专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060284203A1 Side-emitting LED package and manufacturing method of the same 有权
标题翻译：侧面发光LED封装及其制造方法相同
公开(公告)号：US20060284203A1
公开(公告)日：2006-12-21
申请号：US11444397
申请日：2006-06-01
申请人： Kyung Han , Hun Hahm , Dae Kim , Ho Ahn , Seong Han , Young Park , Seon Lee
发明人： Kyung Han , Hun Hahm , Dae Kim , Ho Ahn , Seong Han , Young Park , Seon Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L24/97 , H01L25/0753 , H01L33/0095 , H01L33/486 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15787 , H01L2924/181 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。本发明提供一种用于从侧向发光的侧光发射LED封装件，其包括形成有电极的基板。封装还包括设置在基板上的光源，覆盖并保护其上具有光源的基板的模制部件和覆盖模制部件的外表面的反射层。具有反射层的模制部件在其一侧形成透光表面。本发明允许容易地制造所需形状的反射表面，而不管LED芯片尺寸如何，小型化，LED阵列中的批量生产，显着提高生产率。

2. 发明申请

US20060273338A1 High power LED package and fabrication method thereof 有权
公开(公告)号：US20060273338A1
公开(公告)日：2006-12-07
申请号：US11445227
申请日：2006-06-02
申请人： Seon Lee , Hun Hahm , Jung Park , Kyung Han , Seong Han , Dae Kim , Young Park
发明人： Seon Lee , Hun Hahm , Jung Park , Kyung Han , Seong Han , Dae Kim , Young Park
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

3. 发明申请

US20060273337A1 Side-emitting LED package and method of manufacturing the same 审中-公开
标题翻译：侧面发光LED封装及其制造方法
公开(公告)号：US20060273337A1
公开(公告)日：2006-12-07
申请号：US11444402
申请日：2006-06-01
申请人： Kyung Han , Myoung Choi , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
发明人： Kyung Han , Myoung Choi , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射模制部件形成透光表面。封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

4. 发明申请

US20070029572A1 LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the method 审中-公开
标题翻译：具有改善的焊接结构的LED，将LED焊接到PCB的方法以及通过该方法制造的LED组件
公开(公告)号：US20070029572A1
公开(公告)日：2007-02-08
申请号：US11497233
申请日：2006-08-02
申请人： Kyung Han , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
发明人： Kyung Han , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48091 , H05K3/3426 , H05K3/3494 , H05K2201/10106 , H05K2201/10651 , H05K2201/1084 , H05K2203/0195 , Y02P70/613 , H01L2924/00012 , H01L2924/00014
摘要： The invention relates to an LED with an improved soldering structure, a method of assembling the LED to a PCB, and an LED assembly manufactured by the method. The LED includes an LED chip and a pair of leads with an end electrically connected the LED chip and the other end to be connected to an external power source, having a hole or a cutout part formed therein. The LED also includes a package body housing a part of the lead in the side of the LED chip, and a transparent lens placed on a surface of the package body in the side of the LED chip, for emitting light laterally. This improves soldering conditions for soldering with the other end of the lead placed on the solder, saving the amount of a solder paste while enhancing bonding strength after soldering.
摘要翻译：本发明涉及具有改进的焊接结构的LED，将LED组装到PCB的方法以及通过该方法制造的LED组件。 LED包括LED芯片和一对引线，端部电连接LED芯片，另一端连接到外部电源，其中形成有孔或切口部分。 LED还包括容纳LED芯片侧的引线的一部分的封装体，以及位于LED芯片侧的封装体的表面上的透明透镜，用于横向发光。这样可以提高钎焊焊接条件，同时提高焊接后的焊接强度。

5. 发明申请

US20070019416A1 Light emitting diode package having dual lens structure for lateral light emission 有权
标题翻译：具有用于横向发光的双透镜结构的发光二极管封装
公开(公告)号：US20070019416A1
公开(公告)日：2007-01-25
申请号：US11488067
申请日：2006-07-18
申请人： Kyung Han , Myoung Choi , Seon Lee , Seong Han , Hun Hahm , Chang Song
发明人： Kyung Han , Myoung Choi , Seon Lee , Seong Han , Hun Hahm , Chang Song
IPC分类号： F21V7/00
CPC分类号： H01L33/58 , G02B19/0028 , G02B19/0061 , G02B19/0071 , H01L33/60 , H01L33/62 , H01L33/644 , H01L33/647 , H01L2224/48247 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.
摘要翻译：具有用于光的横向发射的双重结构的LED封装包括LED芯片，下部结构，下部透镜和上部透镜。下部结构包括一对电连接部分，封装主体和填充在封装体的凹部中的透明密封剂，以密封LED芯片。上半球下透镜固定到下结构的上部，其下部附接到透明密封剂的上表面。漏斗状上透镜固定在下透镜的上端，并且包括用于横向反射来自下透镜的光的轴对称反射表面和用于横向发射从反射表面反射的光的发射表面。上透镜和下透镜分别模制并组合在一起以容易地制造和有效地安装LED封装。

6. 发明申请

US20060267036A1 High power light emitting diode package and fabrication method thereof 失效
标题翻译：大功率发光二极管封装及其制造方法
公开(公告)号：US20060267036A1
公开(公告)日：2006-11-30
申请号：US11442414
申请日：2006-05-30
申请人： Seon Lee , Hun Hahm , Dae Kim , Young Song , Young Park , Chang Song
发明人： Seon Lee , Hun Hahm , Dae Kim , Young Song , Young Park , Chang Song
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48247 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.
摘要翻译：本发明涉及一种大功率LED封装及其制造方法。 LED封装包括响应于施加的功率而产生光的发光部，安装有发光部的导热部件，用于电连接发光部和板的引线部，以及用于一体地固定的模具部导热部件和引线部分。导热构件由高度方向上的至少两个金属层构成，引线部包括从导热构件延伸的至少一个第一引线和与导热构件分离的至少一个第二引线。本发明允许将两个组件集成到一个组件中，减少组件的数量并简化组装过程，从而降低制造成本。

7. 发明申请

US20070176198A1 Chip on board package and manufacturing method thereof 有权
标题翻译：船上芯片封装及其制造方法
公开(公告)号：US20070176198A1
公开(公告)日：2007-08-02
申请号：US11709154
申请日：2007-02-22
申请人： Seon Lee , Hun Hahm , Dae Kim
发明人： Seon Lee , Hun Hahm , Dae Kim
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , F21K9/00 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H05K1/021 , H05K3/244 , H05K2201/09827 , H05K2201/09981 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.
摘要翻译：通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。这又提高了光源的发光效率，最终实现了高质量的光源。

8. 发明申请

US20060034097A1 Light emitting diode lens and backlight apparatus having the same 有权
标题翻译：发光二极管透镜和具有相同的背光装置
公开(公告)号：US20060034097A1
公开(公告)日：2006-02-16
申请号：US10953816
申请日：2004-09-30
申请人： Hun Hahm , Jung Park , Young Jeong , Young Park , Hyung Kim , Ho Ahn
发明人： Hun Hahm , Jung Park , Young Jeong , Young Park , Hyung Kim , Ho Ahn
IPC分类号： F21V7/04
CPC分类号： H01L33/58 , H01L33/54 , H01L33/60
摘要： The present invention relates to an LED lens, in which a planar bottom has a pair of halves symmetrically connected with each other about a reference line and narrowed in the vicinity of the reference line. A pair of substantially semicircular reflecting surfaces are extended from both edges of the bottom connected with both ends of the reference line. A radiating surface is connected with remaining edges of the bottom and semicircular edges of the reflecting surfaces. The reflecting surfaces reflect light beams are introduced from the LED chip through the bottom toward the radiating surface. The radiating surface radiates the light beams to the outside when the light beams are introduced to the radiating surface through reflection from the reflecting surfaces and directly through the bottom, so that the light beams are radiated to the outside in a predetermined beam angle.
摘要翻译：本发明涉及一种LED透镜，其中平面底部具有围绕参考线彼此对称连接并在基准线附近变窄的一对半部。一对基本上半圆形的反射表面从与参考线的两端连接的底部的两个边缘延伸。辐射表面与反射表面的底部和半圆形边缘的剩余边缘连接。反射面反射光束从LED芯片通过底部朝向辐射表面引入。当光束通过反射表面反射而直接通过底部将光束引入辐射表面时，辐射表面将光束照射到外部，使得光束以预定的光束角度辐射到外部。

9. 发明申请

US20060169999A1 LED package frame and LED package having the same 有权
标题翻译： LED封装框架和LED封装相同
公开(公告)号：US20060169999A1
公开(公告)日：2006-08-03
申请号：US11319101
申请日：2005-12-28
申请人： Young Park , Seung Lee , Hun Hahm , Hyung Kim , Bum Kim , Young Jeong , Ho Ahn , Jung Park
发明人： Young Park , Seung Lee , Hun Hahm , Hyung Kim , Bum Kim , Young Jeong , Ho Ahn , Jung Park
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： The invention relates to an LED package frame and an LED package incorporating the same. The LED package frame comprises an LED chip; and a heat conductive member made of a lump of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member to separate the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability. Also, it is possible to provide an LED package frame and a high power LED package by fixing the lead fixed to the heat conductive member without a jig.
摘要翻译：本发明涉及一种LED封装框架和一个包含该LED封装框架的LED封装件。 LED封装框架包括LED芯片; 以及由高导热性材料块制成的导热构件。导热构件在侧部具有接收部，并且安装有LED芯片。引线一端插入导热部件的接收部分，并与LED芯片电连接。电绝缘层被放置在引导件和导热构件的接收部分之间的紧密接触中以将引线与接收部分分离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。此外，通过将固定在导热构件上的引线固定而不用夹具，可以提供LED封装框架和大功率LED封装。

10. 发明申请

US20060157657A1 Led array circuit 审中-公开
标题翻译： LED阵列电路
公开(公告)号：US20060157657A1
公开(公告)日：2006-07-20
申请号：US11304821
申请日：2005-12-16
申请人： Young Jeong , Hun Hahm , Hyung Kim , Jung Park , Young Park , Ho Ahn , Bum Kim
发明人： Young Jeong , Hun Hahm , Hyung Kim , Jung Park , Young Park , Ho Ahn , Bum Kim
IPC分类号： G02B27/00
CPC分类号： H05B33/0821 , G02F1/133603 , Y02B20/341
摘要： Provided is an LED array circuit that has reduced power consumption and can protect an LED from a reverse voltage. The LED array circuit includes an LED pair, and an AC power source for supplying an AC voltage to the LED pair. The LED pair includes a first LED and a second LED that are connected in parallel to each other with biasing polarity connected in reverse.
摘要翻译：提供了一种LED阵列电路，其具有降低的功率消耗并且可以保护LED免受反向电压的影响。 LED阵列电路包括LED对，以及用于向LED对提供AC电压的AC电源。 LED对包括彼此并联连接的偏置极性相反的第一LED和第二LED。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式