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    • 2. 发明申请
    • NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 氮化物半导体发光器件及其制造方法
    • US20090159922A1
    • 2009-06-25
    • US12209644
    • 2008-09-12
    • Hyun Soo KIMJoon Seop KwakKi Man KangJin Hyun LeeYu Seung KimCheol Soo Sone
    • Hyun Soo KIMJoon Seop KwakKi Man KangJin Hyun LeeYu Seung KimCheol Soo Sone
    • H01L33/00H01L21/20
    • H01L33/641H01L33/14H01L33/32
    • There is provided a nitride semiconductor light emitting device including: a light emitting structure having n-type and p-type nitride semiconductor layers and an active layer formed therebetween; n-type and p-type electrodes electrically connected to the n-type and p-type nitride semiconductors, respectively; and an n-type ohmic contact layer formed between the n-type nitride semiconductor layer and the n-type electrode and having a first layer formed of a material containing In and a second layer formed on the first layer and formed of a material containing W.According to an aspect of the invention, there is provided a nitride semiconductor light emitting device that has an n-type electrode having thermal stability and excellent electrical characteristics without heat treatment.According to another aspect of the invention, there is provided a method of manufacturing a nitride semiconductor light emitting device optimized to obtain the excellent thermal and electrical characteristics.
    • 提供一种氮化物半导体发光器件,包括:具有n型和p型氮化物半导体层的发光结构和在其间形成的有源层; 分别与n型和p型氮化物半导体电连接的n型和p型电极; 以及形成在n型氮化物半导体层和n型电极之间的n型欧姆接触层,并且具有由含有In的材料形成的第一层和形成在第一层上的由包含W的材料形成的第二层 根据本发明的一个方面,提供一种氮化物半导体发光器件,其具有不具有热稳定性的热稳定性和优异的电特性的n型电极。 根据本发明的另一方面,提供了一种制造优化以获得优异的热和电特性的氮化物半导体发光器件的方法。
    • 6. 发明授权
    • Light emitting device and method of manufacturing the same
    • 发光元件及其制造方法
    • US08963175B2
    • 2015-02-24
    • US12266300
    • 2008-11-06
    • Grigory OnushkinJin Hyun LeeMyong Soo ChoPun Jae Choi
    • Grigory OnushkinJin Hyun LeeMyong Soo ChoPun Jae Choi
    • H01L33/36H01L27/15H01L33/38H01L33/08H01L33/20
    • H01L27/156H01L33/08H01L33/20H01L33/385
    • Provided are a light emitting device and a method of manufacturing the same. The light emitting device includes each of first and second semiconductor stacked structures including first and second conductive type semiconductor layers and an active layer, first and second contacts on tops and bottoms of the first and second semiconductor stacked structures to be connected to the first and second conductive type semiconductor layers, a substrate structure including first and second sides, a first insulation layer on an area where no second contact is formed among a surface of the first and second semiconductor stacked layers, first and second conductive layers connected to the second contacts of the first and second semiconductor stacked structures, first and second wiring layers on the first side of the substrate structure, and first and second external connection terminals connected to the first and second contacts of the first semiconductor stacked structure.
    • 提供一种发光器件及其制造方法。 发光器件包括第一和第二半导体层叠结构中的每一个,包括第一和第二导电类型半导体层和有源层,第一和第二半导体堆叠结构的顶部和底部上的第一和第二触点将被连接到第一和第二 导电型半导体层,包括第一和第二侧的衬底结构,在第一和第二半导体层叠层的表面之间不形成第二接触的区域上的第一绝缘层,与第二和第二侧连接的第一和第二导电层 第一和第二半导体层叠结构,在基板结构的第一侧上的第一和第二布线层,以及连接到第一半导体堆叠结构的第一和第二触点的第一和第二外部连接端子。