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    • 1. 发明授权
    • Process of producing semiconductor layer structure
    • 制造半导体层结构的工艺
    • US06528337B1
    • 2003-03-04
    • US09544982
    • 2000-04-07
    • Satoshi ArakawaToshikazu MukaiharaNobumitsu YamanakaAkihiko Kasukawa
    • Satoshi ArakawaToshikazu MukaiharaNobumitsu YamanakaAkihiko Kasukawa
    • H01L2100
    • B82Y20/00H01L33/06H01S5/2275H01S5/34306H01S5/3434H01S5/4043H01S5/4087
    • Disclosed is a process of producing a semiconductor layer structure which emits lights with a plurality of luminescence wavelengths from the same quantum well structure. The layer structure has a layer structure which has the quantum well structure located between a lower light-confinement layer and an upper light-confinement layer. At least a part of the quantum well structure is an area which has a shorter luminescence wavelength than those of the other portions. This area is produced by stacking a lower cladding layer, the lower light-confinement layer, the quantum well structure, the upper light-confinement layer and a first semiconductor layer having a first conductivity type on a semiconductor substrate by epitaxial growth and further stacking a second semiconductor layer having the opposite conductivity type to that of the first semiconductor layer on the entire surface or a partial surface of the first semiconductor layer. This second semiconductor layer may be removed after the formation.
    • 公开了一种从相同的量子阱结构产生发射具有多个发光波长的光的半导体层结构的方法。 层结构具有层结构,其具有位于下限光层和上光限制层之间的量子阱结构。 量子阱结构的至少一部分是具有比其它部分更短的发光波长的区域。 该区域是通过外延生长在半导体衬底上堆叠下包层,下光限制层,量子阱结构,上光限制层和具有第一导电类型的第一半导体层,并进一步堆叠 第二半导体层与第一半导体层的整个表面或第一半导体层的部分表面具有相反的导电类型。 该第二半导体层可以在形成之后被去除。
    • 2. 发明授权
    • Semiconductor light-emitting diode
    • 半导体发光二极管
    • US06278139B1
    • 2001-08-21
    • US09402757
    • 2000-06-09
    • Takuya IshikawaSatoshi ArakawaToshikazu MukaiharaAkihiko Kasukawa
    • Takuya IshikawaSatoshi ArakawaToshikazu MukaiharaAkihiko Kasukawa
    • H01L3300
    • H01L33/44H01L33/14H01L33/30H01L33/305H01L33/36H01L33/38
    • A semiconductor light emitting diode (10) is formed on an n-type GaAs substrate and includes: an AlGaInP based double heterojunction structure in which an active layer (16) is sandwiched between cladding layers (14, 18); an upper P-type contact layer 20; and a ring-shaped upper electrode (22) having an opening (28), wherein light is emitted through the upper p-type contact layer (20) and the opening (28) of the upper electrode (22). The upper p-type contact layer (20) is a semiconductor layer made of AlGaAs or AlGaAsP having an Al content of 0.5 or more, and doped with impurities at a carrier concentration of 5×1018 cm−3 or more. The semiconductor light emitting diode emits light in a desired emission pattern and at higher intensities, and is capable of being fabricated by relatively simple processes.
    • 半导体发光二极管(10)形成在n型GaAs衬底上,包括:AlGaInP基双异质结结构,其中有源层(16)夹在包层(14,18)之间; 上P型接触层20; 以及具有开口(28)的环形上电极(22),其中通过上电极(22)的上p型接触层(20)和开口(28)发射光。 上部p型接触层(20)是Al含量为0.5以上的AlGaAs或AlGaAsP的半导体层,掺杂了载流子浓度为5×10 18 cm -3以上的杂质。 半导体发光二极管以期望的发射模式和较高的强度发光,并能够通过相对简单的工艺制造。
    • 9. 发明授权
    • Semiconductor laser
    • 半导体激光器
    • US06738405B1
    • 2004-05-18
    • US09889596
    • 2001-07-16
    • Takeharu YamaguchiToshikazu MukaiharaAkihiko Kasukawa
    • Takeharu YamaguchiToshikazu MukaiharaAkihiko Kasukawa
    • H01S500
    • H01S5/22B82Y20/00H01S5/0211H01S5/0212H01S5/0421H01S5/0425H01S5/2022H01S5/2216H01S5/34313
    • A semiconductor laser device (30) includes a layered structure formed on an n-type GaAs substrate (32) having a bandgap energy Eg1 and including an n-type AlGaAs cladding layer (34), an active layer (36) including a quantum-well structure of two layers InGaAs/GaAs having a bandgap energy Eg2 which is smaller than Eg1, a p-type AlGaAs cladding layer (38), and a p-type GaAs cap layer (40), which are consecutively epitaxially grown. The cap layer and the upper portion of the p-type cladding layer are formed as a stripe-shaped mesa structure. An SiN passivation film (42) is formed on the areas except for the top of the cap layer. On the exposed cap layer and the passivation layer a p-side electrode (44) is formed. On the bottom surface of the substrate an n-side electrode (46) including layered metal films of In/AuGe/Ni/Au is formed. An absorption medium layer is interposed between the GaAs substrate and the n-side electrode.
    • 半导体激光装置(30)包括形成在具有带隙能量Eg1并且包括n型AlGaAs包层(34)的n型GaAs衬底(32)上的分层结构,包括量子阱的有源层(36) 具有小于Eg1的带隙能量Eg2,p型AlGaAs覆层(38)和p型GaAs覆盖层(40)的两层InGaAs / GaAs的阱结构,其被连续地外延生长。 覆盖层和p型覆层的上部形成为条状台面结构。 在除了盖层的顶部之外的区域上形成SiN钝化膜(42)。 在露出的盖层和钝化层上形成p侧电极(44)。 在基板的底面形成有包含In / AuGe / Ni / Au的层叠金属膜的n侧电极(46)。 吸收介质层介于GaAs衬底和n侧电极之间。