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    • 1. 发明授权
    • Ultraviolet treatment of metal oxide electrodes
    • 金属氧化物电极的紫外线处理
    • US09082700B2
    • 2015-07-14
    • US13296191
    • 2011-11-14
    • Sean Andrew VailDavid R. EvansWei PanJong-Jan Lee
    • Sean Andrew VailDavid R. EvansWei PanJong-Jan Lee
    • H01L21/44H01L21/268H01G9/20H01L21/02H01L29/786
    • H01L21/2686H01G9/2031H01G9/2059H01L21/02554H01L29/7869Y02E10/542
    • An ultraviolet treatment method is provided for a metal oxide electrode. A metal oxide electrode is exposed to an ultraviolet (UV) light source in a humid environment. The metal oxide electrode is then treated with a moiety having at least one anchor group, where the anchor group is a chemical group capable of promoting communication between the moiety and the metal oxide electrode. As a result, the moiety is bound to the metal oxide electrode. In one aspect the metal oxide electrode is treated with a photoactive moiety. Exposing the metal oxide electrode to the UV light source in the humid environment induces surface defects in the metal oxide electrode in the form of oxygen vacancies. In response to the humidity, atmospheric water competes favorably with oxygen for dissociative adsorption on the metal oxide electrode surface, and hydroxylation of the metal oxide electrode surface is induced.
    • 为金属氧化物电极提供紫外线处理方法。 金属氧化物电极在潮湿环境中暴露于紫外(UV)光源。 然后用具有至少一个锚定基团的部分处理金属氧化物电极,其中锚定基团是能够促进部分和金属氧化物电极之间的连通的化学基团。 结果,该部分与金属氧化物电极结合。 在一个方面,用光活性部分处理金属氧化物电极。 在潮湿环境中将金属氧化物电极暴露于UV光源以氧空位的形式引起金属氧化物电极中的表面缺陷。 响应于湿度,大气水与氧反应,在金属氧化物电极表面上进行离解吸附,诱导金属氧化物电极表面的羟基化。
    • 5. 发明申请
    • Solution-Processed Metal Selenide Semiconductor using Deposited Selenium Film
    • 使用沉积的硒膜的溶液加工的金属硒化物半导体
    • US20140134792A1
    • 2014-05-15
    • US13719052
    • 2012-12-18
    • Sean Andrew VailAlexey KoposovWei PanGary D. FoleyJong-Jan Lee
    • Sean Andrew VailAlexey KoposovWei PanGary D. FoleyJong-Jan Lee
    • H01L21/02
    • H01L21/02628H01L21/02491H01L21/02568H01L21/02614H01L31/0322Y02E10/541
    • Methods are provided for fabricating a solution-processed metal and mixed-metal selenide semiconductor using a selenium (Se) film layer. One aspect provides a conductive substrate and deposits a first Se film layer over the conductive substrate. A first solution, including a first material set of metal salts, metal complexes, or combinations thereof, is dissolved in a solvent and deposited on the first Se film layer. A first intermediate film comprising metal precursors is formed from corresponding members of the first material set. In one aspect, a plurality of intermediate films is formed using metal precursors from the first material set or a different material set. In another aspect, a second Se film layer is formed overlying the intermediate film(s). Thermal annealing is performed in an environment including hydrogen (H2), hydrogen selenide (H2Se), or Se/H2. The metal precursors are transformed in the intermediate film(s), and a metal selenide-containing semiconductor is formed.
    • 提供了使用硒(Se)膜层制造溶液处理金属和混合金属硒化物半导体的方法。 一个方面提供一种导电衬底并且在导电衬底上沉积第一Se膜层。 包括金属盐,金属络合物或其组合的第一材料组合的第一溶液溶解在溶剂中并沉积在第一Se膜层上。 包含金属前体的第一中间膜由第一材料组的相应构件形成。 在一个方面,使用来自第一材料组或不同材料组的金属前体形成多个中间膜。 在另一方面,形成覆盖中间膜的第二Se膜层。 在包括氢(H 2),硒化氢(H 2 Se)或Se / H 2的环境中进行热退火。 金属前体在中间膜中转变,形成含金属硒化物的半导体。
    • 6. 发明申请
    • Solid-State Dye-Sensitized Solar Cell Using Oxidative Dopant
    • 使用氧化掺杂剂的固态染料敏化太阳能电池
    • US20140116509A1
    • 2014-05-01
    • US13664256
    • 2012-10-30
    • Sean Andrew VailAlexey KoposovWei PanGary D. FoleyJong-Jan Lee
    • Sean Andrew VailAlexey KoposovWei PanGary D. FoleyJong-Jan Lee
    • H01L51/00H01B1/12
    • H01L51/4226H01L51/002H01L51/0058Y02E10/549
    • A solid-state hole transport composite material (ssHTM) is provided. The ssHTM is made from a neutral charge first p-type organic semiconductor, and a chemically oxidized first p-type semiconductor, where the dopants are silver(I) containing materials. A reduced form of the silver(I) containing material is also retained as functional component in the ssHTM. In one aspect, the silver(I) containing material is silver bis(trifluoromethanesulfonyl)imide (TFSI). In another aspect, the first p-type organic semiconductor is 2,2′,7,7′-tetrakis(N,N-di-p-methoxyphenylamine)-9,9′-spirobifluorene (Spiro-OMeTAD). In one variation, the ssHTM additionally includes a first p-type organic semiconductor doped with an ionic dopant such as lithium (Li+), sodium (Na+), potassium (K+), or combinations of the above-mentioned materials. Also provided are a method for synthesizing the above-described ssHTM, and a solid-state dye solar cell (ssDSC) fabricated from the ssHTM.
    • 提供固态空穴传输复合材料(ssHTM)。 ssHTM由中性电荷第一p型有机半导体和化学氧化的第一p型半导体制成,其中掺杂剂是含银(I)的材料。 含有银(I)的材料的还原形式也作为ssHTM中的功能组分保留。 一方面,含有银(I)的材料是双(三氟甲磺酰)酰亚胺(TFSI)。 另一方面,第一p型有机半导体是2,2',7,7'-四(N,N-二 - 对甲氧基苯胺)-9,9'-螺二芴(Spiro-OMeTAD)。 在一个实施方案中,ssHTM还包括掺杂有离子掺杂剂如锂(Li +),钠(Na +),钾(K +)或上述材料的组合的第一p型有机半导体。 还提供了合成上述ssHTM的方法和由ssHTM制造的固态染料太阳能电池(ssDSC)。
    • 10. 发明授权
    • MOCVD of tungsten nitride thin films using W(CO)6 and NH3 for copper barrier applications
    • 使用W(CO)6和NH3作为铜屏障应用的氮化钨薄膜的MOCVD
    • US07094691B2
    • 2006-08-22
    • US10410029
    • 2003-04-09
    • Wei PanRobert BarrowcliffDavid R. EvansSheng Teng Hsu
    • Wei PanRobert BarrowcliffDavid R. EvansSheng Teng Hsu
    • H01L21/44
    • H01L21/76841C23C16/34
    • A method of forming a tungsten nitride thin film in an integrated circuit includes preparing a silicon substrate on a silicon wafer and placing the silicon wafer in a heatable chuck in a CVD vacuum chamber; placing a known quantity of a tungsten source in a variable-temperature bubbler to provide a gaseous tungsten source; setting the variable-temperature bubbler to a predetermined temperature; passing a carrier gas through the variable-temperature bubbler and carrying the gaseous tungsten source with the carrier gas into the CVD vacuum chamber; introducing a nitrogen-containing reactant gas into the CVD vacuum chamber; reacting the gaseous tungsten source and the nitrogen-containing reactant gas above the surface of the silicon wafer in a deposition process to deposit a WxNy thin film on the surface of the silicon wafer; and completing the integrated circuit containing the WxNy thin film.
    • 在集成电路中形成氮化钨薄膜的方法包括在硅晶片上制备硅衬底,并将硅晶片放置在CVD真空室中的可加热卡盘中; 将已知量的钨源放置在可变温度起泡器中以提供气态钨源; 将可变温度起泡器设定到预定温度; 使载气通过可变温度起泡器并将载气的气态钨源运送到CVD真空室中; 将含氮反应气体引入CVD真空室中; 在沉积过程中使气态钨源和硅晶片表面上方的含氮反应物气体反应,以沉积W 1 / N 2 N 2 O 3 硅晶片; 并完成包含W< N> N> Y<<<<薄膜的集成电路。