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1. 发明申请

US20060267036A1 High power light emitting diode package and fabrication method thereof 失效
标题翻译：大功率发光二极管封装及其制造方法
公开(公告)号：US20060267036A1
公开(公告)日：2006-11-30
申请号：US11442414
申请日：2006-05-30
申请人： Seon Lee , Hun Hahm , Dae Kim , Young Song , Young Park , Chang Song
发明人： Seon Lee , Hun Hahm , Dae Kim , Young Song , Young Park , Chang Song
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48247 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.
摘要翻译：本发明涉及一种大功率LED封装及其制造方法。 LED封装包括响应于施加的功率而产生光的发光部，安装有发光部的导热部件，用于电连接发光部和板的引线部，以及用于一体地固定的模具部导热部件和引线部分。导热构件由高度方向上的至少两个金属层构成，引线部包括从导热构件延伸的至少一个第一引线和与导热构件分离的至少一个第二引线。本发明允许将两个组件集成到一个组件中，减少组件的数量并简化组装过程，从而降低制造成本。

2. 发明申请

US20060273338A1 High power LED package and fabrication method thereof 有权
公开(公告)号：US20060273338A1
公开(公告)日：2006-12-07
申请号：US11445227
申请日：2006-06-02
申请人： Seon Lee , Hun Hahm , Jung Park , Kyung Han , Seong Han , Dae Kim , Young Park
发明人： Seon Lee , Hun Hahm , Jung Park , Kyung Han , Seong Han , Dae Kim , Young Park
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

3. 发明申请

US20060284203A1 Side-emitting LED package and manufacturing method of the same 有权
标题翻译：侧面发光LED封装及其制造方法相同
公开(公告)号：US20060284203A1
公开(公告)日：2006-12-21
申请号：US11444397
申请日：2006-06-01
申请人： Kyung Han , Hun Hahm , Dae Kim , Ho Ahn , Seong Han , Young Park , Seon Lee
发明人： Kyung Han , Hun Hahm , Dae Kim , Ho Ahn , Seong Han , Young Park , Seon Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L24/97 , H01L25/0753 , H01L33/0095 , H01L33/486 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15787 , H01L2924/181 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。本发明提供一种用于从侧向发光的侧光发射LED封装件，其包括形成有电极的基板。封装还包括设置在基板上的光源，覆盖并保护其上具有光源的基板的模制部件和覆盖模制部件的外表面的反射层。具有反射层的模制部件在其一侧形成透光表面。本发明允许容易地制造所需形状的反射表面，而不管LED芯片尺寸如何，小型化，LED阵列中的批量生产，显着提高生产率。

4. 发明申请

US20070176198A1 Chip on board package and manufacturing method thereof 有权
标题翻译：船上芯片封装及其制造方法
公开(公告)号：US20070176198A1
公开(公告)日：2007-08-02
申请号：US11709154
申请日：2007-02-22
申请人： Seon Lee , Hun Hahm , Dae Kim
发明人： Seon Lee , Hun Hahm , Dae Kim
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , F21K9/00 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H05K1/021 , H05K3/244 , H05K2201/09827 , H05K2201/09981 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.
摘要翻译：通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。这又提高了光源的发光效率，最终实现了高质量的光源。

5. 发明申请

US20050054076A1 Method for producing L-threonine 有权
标题翻译：生产L-苏氨酸的方法
公开(公告)号：US20050054076A1
公开(公告)日：2005-03-10
申请号：US10916804
申请日：2004-08-12
申请人： Jae Cho , Byoung Lee , Dae Kim , Jin Lee , Young Park
发明人： Jae Cho , Byoung Lee , Dae Kim , Jin Lee , Young Park
IPC分类号： C12N15/09 , C12N1/21 , C12P13/08 , C12N1/20
CPC分类号： C12P13/08
摘要： An L-threonine-producing Escherichia coli strain and a method for producing the same are provided. The Escherchia coli strain contains chromosomal DNA with inactivated metJ gene. Therefore, expression repression of threonine biosynthesis genes by a metJ gene product is prevented, thereby producing a high concentration of threonine. Further, a high concentration of L-threonine can be produced in high yield using the method.
摘要翻译：提供了产生L-苏氨酸的大肠杆菌菌株及其制备方法。大肠埃希氏菌菌株含有具有灭活的metJ基因的染色体DNA。因此，通过metJ基因产物抑制苏氨酸生物合成基因的表达抑制，从而产生高浓度的苏氨酸。此外，可以使用该方法以高产率制备高浓度的L-苏氨酸。

6. 发明申请

US20050176114A1 Microorganism producing L-threonine having inactivated galR gene, method of producing the same and method of producing L-threonine using the microorganism 有权
标题翻译：生产具有失活的galR基因的L-苏氨酸的微生物，其生产方法和使用该微生物产生L-苏氨酸的方法
公开(公告)号：US20050176114A1
公开(公告)日：2005-08-11
申请号：US11049845
申请日：2005-02-04
申请人： Young Park , Byoung Lee , Kwang Cho , Dae Kim , Yong Shin , Jin Lee
发明人： Young Park , Byoung Lee , Kwang Cho , Dae Kim , Yong Shin , Jin Lee
IPC分类号： C12N1/20 , C07K14/245 , C12P13/08 , C12P13/04 , C12N1/21 , C12N15/74
CPC分类号： C12P13/08 , C07K14/245
摘要： Provided are a microorganism capable of producing L-threonine and having an inactivated galR gene, a method of producing the same and a method of producing L-threonine using the microorganism. The microorganism can be used to produce L-threonine in high yield.
摘要翻译：提供能够产生L-苏氨酸并具有失活的galR基因的微生物，其生产方法和使用该微生物生产L-苏氨酸的方法。该微生物可用于以高产率生产L-苏氨酸。

7. 发明申请

US20060151716A1 Micro-column electron beam apparatus 失效
标题翻译：微柱电子束装置
公开(公告)号：US20060151716A1
公开(公告)日：2006-07-13
申请号：US11257244
申请日：2005-10-24
申请人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
发明人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
IPC分类号： G21G5/00
CPC分类号： H01J37/067 , B82Y10/00 , B82Y40/00 , H01J37/3177 , H01J2237/1205 , H01J2237/1502 , H01J2237/2818
摘要： Provided is a micro-column electron beam apparatus including: a base; an electron lens bracket on which an electron lens modulate can be fixed, mounted in a central portion of the base; an electron beam source tip module vertically disposed on the electron lens module; a pan spring plate stage module that is mounted over the base, supports the electron beam source tip module at a central portion thereof, and includes a three-coupling pan spring plate portion including first through third spring units that are coupled to the electron beam source tip module in three directions on a plane perpendicular to the vertical axis, which vertically passes the center of the electron beam source tip module, to elastically support the electron beam source tip module in three directions; a first piezoelectric actuator coupled to the pan spring plate stage module to move the electron beam source tip module along a first axis perpendicular to the vertical axis; and a second piezoelectric actuator coupled to the pan spring plate stage module to move the electron beam source tip module along a second axis perpendicular to the vertical axis and the first axis.
摘要翻译：本发明提供一种微柱电子束装置，包括：基底; 可以固定电子透镜调制的电子透镜支架，安装在基座的中心部分; 垂直设置在电子透镜模块上的电子束源头模块; 安装在基座上方的平板弹簧板台模块在其中心部分处支撑电子束源头模块，并且包括三联盘盘弹簧板部分，其包括耦合到电子束源的第一至第三弹簧单元尖端模块在垂直于垂直轴线的平面上垂直通过电子束源头模块的中心，在三个方向弹性支撑电子束源头模块; 第一压电致动器，其联接到所述盘簧板模块以沿着垂直于所述垂直轴线的第一轴线移动所述电子束源尖端模块; 以及耦合到盘簧级模块的第二压电致动器，用于沿垂直于垂直轴线和第一轴线的第二轴线移动电子束源尖端模块。

8. 发明申请

US20060131752A1 Micro column electron beam apparatus formed in low temperature co-fired ceramic substrate 失效
标题翻译：微柱电子束装置形成于低温共烧陶瓷基片中
公开(公告)号：US20060131752A1
公开(公告)日：2006-06-22
申请号：US11260025
申请日：2005-10-24
申请人： Dae Kim , Jin Jeong , Sang Choi , Dae Kim , Ho Kim
发明人： Dae Kim , Jin Jeong , Sang Choi , Dae Kim , Ho Kim
IPC分类号： H01L23/52
CPC分类号： H01J37/3177 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J2237/03 , H01J2237/1205
摘要： A micro column electron beam apparatus having a reduced number of interconnections is provided. The micro column electron beam apparatus includes: a low temperature co-fired ceramic (LTCC) substrate; a plurality of deflector electrodes attached to a predetermined top portion of the LTCC substrate; a pad electrode placed at a top edge of the LTCC substrate and transmitting an external signal to the deflector electrodes; and a connection unit placed in the LTCC substrate and electrically connecting the deflector electrode and the pad electrode.
摘要翻译：提供了具有减少数量的互连的微型列电子束装置。微柱电子束装置包括：低温共烧陶瓷（LTCC）基板; 多个偏转器电极，附着到LTCC衬底的预定顶部; 放置在LTCC衬底的顶部边缘处并将外部信号传输到偏转器电极的焊盘电极; 以及连接单元，其放置在LTCC基板中并电连接偏转器电极和焊盘电极。

9. 发明申请

US20060131996A1 Micro stage using piezoelectric element 有权
标题翻译：微电极采用压电元件
公开(公告)号：US20060131996A1
公开(公告)日：2006-06-22
申请号：US11231471
申请日：2005-09-20
申请人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
发明人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
IPC分类号： H02N2/00
CPC分类号： H02N2/028 , H01J2237/20264
摘要： Provided is a micro stage comprising: a body having a vertically perforated through-hole passing through a central portion thereof; a bobbin including a tip portion with an electron emission tip embedded in the center thereof, and passing through the through-hole of the body to be moved in the through-hole along a first axis perpendicular to a vertical direction; a first piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in one direction along the first axis; a second piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in the other direction along the first axis; and an upper cover that is coupled to an upper portion of the body and has a through-hole, through which the bobbin passes and communicates with the through-hole of the body, wherein the bobbin can be positioned as desired along the first axis by adjusting the voltages applied to the first piezoelectric element and the second piezoelectric element. Accordingly, the emission tip can be exactly and stably positioned using only the movable piezoelectric elements.
摘要翻译：提供了一种微型台，包括：主体，其具有穿过其中心部分的垂直穿孔的通孔; 线轴，其包括具有嵌入其中心的电子发射尖端的尖端部分，并沿着垂直于垂直方向的第一轴线穿过所述通孔的待通孔; 第一压电元件，其设置在所述主体上，并且当施加电压时被延长以沿着所述第一轴线沿一个方向推动所述线轴; 第二压电元件，其设置在所述主体上并且当施加电压时被延长以沿着所述第一轴线沿另一方向推动所述线轴; 以及上盖，其联接到所述主体的上部并且具有通孔，所述筒管通过所述通孔，所述通孔与所述主体的所述通孔连通，其中所述线轴可根据需要沿着所述第一轴由调整施加到第一压电元件和第二压电元件的电压。因此，可以仅使用可动压电元件来精确且稳定地定位发射尖端。

10. 发明申请

US20060131698A1 Wafer-scale microcolumn array using low temperature co-fired ceramic substrate 失效
公开(公告)号：US20060131698A1
公开(公告)日：2006-06-22
申请号：US11259959
申请日：2005-10-24
申请人： Jin Jeong , Dae Kim , Sang Choi , Dae Kim , Ho Kim
发明人： Jin Jeong , Dae Kim , Sang Choi , Dae Kim , Ho Kim
IPC分类号： H01L23/544
CPC分类号： H01J37/3177 , B82Y10/00 , B82Y40/00 , H01J37/04 , H01J2237/0492 , H01J2237/1205 , H01J2237/1518
摘要： Provided is a wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate. The microcolumn array includes a LTCC substrate having wirings and wafer-scale beam deflector arrays, which are attached to at least one side of the LTCC substrate and has an array of deflection devices deflecting electron beams. The wafer-scale microcolumn array using the LTCC substrate makes it possible to significantly increase the throughput of semiconductor wafers, simplify its manufacturing process, and lower its production cost.

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