专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060151716A1 Micro-column electron beam apparatus 失效
标题翻译：微柱电子束装置
公开(公告)号：US20060151716A1
公开(公告)日：2006-07-13
申请号：US11257244
申请日：2005-10-24
申请人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
发明人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
IPC分类号： G21G5/00
CPC分类号： H01J37/067 , B82Y10/00 , B82Y40/00 , H01J37/3177 , H01J2237/1205 , H01J2237/1502 , H01J2237/2818
摘要： Provided is a micro-column electron beam apparatus including: a base; an electron lens bracket on which an electron lens modulate can be fixed, mounted in a central portion of the base; an electron beam source tip module vertically disposed on the electron lens module; a pan spring plate stage module that is mounted over the base, supports the electron beam source tip module at a central portion thereof, and includes a three-coupling pan spring plate portion including first through third spring units that are coupled to the electron beam source tip module in three directions on a plane perpendicular to the vertical axis, which vertically passes the center of the electron beam source tip module, to elastically support the electron beam source tip module in three directions; a first piezoelectric actuator coupled to the pan spring plate stage module to move the electron beam source tip module along a first axis perpendicular to the vertical axis; and a second piezoelectric actuator coupled to the pan spring plate stage module to move the electron beam source tip module along a second axis perpendicular to the vertical axis and the first axis.
摘要翻译：本发明提供一种微柱电子束装置，包括：基底; 可以固定电子透镜调制的电子透镜支架，安装在基座的中心部分; 垂直设置在电子透镜模块上的电子束源头模块; 安装在基座上方的平板弹簧板台模块在其中心部分处支撑电子束源头模块，并且包括三联盘盘弹簧板部分，其包括耦合到电子束源的第一至第三弹簧单元尖端模块在垂直于垂直轴线的平面上垂直通过电子束源头模块的中心，在三个方向弹性支撑电子束源头模块; 第一压电致动器，其联接到所述盘簧板模块以沿着垂直于所述垂直轴线的第一轴线移动所述电子束源尖端模块; 以及耦合到盘簧级模块的第二压电致动器，用于沿垂直于垂直轴线和第一轴线的第二轴线移动电子束源尖端模块。

2. 发明申请

US20060131996A1 Micro stage using piezoelectric element 有权
标题翻译：微电极采用压电元件
公开(公告)号：US20060131996A1
公开(公告)日：2006-06-22
申请号：US11231471
申请日：2005-09-20
申请人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
发明人： Sang Choi , Dae Kim , Jin Jeong , Dae Kim
IPC分类号： H02N2/00
CPC分类号： H02N2/028 , H01J2237/20264
摘要： Provided is a micro stage comprising: a body having a vertically perforated through-hole passing through a central portion thereof; a bobbin including a tip portion with an electron emission tip embedded in the center thereof, and passing through the through-hole of the body to be moved in the through-hole along a first axis perpendicular to a vertical direction; a first piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in one direction along the first axis; a second piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in the other direction along the first axis; and an upper cover that is coupled to an upper portion of the body and has a through-hole, through which the bobbin passes and communicates with the through-hole of the body, wherein the bobbin can be positioned as desired along the first axis by adjusting the voltages applied to the first piezoelectric element and the second piezoelectric element. Accordingly, the emission tip can be exactly and stably positioned using only the movable piezoelectric elements.
摘要翻译：提供了一种微型台，包括：主体，其具有穿过其中心部分的垂直穿孔的通孔; 线轴，其包括具有嵌入其中心的电子发射尖端的尖端部分，并沿着垂直于垂直方向的第一轴线穿过所述通孔的待通孔; 第一压电元件，其设置在所述主体上，并且当施加电压时被延长以沿着所述第一轴线沿一个方向推动所述线轴; 第二压电元件，其设置在所述主体上并且当施加电压时被延长以沿着所述第一轴线沿另一方向推动所述线轴; 以及上盖，其联接到所述主体的上部并且具有通孔，所述筒管通过所述通孔，所述通孔与所述主体的所述通孔连通，其中所述线轴可根据需要沿着所述第一轴由调整施加到第一压电元件和第二压电元件的电压。因此，可以仅使用可动压电元件来精确且稳定地定位发射尖端。

3. 发明申请

US20060131698A1 Wafer-scale microcolumn array using low temperature co-fired ceramic substrate 失效
公开(公告)号：US20060131698A1
公开(公告)日：2006-06-22
申请号：US11259959
申请日：2005-10-24
申请人： Jin Jeong , Dae Kim , Sang Choi , Dae Kim , Ho Kim
发明人： Jin Jeong , Dae Kim , Sang Choi , Dae Kim , Ho Kim
IPC分类号： H01L23/544
CPC分类号： H01J37/3177 , B82Y10/00 , B82Y40/00 , H01J37/04 , H01J2237/0492 , H01J2237/1205 , H01J2237/1518
摘要： Provided is a wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate. The microcolumn array includes a LTCC substrate having wirings and wafer-scale beam deflector arrays, which are attached to at least one side of the LTCC substrate and has an array of deflection devices deflecting electron beams. The wafer-scale microcolumn array using the LTCC substrate makes it possible to significantly increase the throughput of semiconductor wafers, simplify its manufacturing process, and lower its production cost.

4. 发明申请

US20060131752A1 Micro column electron beam apparatus formed in low temperature co-fired ceramic substrate 失效
标题翻译：微柱电子束装置形成于低温共烧陶瓷基片中
公开(公告)号：US20060131752A1
公开(公告)日：2006-06-22
申请号：US11260025
申请日：2005-10-24
申请人： Dae Kim , Jin Jeong , Sang Choi , Dae Kim , Ho Kim
发明人： Dae Kim , Jin Jeong , Sang Choi , Dae Kim , Ho Kim
IPC分类号： H01L23/52
CPC分类号： H01J37/3177 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J2237/03 , H01J2237/1205
摘要： A micro column electron beam apparatus having a reduced number of interconnections is provided. The micro column electron beam apparatus includes: a low temperature co-fired ceramic (LTCC) substrate; a plurality of deflector electrodes attached to a predetermined top portion of the LTCC substrate; a pad electrode placed at a top edge of the LTCC substrate and transmitting an external signal to the deflector electrodes; and a connection unit placed in the LTCC substrate and electrically connecting the deflector electrode and the pad electrode.
摘要翻译：提供了具有减少数量的互连的微型列电子束装置。微柱电子束装置包括：低温共烧陶瓷（LTCC）基板; 多个偏转器电极，附着到LTCC衬底的预定顶部; 放置在LTCC衬底的顶部边缘处并将外部信号传输到偏转器电极的焊盘电极; 以及连接单元，其放置在LTCC基板中并电连接偏转器电极和焊盘电极。

5. 发明申请

US20050266322A1 Electron beam lens for micro-column electron beam apparatus and method of fabricating the same 有权
公开(公告)号：US20050266322A1
公开(公告)日：2005-12-01
申请号：US11174891
申请日：2005-07-01
申请人： Sang Choi , Dae Kim
发明人： Sang Choi , Dae Kim
IPC分类号： G02B3/00 , H01J1/02 , H01J3/18 , H01J9/02 , H01J9/14 , H01J37/12
CPC分类号： H01J9/02 , H01J3/18 , H01J9/14 , H01J37/12 , H01J2237/1205 , H01J2237/3175 , H01J2237/31754 , Y10T29/49117
摘要： Provided is an electron beam lens for a micro-column electron beam apparatus and a method of manufacturing the same. A photosensitive glass substrate is used as a base isolation substrate and a thin metal film is grown by a plating method. Holes through which electron beam passes are formed by a lift off method after forming a resist pattern shaped as a hole on a seed metal layer and plating the thin metal film.

6. 发明申请

US20050263712A1 Electron beam lens for micro-column electron beam apparatus and method of fabricating the same 有权
标题翻译：用于微柱电子束装置的电子束透镜及其制造方法
公开(公告)号：US20050263712A1
公开(公告)日：2005-12-01
申请号：US11174916
申请日：2005-07-01
申请人： Sang Choi , Dae Kim
发明人： Sang Choi , Dae Kim
IPC分类号： G02B3/00 , H01J1/02 , H01J3/18 , H01J9/02 , H01J9/14 , H01J37/12 , H01J3/26
CPC分类号： H01J9/02 , H01J3/18 , H01J9/14 , H01J37/12 , H01J2237/1205 , H01J2237/3175 , H01J2237/31754 , Y10T29/49117
摘要： Provided is an electron beam lens for a micro-column electron beam apparatus and a method of manufacturing the same. A photosensitive glass substrate is used as a base isolation substrate and a thin metal film is grown by a plating method. Holes through which electron beam passes are formed by a lift off method after forming a resist pattern shaped as a hole on a seed metal layer and plating the thin metal film.
摘要翻译：本发明提供一种用于微柱电子束装置的电子束透镜及其制造方法。使用感光性玻璃基板作为基底隔离基板，通过电镀法生长金属薄膜。在种子金属层上形成形成为孔的抗蚀剂图案并镀覆薄金属膜之后，通过剥离法形成电子束通过的孔。

7. 发明申请

US20050087696A1 Electron beam lens for micro-column electron beam apparatus and method of fabricating the same 失效
公开(公告)号：US20050087696A1
公开(公告)日：2005-04-28
申请号：US10817779
申请日：2004-04-02
申请人： Sang Choi , Dae Kim
发明人： Sang Choi , Dae Kim
IPC分类号： G02B3/00 , H01J1/02 , H01J3/18 , H01J9/02 , H01J9/14 , H01J37/12 , H01J3/14 , G21K1/08
CPC分类号： H01J9/02 , H01J3/18 , H01J9/14 , H01J37/12 , H01J2237/1205 , H01J2237/3175 , H01J2237/31754 , Y10T29/49117
摘要： Provided is an electron beam lens for a micro-column electron beam apparatus and a method of manufacturing the same. A photosensitive glass substrate is used as a base isolation substrate and a thin metal film is grown by a plating method. Holes through which electron beam passes are formed by a lift off method after forming a resist pattern shaped as a hole on a seed metal layer and plating the thin metal film.

8. 发明申请

US20080058107A1 Tripod Type Constant Velocity Joint 有权
标题翻译：三脚架型恒速接头
公开(公告)号：US20080058107A1
公开(公告)日：2008-03-06
申请号：US11927601
申请日：2007-10-29
申请人： Jeong Hyun Cho , Dae Kim , In Lee , Joung Park , Sung An , Seung Shin , Hwan Kang
发明人： Jeong Hyun Cho , Dae Kim , In Lee , Joung Park , Sung An , Seung Shin , Hwan Kang
IPC分类号： F16D3/26
CPC分类号： F16D3/2055 , F16D2003/2026 , Y10S464/905
摘要： A tripod type constant velocity joint comprises a housing having three track grooves which are defined at trisected positions of the housing along a circumferential direction and extend in a radial direction; a spider having three polyhedral trunnions which are projectedly formed at trisected positions of the spider along the circumferential direction to be respectively inserted into the track grooves and each of which has at least two polygonal surfaces; inner rollers a circumferential inner surface of each of which has a curved contour for surrounding the polyhedral trunnion; a plurality of needle rollers assembled to a circumferential outer surface of each inner roller; and outer rollers each formed to be rotated through the needle rollers, to be moved in an axial direction of the inner roller, and to be moved in an axial direction of the track groove along a guide surface of the housing.
摘要翻译：三脚架式等速万向节包括具有三个轨道槽的壳体，其沿着圆周方向限定在壳体的三维位置处并沿径向方向延伸; 具有三个多面耳轴的蜘蛛，其沿着圆周方向突出地形成在所述蜘蛛的三分位置处，以分别插入到所述轨道槽中，并且每个具有至少两个多边形表面; 内滚子，其每个的周向内表面具有用于围绕多面耳轴的弯曲轮廓; 组装到每个内辊的周向外表面上的多个滚针; 以及外辊，每一个都形成为通过滚针旋转，沿着内辊的轴向移动，并且沿着壳体的引导表面在轨道槽的轴向方向上移动。

9. 发明申请

US20080026695A1 Method and system for transmitting voice data by using wireless LAN and bluetooth 审中-公开
标题翻译：使用无线局域网和蓝牙传输语音数据的方法和系统
公开(公告)号：US20080026695A1
公开(公告)日：2008-01-31
申请号：US11878938
申请日：2007-07-27
申请人： Hyo Choi , Jin Jeon , Dae Kim , Kyeongho Lee , Sang Shim , Won Song
发明人： Hyo Choi , Jin Jeon , Dae Kim , Kyeongho Lee , Sang Shim , Won Song
IPC分类号： H04B7/00 , H04Q7/20
CPC分类号： H04W16/14 , H04W88/06 , H04W88/10
摘要： Embodiments of methods and systems of the application can transmit data (e.g., voice) using a wireless LAN and a Bluetooth. One system embodiment can include a terminal device, an AP (access point) for communicating with the terminal device according to a first (e.g., wireless LAN) protocol by using a first frequency band among multiple frequency bands of a prescribed frequency band (e.g., ISM frequency band) and a headset for communicating with the terminal device according to a second (e.g., Bluetooth) protocol by using at least one frequency band of remaining frequency bands by excepting the first frequency band.
摘要翻译：应用的方法和系统的实施例可以使用无线LAN和蓝牙传输数据（例如，语音）。一个系统实施例可以包括终端设备，用于根据第一（例如无线LAN）协议与终端设备进行通信的AP（接入点），该协议通过使用规定频带的多个频带中的第一频带（例如， ISM频带）和耳机，用于通过除了第一频带之外使用剩余频带的至少一个频带，根据第二（例如，蓝牙）协议与终端设备进行通信。

10. 发明申请

US20070176198A1 Chip on board package and manufacturing method thereof 有权
标题翻译：船上芯片封装及其制造方法
公开(公告)号：US20070176198A1
公开(公告)日：2007-08-02
申请号：US11709154
申请日：2007-02-22
申请人： Seon Lee , Hun Hahm , Dae Kim
发明人： Seon Lee , Hun Hahm , Dae Kim
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , F21K9/00 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H05K1/021 , H05K3/244 , H05K2201/09827 , H05K2201/09981 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.
摘要翻译：通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。这又提高了光源的发光效率，最终实现了高质量的光源。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式