148A1 Semiconductor package 有权
公开(公告)号：US20050062148A1
公开(公告)日：2005-03-24
申请号：US10944241
申请日：2004-09-17
申请人： Seong Seo , Young Chung , Jong Paek , Jae Ku , Jae Yee
发明人： Seong Seo , Young Chung , Jong Paek , Jae Ku , Jae Yee
IPC分类号： H01L23/48 , H01L21/60 , H01L23/495 , H01L23/34
CPC分类号： H01L24/83 , H01L23/4951 , H01L23/49548 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/16245 , H01L2224/29101 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73203 , H01L2224/73265 , H01L2224/8319 , H01L2224/838 , H01L2224/85399 , H01L2924/00014 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor package is disclosed that bonds a semiconductor chip to a leadframe using a flip chip technology. An exemplary semiconductor package includes a semiconductor chip having a plurality of input-output pads at an active surface thereof. A plurality of leads are superimposed by the bond pads and active surface of the semiconductor chip. The leads have at least one exposed surface at a bottom surface of the package body. A plurality of conductive connecting means electrically connect the input-output pads of the chip to the leads. A package body is formed over the semiconductor chip and the conductive connecting means. The bottom surface portions of the leads are exposed to the outside.

2. 发明申请

US20060261458A1 Semiconductor package and manufacturing method thereof 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20060261458A1
公开(公告)日：2006-11-23
申请号：US10712839
申请日：2003-11-12
申请人： Jong Paek , Jin Kim , Seong Seo
发明人： Jong Paek , Jin Kim , Seong Seo
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L25/167 , H01L27/14634 , H01L31/0203 , H01L2224/73253
摘要： A semiconductor package and manufacturing method thereof are disclosed. The semiconductor package includes a substrate having an image sensor die, window, a glass, and solder balls. Not only the substrate having the window is attached to the upper side of the image sensor die, but also one side of the substrate extends and is bent so that the one side of the substrate is attached to the lower side of the image sensor die, thereby reducing the thickness and width of the semiconductor package. In another embodiment, at least one memory die can be stacked in an image sensor die or a substrate, so that the functions of the semiconductor package is growing multifarious and the package efficiency is increased.
摘要翻译：公开了半导体封装及其制造方法。半导体封装包括具有图像传感器芯片，窗口，玻璃和焊球的基板。不仅具有窗口的基板被附着到图像传感器芯片的上侧，而且基板的一侧延伸并弯曲，使得基板的一侧附接到图像传感器管芯的下侧，从而减小半导体封装的厚度和宽度。在另一个实施例中，至少一个存储器管芯可以堆叠在图像传感器管芯或衬底中，使得半导体封装的功能日益增加，封装效率提高。

3. 发明申请

US20050159186A1 Combined base transceiver station and base station controller 有权
标题翻译：组合式收发台和基站控制器
公开(公告)号：US20050159186A1
公开(公告)日：2005-07-21
申请号：US11037063
申请日：2005-01-18
申请人： Wonjun Cho , Jeom Kim , Myoung Choi , Hyunyung Cha , Jefferson Kim , Hyeon Park , Jae Park , Seong Seo , Jae Yoo , Jake Han
发明人： Wonjun Cho , Jeom Kim , Myoung Choi , Hyunyung Cha , Jefferson Kim , Hyeon Park , Jae Park , Seong Seo , Jae Yoo , Jake Han
IPC分类号： H04B7/00 , H04L9/00 , H04L12/56 , H04W88/08 , H04W88/12
CPC分类号： H04W72/04 , H04W36/00 , H04W60/04 , H04W72/08 , H04W76/10 , H04W76/30 , H04W88/08 , H04W88/12
摘要： A combined base station controller (12) and base transceiver station (14) comprises a selector distribution unit (SDU, 20), a main call control (MCC, 22) coupled to the SDU, a radio call control (RCC, 18) coupled to the MCC, and a channel element control (CEC, 16) coupled to the RCC.
摘要翻译：组合基站控制器（12）和基站收发台（14）包括选择器分配单元（SDU，20），耦合到SDU的主呼叫控制（MCC，22），耦合到无线电呼叫控制（RCC，18）到MCC，以及耦合到RCC的信道元素控制（CEC，16）。

4. 发明申请

US20050015243A1 Apparatus and method for converting pitch delay using linear prediction in speech transcoding 审中-公开
标题翻译：用于在语音转码中使用线性预测转换音调延迟的装置和方法
公开(公告)号：US20050015243A1
公开(公告)日：2005-01-20
申请号：US10749779
申请日：2003-12-30
申请人： Eung Lee , Hyun Kim , Do Kim , Chang Yoo , Seong Seo , Dal Jang
发明人： Eung Lee , Hyun Kim , Do Kim , Chang Yoo , Seong Seo , Dal Jang
IPC分类号： G10L19/04 , G10L19/08 , G10L19/14
CPC分类号： G10L19/09 , G10L19/18 , G10L25/12
摘要： Provided are an apparatus and method for converting a pitch delay using linear prediction in speech transcoding. A linear interpolating portion linearly interpolates a closed-loop pitch delay decoded by a selected mode vocoder (SMV) speech decoder to make the closed-loop pitch delay fit in a search section for open-loop pitch delays of G.723.1 speech encoder, to obtain a changed closed-loop pitch delay of the SMV decoder. A predicted value calculating portion calculates a predicted pitch delay using linear prediction, based on past closed-loop pitch delays of the G.723.1 speech encoder. A difference calculating portion calculates a difference between the changed closed-loop pitch delay of the SMV speech decoder and the calculated predicted pitch delay. When the calculated difference is less than the predetermined threshold value, a pitch delay determining portion determines the changed closed-loop pitch delay of the SMV speech decoder to be an open-loop pitch delay of the G.723.1 speech encoder. A pitch delay detecting portion detects a closed-loop pitch delay of the G.723.1 speech encoder using a conventional method, based on the determined open-loop pitch delay of the G.723.1 speech encoder.
摘要翻译：提供了一种用于在语音代码转换中使用线性预测来转换音调延迟的装置和方法。线性内插部分线性内插由选择的模式声码器（SMV）语音解码器解码的闭环音调延迟，以使闭环音调延迟适合于用于G.723.1语音编码器的开环音调延迟的搜索部分，获得SMV解码器的改变的闭环音调延迟。基于G.723.1语音编码器的过去闭环音调延迟，预测值计算部分使用线性预测来计算预测音调延迟。差分计算部分计算SMV语音解码器的改变的闭环音调延迟与所计算的预测音调延迟之间的差。当计算出的差小于预定阈值时，音调延迟确定部分将SMV语音解码器的改变的闭环音调延迟确定为G.723.1语音编码器的开环音调延迟。基于所确定的G.723.1语音编码器的开环音调延迟，音调延迟检测部分使用常规方法检测G.723.1语音编码器的闭环音调延迟。

5. 发明申请

US20070018322A1 Wafer level package and its manufacturing method 审中-公开
标题翻译：晶圆级封装及其制造方法
公开(公告)号：US20070018322A1
公开(公告)日：2007-01-25
申请号：US10876196
申请日：2004-06-23
申请人： In Park , Won Do , Seong Seo
发明人： In Park , Won Do , Seong Seo
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , H01L23/3192 , H01L24/02 , H01L24/11 , H01L24/94 , H01L2224/0401 , H01L2224/10126 , H01L2224/11334 , H01L2224/13022 , H01L2224/13099 , H01L2224/16 , H01L2224/274 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/05042 , H01L2924/19041 , H01L2924/19043
摘要： A semiconductor package includes a semiconductor die having a plurality of bond pads, a first protective layer formed at the periphery of the bond pads of the semiconductor die, UBM (Under Bump Metals) formed at the bond pads of the semiconductor die, a plurality of solder balls wetted to the UBM, and a second protective layer formed at the periphery of the solder balls. The second protective layer includes a thick collar, which is formed from the surface of the solder ball toward its periphery, so that the joint force of the solder ball can be more improved. Further, the second protective layer protects the surface of the wafer from the external environment, and absorbs and alleviates the external stress.
摘要翻译：半导体封装包括具有多个接合焊盘的半导体管芯，形成在半导体管芯的接合焊盘的外围的第一保护层，形成在半导体管芯的接合焊盘处的UBM（下凸块金属），多个润湿UBM的焊球，以及形成在焊锡球周边的第二保护层。第二保护层包括由焊球的表面朝向其周边形成的厚领，从而能够更好地改善焊球的接合力。此外，第二保护层保护晶片的表面免受外部环境的影响，并且吸收和减轻外部应力。

6. 发明申请

US20050094508A1 Method and apparatus for adjusting tracking error balance in an optical disk reproducing apparatus 失效
标题翻译：用于调整光盘再现装置中的跟踪误差平衡的方法和装置
公开(公告)号：US20050094508A1
公开(公告)日：2005-05-05
申请号：US10958425
申请日：2004-10-06
申请人： Seong Seo
发明人： Seong Seo
IPC分类号： G11B7/00 , G11B7/095
CPC分类号： G11B7/0956
摘要： A method and apparatus for adjusting tracking error balance in an optical disk reproducing apparatus are provided. The method includes pre-setting a tracking error balance for an optical recording medium and adjusting the tracking error balance during reproduction of data from the optical recording medium.
摘要翻译：提供了一种用于调整光盘再现装置中的跟踪误差平衡的方法和装置。该方法包括预先设置光学记录介质的跟踪误差平衡，并且在从光学记录介质再现数据期间调整跟踪误差平衡。

7. 发明申请

US20060204438A1 Water soluble iron oxide nanoparticles and a method of its preparation 审中-公开
标题翻译：水溶性氧化铁纳米粒子及其制备方法
公开(公告)号：US20060204438A1
公开(公告)日：2006-09-14
申请号：US11178766
申请日：2005-07-11
申请人： Sun Cho , Hae Lee , Gil Khang , Moon Kim , Ha Lee , Nak Lim , Jin Seo , Seong Seo
发明人： Sun Cho , Hae Lee , Gil Khang , Moon Kim , Ha Lee , Nak Lim , Jin Seo , Seong Seo
IPC分类号： A61K49/00
CPC分类号： B82Y5/00 , A61K49/1854
摘要： This invention relates to water soluble iron oxide nanoparticles and a method of its preparation. More specifically, this invention relates to a method of manufacturing water soluble iron oxide nanoparticles uniform in size by coating polyvinylpyrolidone, a biocompatible polymer that can be intravenously administered via thermal decomposition, on the surface of iron oxide thereby enabling to control the size of resulting particles, and water soluble iron oxide nanoparticles coated with polyvinylpyrolidone. The above-mentioned water soluble iron oxide nanoparticles have excellent image contrasting effect and are thus useful as MRI contrast agent.
摘要翻译：本发明涉及水溶性氧化铁纳米粒子及其制备方法。更具体地说，本发明涉及通过在氧化铁表面上涂覆聚乙烯吡咯烷酮（一种可通过热分解进行静脉内给药的生物相容性聚合物）制造尺寸均匀的水溶性氧化铁纳米粒子的方法，从而能够控制所得颗粒的尺寸和用聚乙烯吡咯烷酮涂覆的水溶性氧化铁纳米颗粒。上述水溶性氧化铁纳米颗粒具有优异的图像对比效果，因此可用作MRI造影剂。

8. 发明申请

US20060114391A1 Multi-domain liquid crystal display device 有权
公开(公告)号：US20060114391A1
公开(公告)日：2006-06-01
申请号：US11334693
申请日：2006-01-19
申请人： Seong Seo , Hyun Shin , Kyeong Kim , Yun Lee , Jeom Kim
发明人： Seong Seo , Hyun Shin , Kyeong Kim , Yun Lee , Jeom Kim
IPC分类号： G02F1/1337
CPC分类号： G02F1/133707 , G02F1/133512 , G02F1/136213 , G02F1/136286 , G02F2001/133519 , G02F2001/133562 , G02F2001/136218
摘要： A multi-domain liquid crystal display device includes first and second substrates facing each other and a liquid crystal layer between the first and second substrates. A plurality of gate bus lines are arranged in a first direction on the first substrate and a plurality of data bus lines are arranged in a second direction on the first substrate to define a pixel region. A pixel electrode is electrically charged through the data bus line in the pixel region. A common-auxiliary electrode surrounds the pixel electrode on a same layer whereon the gate bus line is formed.

9. 发明申请

US20050007529A1 Multi-domain liquid crystal display 失效
标题翻译：多域液晶显示
公开(公告)号：US20050007529A1
公开(公告)日：2005-01-13
申请号：US10805482
申请日：2004-03-22
申请人： Kyeong Kim , Do Kwon , Seong Seo
发明人： Kyeong Kim , Do Kwon , Seong Seo
IPC分类号： G02F1/1343 , G02F1/1337 , G02F1/1362
CPC分类号： G02F1/133753 , G02F1/133788 , G02F1/1362 , G02F1/136286
摘要： Multi-domain liquid crystal display: including a first substrates and a second substrate, a liquid crystal layer between the first and second substrates, a plurality of gatelines and datalines on the first substrate crossed each other at fixed intervals, a pixel electrode in each of pixel regions formed between the gatelines and the datalines, a supplementary electrode around each of the pixel electrodes in the same layer with the pixel electrodes, at least one field induction window in each of the pixel regions, and an optical orientation film formed at least one of the first and second substrates.
摘要翻译：多域液晶显示器：包括第一基板和第二基板，第一和第二基板之间的液晶层，第一基板上的多个栅格和数据线以固定的间隔彼此交叉，每个中的像素电极形成在基准线和数据线之间的像素区域，与像素电极在同一层中的每个像素电极周围的辅助电极，每个像素区域中的至少一个场感应窗口，以及形成至少一个的第一和第二基底。

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